公开(公告)号：US11268867B2

公开(公告)日：2022-03-08

申请号：US15844694

申请日：2017-12-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John U. Knickerbocker ,  Minhua Lu ,  Katsuyuki Sakuma

IPC: H01L41/047 ,  H01L41/113 ,  G01L1/22 ,  G01L19/00 ,  G01L9/06 ,  G01L1/18 ,  G01L1/16

Abstract: According to an embodiment of the present invention, a structure for a strain gauge device is provided. The structure comprises a layer of strain gauge material and one or more contact pads positioned directly on the layer of strain gauge material. The structure further comprises a multiplexer, measuring device, amplifier, analog to digital converter, microcontroller, and wireless adapter. According to the structure, the multiplexer selects a given contact pad pair of the one or more contact pad pairs, the measuring device measures signal generated by the layer of strain gauge material between the given contact pad pair, the amplifier amplifies the measured signal, the analog to digital converter converts the amplified analog signal to a digital signal, the microcontroller processes the digital signal, and the wireless adapter transmits the processed digital signal. In addition, the structure may further comprise a battery to provide energy to the structure.

公开(公告)号：US11039765B2

公开(公告)日：2021-06-22

申请号：US15715558

申请日：2017-09-26

Applicant: International Business Machines Corporation

Inventor： Vince Siu ,  Minhua Lu ,  Evan Colgan ,  Russell Budd ,  John U. Knickerbocker

IPC: A61B5/145 ,  G01N21/64 ,  G01N33/543 ,  G01N33/558 ,  G16H10/40 ,  G01N21/78 ,  G01N21/84

Abstract: A submersible sensor device configured as a small pellet for testing biological and other liquid samples is provided. In one aspect, a sensing device includes: a housing; and one or more sensors contained within the housing, wherein the housing hermetically seals the sensors such that the sensing device is fully submersible in a liquid analyte. A method and system for analysis of a liquid sample using the present sensing device are also provided.

公开(公告)号：US10545116B2

公开(公告)日：2020-01-28

申请号：US15826383

申请日：2017-11-29

Applicant: International Business Machines Corporation

Inventor： Minhua Lu ,  Sufi Zafar

IPC: G01N27/416 ,  H01L29/73 ,  G01N27/414

Abstract: A bipolar junction transistor is provided; the transistor has an emitter, a base, and a collector. The base is coupled to a sensing electrode. The sensing electrode is immersed in a fluid to be analyzed. The bipolar junction transistor is biased into the active region. An AC excitation of one of the emitter and the base is caused. A measurement is carried out on a collector current resulting from the AC excitation, to analyze the fluid.

公开(公告)号：US20190176147A1

公开(公告)日：2019-06-13

申请号：US15841215

申请日：2017-12-13

Applicant: International Business Machines Corporation

Inventor： Minhua Lu ,  Mareva B. Fevre ,  James Hedrick ,  Vince Siu ,  Evan Colgan ,  Myron Plugge

IPC: B01L3/00 ,  B81C1/00 ,  C07F7/18 ,  C08G63/183

Abstract: Techniques for localized surface modification for microfluidic applications are provided. In one aspect, a method includes: contacting at least one portion of a surface with at least one tri(m)ethoxysilane-containing solution under conditions sufficient to form at least one silane monolayer having a given contact angle on the surface thereby modifying a flow rate over the surface. The silane monolayer can include a silane derivative selected from: trimethoxysilyl-propoxypolyethyleneoxide (TMS-PPEO), hexadecyl-triethoxysilane (HD-TES), tridecafluoro-1,1,2,2-tetrahydrooctyl)triethoxysilane (TDF-THO-TES), and combinations thereof. A device modified in accordance with the present techniques is also provided.

公开(公告)号：US20180098432A1

公开(公告)日：2018-04-05

申请号：US15821432

申请日：2017-11-22

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Robert J. Polastre ,  Bucknell C. Webb

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K1/11 ,  H05K3/30 ,  H05K1/03 ,  H05K3/34

CPC classification number: H05K1/189 ,  G01R31/2818 ,  G01R31/309 ,  G01R31/44 ,  H05K1/0268 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K3/0026 ,  H05K3/0052 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3494 ,  H05K13/0069 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10522 ,  H05K2203/107 ,  H05K2203/162

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

公开(公告)号：US20180052377A1

公开(公告)日：2018-02-22

申请号：US15239972

申请日：2016-08-18

Applicant: International Business Machines Corporation

Inventor： Michael S. Gordon ,  John U. Knickerbocker ,  Minhua Lu ,  Robert Polastre

IPC: G02F1/29 ,  G02F1/1343 ,  G02B3/12 ,  G02F1/137

CPC classification number: G02F1/29 ,  G02B3/12 ,  G02F1/13439 ,  G02F1/137

Abstract: A lens structure includes a transparent cell containing a liquid crystal material. The cell is thicker in a center region thereof than at peripheral regions. The structure further includes transparent electrically conductive electrodes coupled with opposing top and bottom surfaces of the cell and configured to establish an electric field through the cell that is strongest at the peripheral regions where the cell is thinner relative to the center region so that a value of the index of refraction of the liquid crystal material changes across the cell from the center region towards the peripheral regions to change an effective focal length of the lens structure. In some embodiments the top surface of the cell has a first curvature C1 and the bottom surface of the cell has a second curvature C2 that differs from the first curvature.

公开(公告)号：US20170337392A1

公开(公告)日：2017-11-23

申请号：US15156800

申请日：2016-05-17

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Minhua Lu

IPC: G06F21/62 ,  G06F19/00 ,  G06F21/32 ,  G06F21/60

CPC classification number: G06F21/6245 ,  G06F19/00 ,  G06F19/324 ,  G06F21/32 ,  G06F21/602 ,  H04L63/0861

Abstract: A method for providing data security comprises operatively connecting one or more sensing elements with a user, sensing one or more characteristics of the user via the one or more sensing elements, wherein each of the one or more sensing elements comprises at least one unique semiconductor identifier, transmitting the at least one unique semiconductor identifier and data concerning the one or more sensed characteristics from the one or more sensing elements to a data analytics engine, attaching at least one unique biological identifier associated with the user to the transmission of the at least one unique semiconductor identifier and the data concerning the one or more sensed characteristics, verifying by the data analytics engine that the at least one unique semiconductor identifier of the one or more sensing elements and the at least one biological identifier are valid, analyzing by the data analytics engine the data concerning the one or more sensed characteristics, generating a response based on the analysis, and transmitting the response from the data analytics engine to an integration device associated with the user.

公开(公告)号：US09305866B2

公开(公告)日：2016-04-05

申请号：US14189389

申请日：2014-02-25

Applicant: International Business Machines Corporation

Inventor： Minhua Lu ,  Jae-Woong Nah

IPC: H01L21/44 ,  H01L23/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49827 ,  H01L21/4867 ,  H01L21/76898 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Electronic devices including intermetallic columns within vias are provided. Vias are filled with one or more pastes containing metal particles. Thermal treatment of the pastes within the vias converts the particles within the pastes to one or more intermetallic compounds that do not melt during next level packaging.

Abstract translation: 提供包括通孔内的金属间柱的电子设备。 通孔充满一个或多个含有金属颗粒的糊状物。 过孔内的糊状物的热处理将糊料内的颗粒转化为在下一级包装期间不熔化的一种或多种金属间化合物。

公开(公告)号：US20140339699A1

公开(公告)日：2014-11-20

申请号：US14447908

申请日：2014-07-31

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Minhua Lu ,  Eric D. Perfecto ,  David J. Russell ,  Wolfgang Sauter ,  Krystyna W. Semkow ,  Thomas A. Wassick

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/49816 ,  H01L21/76843 ,  H01L21/76885 ,  H01L23/49866 ,  H01L2224/11 ,  H05K1/09 ,  H05K3/3478 ,  H05K3/4007 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0344 ,  H05K2201/09745 ,  H05K2203/041

Abstract: An interconnect structure that includes a substrate having an electrical component present therein, and a under-bump metallurgy (UBM) stack that is present in contact with a contact pad to the electrical component that is present in the substrate. The UBM stack includes a metallic adhesion layer that is direct contact with the contact pad to the electrical component, a copper (Cu) seed layer that is in direct contact with the metallic adhesion layer layer, a first nickel (Ni) barrier layer that is present in direct contact with copper (Cu) seed layer, and a layered structure of at least one copper (Cu) conductor layer and at least one second nickel (Ni) barrier layer present on the first nickel (Ni) barrier layer. A solder ball may be present on second nickel (Ni) barrier layer.

Abstract translation: 一种互连结构，其包括其中存在电气部件的基板以及与接触焊盘接触的凸起下冶金（UBM）堆叠，所述凸块冶金（UBM）堆叠存在于所述基板中的所述电气部件。 UBM堆叠包括与接触焊盘直接接触电气部件的金属粘合层，与金属粘附层层直接接触的铜（Cu）种子层，第一镍（Ni）阻挡层， 存在于铜（Cu）种子层的直接接触中，以及存在于第一镍（Ni）阻挡层上的至少一个铜（Cu）导体层和至少一个第二镍（Ni）阻挡层的层状结构。 第二镍（Ni）阻挡层上可能存在焊球。

公开(公告)号：US20230314331A1

公开(公告)日：2023-10-05

申请号：US18203022

申请日：2023-05-29

Applicant: International Business Machines Corporation

Inventor： Minhua Lu ,  Vince Siu ,  Russell A. Budd ,  Youssef Anthony Asaad ,  Evan Colgan

IPC: G01N21/84 ,  H04M1/72409 ,  G01N21/80

CPC classification number: G01N21/80 ,  G01N21/8483 ,  H04M1/72409 ,  G01N2021/7759

Abstract: Techniques for quantitative colorimetric liquid analysis with color and turbidity correction are provided. In one aspect, an optical detector includes: a vessel for containing a liquid sample; a light source on a first side of the vessel; a first sensor on a second side of the vessel opposite the first side and along a light path of the light source; and a second sensor on a third side of the vessel at an angle θ with respect to the light path. A method for quantitative measurement of an analyte is also provided, as is a method for color and turbidity analysis.