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    INTEGRATED CIRCUIT PACKAGING SYSTEM INCLUDING NON-LEADED PACKAGE
    12.
    发明申请
    INTEGRATED CIRCUIT PACKAGING SYSTEM INCLUDING NON-LEADED PACKAGE 审中-公开
    集成电路封装系统，包括非引线封装

    公开(公告)号：US20110204501A1

    公开(公告)日：2011-08-25

    申请号：US13100768

    申请日：2011-05-04

    申请人： Jeffrey D. Punzalan ,  Henry D. Bathan ,  Il Kwon Shim ,  Keng Kiat Lau

    发明人： Jeffrey D. Punzalan ,  Henry D. Bathan ,  Il Kwon Shim ,  Keng Kiat Lau

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit packaging system includes: a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads; each one of the plurality of leads includes first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package; and a lead-to-lead gap formed between the second terminal ends of alternating leads in excess of the predetermined interval gap.

    摘要翻译： 集成电路封装系统包括：具有预定厚度的多个引线和多个引线中的每一个之间的预定间隔间隙; 所述多个引线中的每一个包括邻近集成电路设置的第一端子和沿着封装的周边设置的第二端子端; 以及在交替引线的第二端部之间形成的引出线间隙超过预定间隔间隙。

    Integrated circuit packaging system including a non-leaded package
    13.
    发明授权
    Integrated circuit packaging system including a non-leaded package 有权
    集成电路封装系统，包括非引线封装

    公开(公告)号：US07947534B2

    公开(公告)日：2011-05-24

    申请号：US11307383

    申请日：2006-02-04

    申请人： Jeffrey D. Punzalan ,  Henry D. Bathan ,  Il Kwon Shim ,  Keng Kiat Lau

    发明人： Jeffrey D. Punzalan ,  Henry D. Bathan ,  Il Kwon Shim ,  Keng Kiat Lau

    IPC分类号： H01L33/62

    CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit package system is provided including: forming a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads; configuring each one of the plurality of leads to include first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package; and forming the second terminal ends of alternating leads disposed along the periphery of the package to form an etched lead-to-lead gap in excess of the predetermined interval gap.

    摘要翻译： 提供一种集成电路封装系统，包括：在多个引线中的每一个之间形成具有预定厚度和预定间隔间隙的多个引线; 配置所述多个引线中的每一个包括邻近集成电路设置的第一终端和沿着封装的周边设置的第二终端; 以及沿着所述封装的周边形成交替引线的第二端部，以形成超过所述预定间隔间隙的蚀刻引线到引线间隙。

    Integrated circuit leadless package system
    16.
    发明授权
    Integrated circuit leadless package system 有权
    集成电路无引线封装系统

    公开(公告)号：US07498665B2

    公开(公告)日：2009-03-03

    申请号：US11381726

    申请日：2006-05-04

    申请人： Leocadio M. Alabin ,  Il Kwon Shim ,  Henry D. Bathan ,  Jeffrey D. Punzalan

    发明人： Leocadio M. Alabin ,  Il Kwon Shim ,  Henry D. Bathan ,  Jeffrey D. Punzalan

    IPC分类号： H01L23/495 ,  H01L21/44

    CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L24/97 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

    摘要： An integrated circuit leadless package system is presented comprising forming a QFN leadframe comprises providing a die pad, forming a fishtail tie-bar on the die pad, forming a row of an outer contact pad around the die pad, forming an additional outer contact pad around the fishtail tie-bar, and forming an inner contact pad in a staggered position from the outer contact pad, mounting an integrated circuit on the die pad of the QFN leadframe, and attaching a bond wire from the integrated circuit to the additional outer contact pad.

    摘要翻译： 提供了一种集成电路无引线封装系统，包括形成QFN引线框架，包括提供管芯焊盘，在管芯焊盘上形成鱼尾连接杆，在管芯焊盘周围形成一排外部接触焊盘，形成附近的外部接触焊盘 钓鱼连接杆，并且从外部接触垫形成交错位置的内部接触垫，将集成电路安装在QFN引线框架的管芯焊盘上，以及将来自集成电路的接合线附接到附加的外部接触焊盘 。