公开(公告)号：US20240164008A1

公开(公告)日：2024-05-16

申请号：US18506151

申请日：2023-11-10

Applicant: Industrial Technology Research Institute

Inventor： Li-Wei Yao ,  Hsiao-Fen Wei ,  Chung-Wei Wang ,  Shu-Wei Kuo

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/367 ,  H01L25/075 ,  H01L33/52 ,  H01L33/64 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H01L23/367 ,  H01L24/05 ,  H01L24/16 ,  H01L25/0753 ,  H01L33/52 ,  H01L33/642 ,  H01L33/644 ,  H05K1/181 ,  H01L33/62 ,  H01L2224/05553 ,  H01L2224/16054 ,  H01L2224/16227

Abstract: A molded electronic assembly including a circuit substrate, a plurality of electronic devices, and at least one patterned heat dissipation structure is provided. The circuit substrate includes a substrate and a circuit, where the substrate has a top surface, and the circuit has a plurality of signal contacts distributed on the top surface. The electronic devices are disposed on the circuit substrate, and each of the electronic devices has a plurality of device pins connected to the signal contacts. The at least one patterned heat dissipation structure corresponds to a signal contact of the signal contacts and starts from the corresponding signal contact and extends toward a plurality of directions on the top surface of the substrate.

公开(公告)号：US11329500B2

公开(公告)日：2022-05-10

申请号：US16747541

申请日：2020-01-21

Applicant: Industrial Technology Research Institute

Inventor： Shu-Wei Kuo ,  Chang-Chung Yang

IPC: H02J7/00 ,  H02J7/35 ,  H02J3/38 ,  H02J3/32

Abstract: A charging-and-discharging device and a charging-and-discharging method are provided. The charging-and-discharging device includes a renewable energy converter, an aluminum battery, a controller and a current converter. The renewable energy converter receives a power from a renewable energy power generation system. The controller is coupled to the renewable energy converter and the aluminum battery, wherein the controller configures a charging-and-discharging power of the aluminum battery, according to a power value of the power, to compensate the power so as to generate a compensated power. The current converter is coupled to the controller, wherein the current converter outputs the compensated power to a power grid after performing DC/AC converting.

公开(公告)号：US10522438B2

公开(公告)日：2019-12-31

申请号：US15597124

申请日：2017-05-16

Applicant: Industrial Technology Research Institute

Inventor： Chun-Yi Cheng ,  Wei-Yuan Cheng ,  Shu-Wei Kuo ,  Yu-Jhen Yang

IPC: H01L23/31 ,  H01L21/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/00

Abstract: A package structure includes a redistribution layer, a chip, an encapsulant, a plurality of under ball release layers, and a plurality of solder balls. The redistribution layer includes a first surface, a second surface opposite to the first surface, and a patterned circuit layer, wherein the patterned circuit layer includes a plurality of pads protruding from the first surface. The chip is disposed on the second surface and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface and encapsulates the chip. The under ball release layers cover the pads respectively. The solder balls are disposed on the under ball release layers and electrically connected to the pads.

公开(公告)号：US09046681B2

公开(公告)日：2015-06-02

申请号：US14033980

申请日：2013-09-23

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shu-Wei Kuo ,  Yi-Chun Liu ,  Wei-Yuan Cheng

IPC: G02B26/00

CPC classification number: G02B26/005

Abstract: The disclosure provides an electro-wetting element, including: a first substrate and a second substrate, wherein the first substrate and the second substrate are disposed oppositely; a first electrode formed on the first substrate; a photoreactive layer formed on the first electrode, wherein the photoreactive layer includes a reversible photoreactive material; a second electrode formed on the first substrate or the second substrate; and a polar fluid and a non-polar fluid disposed between the first substrate and the second substrate.

Abstract translation: 本发明提供一种电润湿元件，包括：第一基板和第二基板，其中第一基板和第二基板相对设置; 形成在所述第一基板上的第一电极; 形成在所述第一电极上的光反应层，其中所述光反应层包括可逆光反应性材料; 形成在所述第一基板或所述第二基板上的第二电极; 以及设置在第一基板和第二基板之间的极性流体和非极性流体。

公开(公告)号：US20220130744A1

公开(公告)日：2022-04-28

申请号：US17159012

申请日：2021-01-26

Applicant: Industrial Technology Research Institute

Inventor： Shu-Wei Kuo ,  Chen-Tsai Yang ,  Wei-Yuan Cheng ,  Chien-Hsun Chu ,  Shau-Fei Cheng

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48

Abstract: Provided is a forming method of a redistribution structure including: forming a first redistribution layer and a first compensation circuit layer on a substrate, wherein the first compensation circuit layer surrounds the first redistribution layer, and the first compensation circuit layer and the first redistribution layer are electrically insulated from each other; forming a first dielectric layer on the first redistribution layer and the first compensation circuit layer; and forming a second redistribution layer and a second compensation circuit layer on the first dielectric layer, wherein the second compensation circuit layer surrounds the second redistribution layer, the second compensation circuit layer and the second redistribution layer are electrically insulated from each other, the second compensation circuit layer is connected to the first compensation circuit layer, and the second redistribution layer is connected to the first redistribution layer.

公开(公告)号：US20190131271A1

公开(公告)日：2019-05-02

申请号：US15856065

申请日：2017-12-28

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Shu-Wei Kuo ,  Wei-Yuan Cheng ,  Shau-Fei Cheng

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/544 ,  H01L21/67 ,  H01L21/48

CPC classification number: H01L24/75 ,  H01L21/4853 ,  H01L21/67144 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2224/16165 ,  H01L2224/75753 ,  H01L2224/75756 ,  H01L2224/81121 ,  H01L2224/81136

Abstract: A chip bonding apparatus for bonding a chip and a redistribution structure with each other is provided. The chip bonding apparatus includes a pick and place module and an alignment module. The pick and place module is suitable for picking up and placing the chip. The alignment module is movably connected to the pick and place module. The alignment module includes at least one alignment protrusion, wherein the at least one alignment protrusion extends toward at least one alignment socket included in the redistribution structure. Furthermore, a chip bonding method and a chip package structure are provided.

公开(公告)号：US20190057934A1

公开(公告)日：2019-02-21

申请号：US15853853

申请日：2017-12-25

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Jie-Mo Lin ,  Shu-Wei Kuo ,  Wei-Yuan Cheng ,  Chen-Tsai Yang

IPC: H01L23/528 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

Abstract: A redistribution layer structure of the semiconductor package includes a dielectric layer having a thickness, at least one upper conductive wire disposed on a first surface of the dielectric layer, at least one lower conductive wire disposed on a second surface of the dielectric layer, and vias penetrating the dielectric layer and connecting the at least one upper conductive wire and the at least one lower conductive wire. Each via has a cross-section at one upper conductive wire. The cross-section has a third width. The ratio of the third width to the thickness of the dielectric layer is less than or equal to 1. The ratio of the pitch between every two adjacent vias to the third width is greater than or equal to 0.5.

公开(公告)号：US20180122732A1

公开(公告)日：2018-05-03

申请号：US15673422

申请日：2017-08-10

Applicant: Industrial Technology Research Institute

Inventor： Shu-Wei Kuo ,  Chun-Yi Cheng ,  Wei-Yuan Cheng

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00

Abstract: A package structure includes a redistribution layer, a chip, an encapsulant, an under bump supporting layer, an attachment layer and solder balls. The redistribution layer includes a first surface, a second surface opposite to the first surface and a patterned circuit layer disposed on the first surface, wherein an outer surface of the patterned circuit layer and the first surface are coplanar. The chip is disposed on the second surface and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface to encapsulate the chip. The under bump supporting layer is disposed on the first surface and includes openings for exposing the outer surface. The attachment layer covers the inner surface of each opening and the exposed portion of the patterned circuit layer. The solder balls are disposed in the openings respectively and electrically connected to the patterned circuit layer.

公开(公告)号：US20180122694A1

公开(公告)日：2018-05-03

申请号：US15597124

申请日：2017-05-16

Applicant: Industrial Technology Research Institute

Inventor： Chun-Yi Cheng ,  Wei-Yuan Cheng ,  Shu-Wei Kuo ,  Yu-Jhen Yang

IPC: H01L21/768 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L21/02

CPC classification number: H01L23/3107 ,  H01L21/02172 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76832 ,  H01L21/76838 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68359 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/16227 ,  H01L2224/81005 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/15311 ,  H01L2924/181

Abstract: A package structure includes a redistribution layer, a chip, an encapsulant, a plurality of under ball release layers, and a plurality of solder balls. The redistribution layer includes a first surface, a second surface opposite to the first surface, and a patterned circuit layer, wherein the patterned circuit layer includes a plurality of pads protruding from the first surface. The chip is disposed on the second surface and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface and encapsulates the chip. The under ball release layers cover the pads respectively. The solder balls are disposed on the under ball release layers and electrically connected to the pads.

公开(公告)号：US09069250B2

公开(公告)日：2015-06-30

申请号：US13803168

申请日：2013-03-14

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yi-Chun Liu ,  Shu-Wei Kuo ,  Ping-Chen Chen

IPC: G02B26/00 ,  B01F17/00 ,  C01B25/00 ,  G03F7/20

CPC classification number: G03F7/20 ,  G02B26/005 ,  G02B2207/115 ,  G03F7/0035

Abstract: A method for manufacturing an electrowetting display unit includes the following steps. A first substrate and a second substrate are provided. A first conductive layer is disposed on one side of the first substrate. A second conductive layer is disposed on one side of the second substrate. A polymer layer, which includes a siloxane containing a light-induced cross linkable group and a Si—H bond, is disposed on the first conductive layer. The molecular weight of the monomer of the siloxane is equal to or greater than 5000. A part of the polymer layer is exposed to a light so as to form a plurality of hydrophobic sections. A hydrophilic section is developed by treating a developing agent. The hydrophilic section and the plurality of hydrophobic sections form a pattern layer together. Polar liquid and non-polar liquid are disposed between the pattern layer and the second conductive layer.

Abstract translation: 电润湿显示单元的制造方法包括以下步骤。 提供第一基板和第二基板。 第一导电层设置在第一基板的一侧。 第二导电层设置在第二基板的一侧。 包含含有光诱导的可交联基团和Si-H键的硅氧烷的聚合物层设置在第一导电层上。 硅氧烷的单体的分子量等于或大于5000.聚合物层的一部分暴露于光以形成多个疏水部分。 通过处理显影剂来开发亲水部分。 亲水部分和多个疏水部分一起形成图案层。 极性液体和非极性液体设置在图案层和第二导电层之间。