Barrier Layers for Silver Reflective Coatings and HPC Workflows for Rapid Screening of Materials for Such Barrier Layers
    11.
    发明申请
    Barrier Layers for Silver Reflective Coatings and HPC Workflows for Rapid Screening of Materials for Such Barrier Layers 有权
    银色反射涂层屏障层和HPC工作流程,用于快速筛选这种阻挡层的材料

    公开(公告)号:US20140272454A1

    公开(公告)日:2014-09-18

    申请号:US13801635

    申请日:2013-03-13

    Abstract: Provided is High Productivity Combinatorial (HPC) testing methodology of semiconductor substrates, each including multiple site isolated regions. The site isolated regions are used for testing different compositions and/or structures of barrier layers disposed over silver reflectors. The tested barrier layers may include all or at least two of nickel, chromium, titanium, and aluminum. In some embodiments, the barrier layers include oxygen. This combination allows using relative thin barrier layers (e.g., 5-30 Angstroms thick) that have high transparency yet provide sufficient protection to the silver reflector. The amount of nickel in a barrier layer may be 5-10% by weight, chromium—25-30%, titanium and aluminum—30%-35% each. The barrier layer may be co-sputtered in a reactive or inert-environment using one or more targets that include all four metals. An article may include multiple silver reflectors, each having its own barrier layer.

    Abstract translation: 提供了半导体衬底的高生产率组合(HPC)测试方法,每个包括多个现场隔离区域。 位置隔离区域用于测试布置在银反射器上的阻挡层的不同组成和/或结构。 经测试的阻挡层可以包括镍,铬,钛和铝中的全部或至少两种。 在一些实施例中,阻挡层包括氧。 该组合允许使用具有高透明度的相对薄的阻挡层(例如5-30埃厚),同时为银反射器提供足够的保护。 阻挡层中的镍的量可以是5-10重量%,铬25-30%,钛和铝30%-35%。 阻挡层可以在反应性或惰性环境中使用包括所有四种金属的一种或多种目标共溅射。 物品可以包括多个银反射器,每个具有其自己的阻挡层。

    Barrier Layers for Silver Reflective Coatings and HPC Workflows for Rapid Screening of Materials for Such Barrier Layers
    12.
    发明申请
    Barrier Layers for Silver Reflective Coatings and HPC Workflows for Rapid Screening of Materials for Such Barrier Layers 审中-公开
    银色反射涂层屏障层和HPC工作流程,用于快速筛选这种阻挡层的材料

    公开(公告)号:US20140178578A1

    公开(公告)日:2014-06-26

    申请号:US13727115

    申请日:2012-12-26

    Abstract: Provided is High Productivity Combinatorial (HPC) testing methodology of semiconductor substrates, each including multiple site isolated regions. The site isolated regions are used for testing different compositions and/or structures of barrier layers disposed over silver reflectors. The tested barrier layers may include all or at least two of nickel, chromium, titanium, and aluminum. In some embodiments, the barrier layers include oxygen. This combination allows using relative thin barrier layers (e.g., 5-30 Angstroms thick) that have high transparency yet provide sufficient protection to the silver reflector. The amount of nickel in a barrier layer may be 5-10% by weight, chromium −25-30%, titanium and aluminum −30%-35% each. The barrier layer may be co-sputtered in a reactive or inert-environment using one or more targets that include all four metals. An article may include multiple silver reflectors, each having its own barrier layer.

    Abstract translation: 提供了半导体衬底的高生产率组合(HPC)测试方法,每个包括多个现场隔离区域。 位置隔离区域用于测试布置在银反射器上的阻挡层的不同组成和/或结构。 经测试的阻挡层可以包括镍,铬,钛和铝中的全部或至少两种。 在一些实施例中,阻挡层包括氧。 该组合允许使用具有高透明度的相对薄的阻挡层(例如5-30埃厚),同时为银反射器提供足够的保护。 阻挡层中的镍的量可以为5-10重量%,铬-25-30%,钛和铝各自为-30%-35%。 阻挡层可以在反应性或惰性环境中使用包括所有四种金属的一种或多种目标共溅射。 物品可以包括多个银反射器,每个具有其自己的阻挡层。

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