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公开(公告)号：US20130009296A1
公开(公告)日：2013-01-10
申请号：US13348308
申请日：2012-01-11
申请人： Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
发明人： Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49575 , H01L21/561 , H01L23/3107 , H01L23/4334 , H01L23/49503 , H01L23/4951 , H01L23/49513 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L23/49582 , H01L23/49586 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/97 , H01L2224/26175 , H01L2224/27013 , H01L2224/2919 , H01L2224/32245 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/40249 , H01L2224/45014 , H01L2224/45033 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/73263 , H01L2224/73265 , H01L2224/83051 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83439 , H01L2224/83801 , H01L2224/84439 , H01L2224/84444 , H01L2224/84447 , H01L2224/84455 , H01L2224/84464 , H01L2224/84801 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/92246 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/85 , H01L2224/84 , H01L2224/83 , H01L2924/206
摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. The lead frame can include a plurality of terminals with stamped features at edges of the terminals. The stamped features can include flattened portions that are thinner than other portions of the terminals and extend laterally beyond the edges of the terminals. Such stamped features can help mechanically interlock the terminals with the plastic molding of the package body. The stamped features can include patterns and/or other features that may further increase interlocking between the terminals and the package body.
摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 引线框架可以包括在端子的边缘处具有冲压特征的多个端子。 冲压的特征可以包括比端子的其它部分薄的扁平部分，并且横向延伸超过端子的边缘。 这种冲压的特征可以帮助机械地将端子与包装体的塑料成型机械地互锁。 冲压的特征可以包括可以进一步增加端子和封装主体之间的互锁的图案和/或其他特征。
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公开(公告)号：US08106493B2
公开(公告)日：2012-01-31
申请号：US12903626
申请日：2010-10-13
申请人： Anthony C. Tsui , Mohammad Eslamy , Anthony Chia , Hongbo Yang , Ming Zhou , Jian Xu
发明人： Anthony C. Tsui , Mohammad Eslamy , Anthony Chia , Hongbo Yang , Ming Zhou , Jian Xu
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L21/561 , H01L23/3107 , H01L23/49503 , H01L23/49524 , H01L23/49548 , H01L23/49551 , H01L23/49582 , H01L23/49586 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/27013 , H01L2224/2919 , H01L2224/32013 , H01L2224/32245 , H01L2224/40245 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48655 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48755 , H01L2224/48839 , H01L2224/48844 , H01L2224/48855 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83051 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , Y10T29/49124 , H01L2924/00012 , H01L2924/00 , H01L2224/37099
摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.
摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。
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公开(公告)号：US20110024886A1
公开(公告)日：2011-02-03
申请号：US12903626
申请日：2010-10-13
申请人： Anthony C. Tsui , Mohammad Eslamy , Anthony Chia , Hongbo Yang , Ming Zhou , Jian Xu
发明人： Anthony C. Tsui , Mohammad Eslamy , Anthony Chia , Hongbo Yang , Ming Zhou , Jian Xu
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L21/561 , H01L23/3107 , H01L23/49503 , H01L23/49524 , H01L23/49548 , H01L23/49551 , H01L23/49582 , H01L23/49586 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/27013 , H01L2224/2919 , H01L2224/32013 , H01L2224/32245 , H01L2224/40245 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48655 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48755 , H01L2224/48839 , H01L2224/48844 , H01L2224/48855 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83051 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , Y10T29/49124 , H01L2924/00012 , H01L2924/00 , H01L2224/37099
摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.
摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。
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公开(公告)号：US20090250796A1
公开(公告)日：2009-10-08
申请号：US12191527
申请日：2008-08-14
申请人： Anthony C. Tsui , Mohammad Eslamy , Anthony Chia , Hongbo Yang , Ming Zhou , Jian Xu
发明人： Anthony C. Tsui , Mohammad Eslamy , Anthony Chia , Hongbo Yang , Ming Zhou , Jian Xu
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49575 , H01L21/561 , H01L23/3107 , H01L23/49503 , H01L23/49524 , H01L23/49548 , H01L23/49551 , H01L23/49582 , H01L23/49586 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/27013 , H01L2224/2919 , H01L2224/32013 , H01L2224/32245 , H01L2224/40245 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48655 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48755 , H01L2224/48839 , H01L2224/48844 , H01L2224/48855 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83051 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , Y10T29/49124 , H01L2924/00012 , H01L2924/00 , H01L2224/37099
摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.
摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。
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15.发明申请公开(公告)号：US20130017652A1
公开(公告)日：2013-01-17
申请号：US13348332
申请日：2012-01-11
申请人： Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
发明人： Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
IPC分类号： H01L21/56
CPC分类号： H01L23/49575 , H01L21/561 , H01L23/3107 , H01L23/4334 , H01L23/49503 , H01L23/49524 , H01L23/49548 , H01L23/49551 , H01L23/49562 , H01L23/49582 , H01L23/49586 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/131 , H01L2224/16145 , H01L2224/16245 , H01L2224/27013 , H01L2224/2919 , H01L2224/32245 , H01L2224/37147 , H01L2224/37644 , H01L2224/37655 , H01L2224/37664 , H01L2224/40095 , H01L2224/40137 , H01L2224/40247 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48655 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48755 , H01L2224/48839 , H01L2224/48844 , H01L2224/48855 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2224/83051 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/92 , H01L2224/92247 , H01L2224/92252 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2924/206
摘要： Embodiments of the present invention relate to forming semiconductor device package with a heat sink. In one embodiment, a subassembly comprising a die attached to a lead frame is formed, a heat sink is provided in a molding cavity, and the subassembly is coupled to the heat sink while the heat sink is in the molding cavity. In certain embodiments, a second component of the lead frame can be substituted for the heat sink. Such techniques can simplify the manufacturing process for semiconductor packages having a heat sink or lead frame with a second component.
摘要翻译： 本发明的实施例涉及用散热器形成半导体器件封装。 在一个实施例中，形成包括连接到引线框架的管芯的子组件，在模制腔中设置散热器，并且在散热器处于模腔中时，子组件联接到散热器。 在某些实施例中，引线框架的第二部件可以代替散热器。 这样的技术可以简化具有散热器或具有第二部件的引线框的半导体封装的制造工艺。
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16.发明申请公开(公告)号：US20130009297A1
公开(公告)日：2013-01-10
申请号：US13348322
申请日：2012-01-11
申请人： Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
发明人： Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4334 , H01L23/49503 , H01L23/4951 , H01L23/49513 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L23/49582 , H01L23/49586 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/97 , H01L2224/26175 , H01L2224/27013 , H01L2224/2919 , H01L2224/32013 , H01L2224/32245 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40245 , H01L2224/40247 , H01L2224/45014 , H01L2224/45033 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/73263 , H01L2224/73265 , H01L2224/83051 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83439 , H01L2224/83801 , H01L2224/8385 , H01L2224/84439 , H01L2224/84444 , H01L2224/84447 , H01L2224/84455 , H01L2224/84464 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/92246 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2224/84 , H01L2224/83 , H01L2924/00012 , H01L2224/85 , H01L2924/206
摘要： Embodiments of the present invention relate to the use of configurable lead frame fingers in a semiconductor device package. More specifically, the lead frame of a device package can include a plurality of fingers used to support and provide electrical contact to the die. The die can include a plurality of contacts that comprise a series of parallel columns located a certain distance from one another, and the fingers of the lead frame can be configured to align with the contacts. The lead frame can have multiple terminals, each with one or more fingers and pins. As such, each lead frame configuration may be utilized with different configurations of die.
摘要翻译： 本发明的实施例涉及在半导体器件封装中使用可配置引线框架指状物。 更具体地，器件封装的引线框架可以包括用于支撑并提供与管芯的电接触的多个指状物。 模具可以包括多个触点，其包括一系列彼此相距一定距离的平行列，并且引线框架的指状物可构造成与触点对准。 引线框架可以具有多个端子，每个端子具有一个或多个指状物和引脚。 因此，每个引线框架配置可以与不同的管芯配置一起使用。
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公开(公告)号：US20120181677A1
公开(公告)日：2012-07-19
申请号：US13348298
申请日：2012-01-11
申请人： Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
发明人： Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
IPC分类号： H01L23/495 , H01L23/34
CPC分类号： H01L23/49503 , H01L21/561 , H01L23/3107 , H01L23/49524 , H01L23/49548 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L23/49586 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/0655 , H01L2224/0401 , H01L2224/06051 , H01L2224/1411 , H01L2224/16145 , H01L2224/16245 , H01L2224/26175 , H01L2224/27013 , H01L2224/2919 , H01L2224/32013 , H01L2224/32245 , H01L2224/371 , H01L2224/40095 , H01L2224/40245 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48655 , H01L2224/48699 , H01L2224/48739 , H01L2224/48755 , H01L2224/48839 , H01L2224/48855 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2224/83051 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/84801 , H01L2224/85439 , H01L2224/85455 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2924/206
摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.
摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。
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公开(公告)号：US07838339B2
公开(公告)日：2010-11-23
申请号：US12191527
申请日：2008-08-14
申请人： Anthony C. Tsui , Mohammad Eslamy , Anthony Chia , Hongbo Yang , Ming Zhou , Jian Xu
发明人： Anthony C. Tsui , Mohammad Eslamy , Anthony Chia , Hongbo Yang , Ming Zhou , Jian Xu
IPC分类号： H01L21/82
CPC分类号： H01L23/49575 , H01L21/561 , H01L23/3107 , H01L23/49503 , H01L23/49524 , H01L23/49548 , H01L23/49551 , H01L23/49582 , H01L23/49586 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/27013 , H01L2224/2919 , H01L2224/32013 , H01L2224/32245 , H01L2224/40245 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48655 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48755 , H01L2224/48839 , H01L2224/48844 , H01L2224/48855 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83051 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , Y10T29/49124 , H01L2924/00012 , H01L2924/00 , H01L2224/37099
摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.
摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。
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公开(公告)号：US20120181676A1
公开(公告)日：2012-07-19
申请号：US13348283
申请日：2012-01-11
申请人： Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
发明人： Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49503 , H01L21/561 , H01L23/3107 , H01L23/49524 , H01L23/49548 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L23/49586 , H01L23/60 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2224/131 , H01L2224/1411 , H01L2224/16145 , H01L2224/16245 , H01L2224/17106 , H01L2224/27013 , H01L2224/2919 , H01L2224/32245 , H01L2224/371 , H01L2224/40095 , H01L2224/40245 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48699 , H01L2224/48739 , H01L2224/48839 , H01L2224/4903 , H01L2224/49051 , H01L2224/49109 , H01L2224/49171 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2224/83051 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/84801 , H01L2224/85439 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012 , H01L2924/206
摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.
摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。
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公开(公告)号：USD588557S1
公开(公告)日：2009-03-17
申请号：US29292225
申请日：2007-10-02
申请人： James Harnden , Anthony Chia , Hongbo Yang , Teng Hui
设计人： James Harnden , Anthony Chia , Hongbo Yang , Teng Hui
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