公开(公告)号：US10396220B2

公开(公告)日：2019-08-27

申请号：US16246637

申请日：2019-01-14

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Steven Lorenz Wright ,  Cornelia Tsang Yang

IPC: H01L31/00 ,  H01L31/024 ,  H01L31/18

Abstract: A semiconductor structure includes a thin-film device layer, an optoelectronic device disposed in the thin-film device layer, and a surrogate substrate permanently attached to the thin film device layer. The optoelectronic device is excitable by light at an application wavelength. The surrogate substrate is optically transparent and has a thermal conductivity of at least 300 W/m-K. The surrogate substrate has a volume of substrate removed therefrom to form a via. Light passes through the via and at least some of the surrogate substrate prior to reaching the optoelectronic device.

公开(公告)号：US10380284B2

公开(公告)日：2019-08-13

申请号：US15626582

申请日：2017-06-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Qianwen Chen ,  Li-Wen Hung ,  Wanki Kim ,  John U. Knickerbocker ,  Kenneth P. Rodbell ,  Robert L. Wisnieff

IPC: G06F17/50 ,  G06F15/78 ,  H01L25/00 ,  H01L23/31 ,  H01L23/00 ,  H01L21/683 ,  H01L25/065 ,  H01L25/11 ,  H01L25/07 ,  H01L21/56 ,  H01L25/18 ,  G06F15/80

Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

公开(公告)号：US20190187010A1

公开(公告)日：2019-06-20

申请号：US15844694

申请日：2017-12-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John U. Knickerbocker ,  Minhua Lu ,  KATSUYUKI Sakuma

IPC: G01L1/22 ,  H01L41/047 ,  H01L41/113 ,  G01L9/06 ,  G01L19/00

CPC classification number: G01L1/2293 ,  G01L1/2206 ,  G01L9/06 ,  G01L19/0092 ,  H01L41/047 ,  H01L41/1132

Abstract: According to an embodiment of the present invention, a structure for a strain gauge device is provided. The structure comprises a layer of strain gauge material and one or more contact pads positioned directly on the layer of strain gauge material. The structure further comprises a multiplexer, measuring device, amplifier, analog to digital converter, microcontroller, and wireless adapter. According to the structure, the multiplexer selects a given contact pad pair of the one or more contact pad pairs, the measuring device measures signal generated by the layer of strain gauge material between the given contact pad pair, the amplifier amplifies the measured signal, the analog to digital converter converts the amplified analog signal to a digital signal, the microcontroller processes the digital signal, and the wireless adapter transmits the processed digital signal. In addition, the structure may further comprise a battery to provide energy to the structure.

公开(公告)号：US10297479B2

公开(公告)日：2019-05-21

申请号：US15403937

申请日：2017-01-11

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: B23K26/57 ,  H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  B23K26/36

Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.

公开(公告)号：US20190146245A1

公开(公告)日：2019-05-16

申请号：US16213419

申请日：2018-12-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Emily R. Kinser ,  John U. Knickerbocker ,  Roy R. Yu

IPC: G02C7/08 ,  B29D11/00 ,  G02C7/04

Abstract: Lenses and methods for adjusting the focus of a lens include dividing multiple light sensors in a lens into four quadrants. A position of the lens relative to occlusion along a top and bottom edge of the lens is determined based on numbers of bits in respective bit sequences from light sensors in respective regions of the lens. An optimal focal length for the lens is determined based on the position of the lens. The focal length of the lens is adjusted to match the optimal focal length.

公开(公告)号：US20190088480A1

公开(公告)日：2019-03-21

申请号：US15709876

申请日：2017-09-20

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  B24B7/22 ,  H01L21/683

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

公开(公告)号：US10229288B2

公开(公告)日：2019-03-12

申请号：US15156800

申请日：2016-05-17

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Minhua Lu

IPC: G06F21/00 ,  G06F21/62 ,  G06F19/00 ,  G06F21/32 ,  H04L29/06 ,  G06F21/60

Abstract: A method for providing data security comprises operatively connecting sensing elements with a user, sensing characteristics of the user via the sensing elements, wherein each of the sensing elements comprises at least one unique semiconductor identifier. The at least one unique semiconductor identifier and data concerning the sensed characteristics is transmitted from the sensing elements to a data analytics engine, and at least one unique biological identifier associated with the user is attached to the transmission of the at least one unique semiconductor identifier and the data concerning the sensed characteristics. The method further includes verifying by the data analytics engine that the at least one unique semiconductor identifier of the sensing elements and the at least one biological identifier are valid, analyzing by the data analytics engine the data concerning the sensed characteristics, and generating and transmitting a response based on the analysis.

公开(公告)号：US10217637B1

公开(公告)日：2019-02-26

申请号：US15709876

申请日：2017-09-20

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  B24B7/22 ,  H01L21/683 ,  H01L23/498

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

公开(公告)号：US10168550B2

公开(公告)日：2019-01-01

申请号：US15131411

申请日：2016-04-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Emily R. Kinser ,  John U. Knickerbocker ,  Roy R. Yu

IPC: B29D11/00 ,  G02C7/08 ,  G02C7/04

Abstract: Methods of forming a lens include forming components on a lower substrate. The components are sealed on the lower substrate with a sealing layer. An upper substrate is formed over the sealing layer. The lower substrate is polished to a lower lens curvature.

公开(公告)号：US20180350768A1

公开(公告)日：2018-12-06

申请号：US16057434

申请日：2018-08-07

Applicant: International Business Machines Corporation

Inventor： William E. BERNIER ,  Bing Dang ,  Mario J. Interrante ,  John U. Knickerbocker ,  Son K. Tran

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L23/60 ,  H01L25/065 ,  H01L23/367

CPC classification number: H01L24/81 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/552 ,  H01L23/60 ,  H01L24/09 ,  H01L25/0655 ,  H01L2224/08238 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15738 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.