公开(公告)号：US20090305612A1

公开(公告)日：2009-12-10

申请号：US12457175

申请日：2009-06-03

申请人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

发明人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC分类号： B24B51/00 ,  B08B3/00 ,  B08B1/02 ,  F26B5/00

CPC分类号： B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

摘要翻译： 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被抛光的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US08795032B2

公开(公告)日：2014-08-05

申请号：US12457175

申请日：2009-06-03

申请人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

发明人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC分类号： B24B51/00

CPC分类号： B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

摘要翻译： 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被研磨的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20050155865A1

公开(公告)日：2005-07-21

申请号：US10845429

申请日：2004-05-14

申请人： Koji Mishima ,  Keisuke Namiki ,  Masao Hodai ,  Junji Kunisawa ,  Natsuki Makino ,  Yukio Fukunaga

发明人： Koji Mishima ,  Keisuke Namiki ,  Masao Hodai ,  Junji Kunisawa ,  Natsuki Makino ,  Yukio Fukunaga

IPC分类号： C25D7/12 ,  C25B9/00 ,  C25D17/00 ,  C25D17/02 ,  C25D19/00 ,  C25D21/00

CPC分类号： C25D17/00 ,  C25D17/02

摘要： There is provided an electrolytic processing apparatus and method which can produce products having various specifications with enhanced productivity, thus reducing the production cost, and which can respond flexibly to the movement toward finer interconnects in semiconductor devices. An electrolytic processing apparatus according to the present invention includes: an electrolytic processing unit including a substrate holder for holding a substrate, and a counter electrode plate disposed opposite the substrate held by the substrate holder, said electrolytic processing unit carrying out electrolytic processing by filling the space between the substrate held by the substrate holder and the counter electrode plate with an electrolysis solution while feeding electricity; and a plurality of electrolysis solution supply facilities for supplying different types of electrolysis solutions; wherein the electrolytic processing unit is selectively connectable to one of the plurality of electrolysis solution supply facilities.

摘要翻译： 提供一种电解处理装置和方法，其能够生产具有提高的生产率的各种规格的产品，从而降低生产成本，并且可以灵活地响应于朝向半导体器件中更精细的互连的移动。 根据本发明的电解处理装置包括：电解处理单元，包括用于保持基板的基板保持器和与由基板保持器保持的基板相对设置的对置电极板，所述电解处理单元通过填充电解处理单元进行电解处理 在供电的同时由衬底保持器保持的衬底与电极板之间的电解槽的间隔; 以及用于供给不同种类的电解液的多个电解液供给装置; 其中所述电解处理单元可选择性地连接到所述多个电解溶液供应设备中的一个。

公开(公告)号：US06858084B2

公开(公告)日：2005-02-22

申请号：US09983401

申请日：2001-10-24

申请人： Hiroaki Inoue ,  Koji Mishima ,  Tsutomu Karimata ,  Kenji Nakamura ,  Moriji Matsumoto ,  Junji Kunisawa

发明人： Hiroaki Inoue ,  Koji Mishima ,  Tsutomu Karimata ,  Kenji Nakamura ,  Moriji Matsumoto ,  Junji Kunisawa

IPC分类号： C23C18/16 ,  H01L21/288 ,  H01L21/768 ,  B05C11/00

CPC分类号： H01L21/76843 ,  C23C18/1619 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877 ,  H01L2221/1089

摘要： The present invention relates to an electroless plating apparatus which can reduce an amount of a plating liquid to be used, maintain a stable plating process, be downsized, reduce an apparatus cost, form a film having a uniform thickness over an entire surface, and prevent a plating liquid from being deteriorated due to a temperature rise. The present invention comprises: a holding device for holding a substrate with a surface, to be plated, facing upwardly; a plating liquid holding mechanism for sealing a periphery of the surface, to be plated, of the substrate held by the holding device; an electroless plating treatment liquid supply device for supplying an electroless plating liquid to the surface, to be plated, of the substrate sealed by the plating liquid holding mechanism to allow supplied electroless plating liquid to be held on the substrate; and a heating apparatus provided below the substrate.

摘要翻译： 本发明涉及一种能够减少使用的电镀液量，保持电镀工序稳定，小型化，降低设备成本，在整个表面形成均匀厚度的膜的化学镀设备，并且防止 电镀液由于升温而劣化。 本发明包括：保持装置，用于保持具有面向上的待镀表面的基板; 电镀液保持机构，用于密封由保持装置保持的基板的待镀表面的周边; 一种化学镀处理液体供应装置，用于向由电镀液保持机构密封的基板的待镀表面供给化学镀液体，以使供给的化学镀液保持在基板上; 以及设置在基板的下方的加热装置。

公开(公告)号：US20050074559A1

公开(公告)日：2005-04-07

申请号：US10995174

申请日：2004-11-24

申请人： Hiroaki Inoue ,  Koji Mishima ,  Tsutomu Karimata ,  Kenji Nakamura ,  Moriji Matsumoto ,  Junji Kunisawa

发明人： Hiroaki Inoue ,  Koji Mishima ,  Tsutomu Karimata ,  Kenji Nakamura ,  Moriji Matsumoto ,  Junji Kunisawa

IPC分类号： C23C18/16 ,  H01L21/288 ,  H01L21/768 ,  B05D3/12

CPC分类号： H01L21/76843 ,  C23C18/1619 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877 ,  H01L2221/1089

摘要： The present invention relates to an electroless plating apparatus which can reduce an amount of a plating liquid to be used, maintain a stable plating process, be downsized, reduce an apparatus cost, form a film having a uniform thickness over an entire surface, and prevent a plating liquid from being deteriorated due to a temperature rise. The present invention comprises: a holding device for holding a substrate with a surface, to be plated, facing upwardly; a plating liquid holding mechanism for sealing a periphery of the surface, to be plated, of the substrate held by the holding device; an electroless plating treatment liquid supply device for supplying an electroless plating liquid to the surface, to be plated, of the substrate sealed by the plating liquid holding mechanism to allow supplied electroless plating liquid to be held on the substrate; and a heating apparatus provided below the substrate.

公开(公告)号：US06767437B2

公开(公告)日：2004-07-27

申请号：US09860514

申请日：2001-05-21

申请人： Tetsuo Matsuda ,  Hisashi Kaneko ,  Koji Mishima ,  Natsuki Makino ,  Junji Kunisawa

发明人： Tetsuo Matsuda ,  Hisashi Kaneko ,  Koji Mishima ,  Natsuki Makino ,  Junji Kunisawa

IPC分类号： C25D1700

CPC分类号： C25D17/001 ,  Y10S204/07

摘要： In an electroplating apparatus, an electrolytic agent is filled into the portion between an anode and a dummy cathode which is opposite substantially face to face and parallel to the anode, and an electric current is supplied to this portion, thereby suppressing changes in properties of a black film during the period in which plating to a substrate to be processed is stopped. In particular, by applying an electric current to the anode immediately before plating to the substrate is resumed, the film formation characteristics of plating to the substrate can be maximally stabilized. This can reduce the consumption power and dissolution of the anode. This apparatus is particularly effective in copper plating in which the formation of a black film is significant.

摘要翻译： 在电镀装置中，电解质被填充到阳极和虚拟阴极之间的与阳极基本上面对并且平行的方向相反的部分中，并且向该部分提供电流，从而抑制了 在停止对待处理的基板的电镀期间的黑色膜。 特别地，通过在电镀到基板之前立即向阳极施加电流，电镀到基板的成膜特性可以最大程度地稳定。 这可以降低阳极的消耗功率和溶解度。 该装置在形成黑色膜的铜电镀中特别有效。

公开(公告)号：US06746589B2

公开(公告)日：2004-06-08

申请号：US09955115

申请日：2001-09-19

申请人： Koji Mishima ,  Hiroaki Inoue ,  Natsuki Makino ,  Junji Kunisawa ,  Kenji Nakamura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Toshiyuki Morita

发明人： Koji Mishima ,  Hiroaki Inoue ,  Natsuki Makino ,  Junji Kunisawa ,  Kenji Nakamura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Toshiyuki Morita

IPC分类号： C25D500

CPC分类号： H01L21/2885 ,  C25D5/04 ,  C25D5/08 ,  C25D21/12 ,  H01L21/7684 ,  H01L21/76877

摘要： The present invention relates to a plating method and a plating apparatus which can attain embedding of copper into fine interconnection patterns with use of a plating liquid having high throwing power and leveling properties, and which can make film thickness of a plated film substantially equal between an interconnection region and a non-interconnection region. A plating method comprises filling a plating liquid containing metal ions and an additive into a plating space formed between a substrate and an anode disposed closely to the substrate so as to face the substrate, and changing concentration of the additive in the plating liquid filled into the plating space during a plating process.

公开(公告)号：US20060027452A1

公开(公告)日：2006-02-09

申请号：US11235335

申请日：2005-09-27

申请人： Koji Mishima ,  Junji Kunisawa ,  Natsuki Makino ,  Norio Kimura ,  Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto ,  Takahiro Nanjo ,  Mitsuko Odagaki

发明人： Koji Mishima ,  Junji Kunisawa ,  Natsuki Makino ,  Norio Kimura ,  Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto ,  Takahiro Nanjo ,  Mitsuko Odagaki

IPC分类号： C25D5/02 ,  C25D17/00

CPC分类号： H01L21/67109 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67778 ,  H01L21/681

摘要： A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.

摘要翻译： 基板处理装置以限定在半导体基板中的精细互连图案或沟槽中填充诸如铜等的金属。 基板处理装置具有用于放置基板盒以装载和卸载基板的装载/卸载单元，用于处理基板的基板处理单元，以及用于在装载/卸载单元和卸载单元之间传送基板的传送机器人 底物处理单元。 装载/卸载单元，基板处理单元和传送机器人安装在单个设施中。 装载/卸载单元具有可水平旋转的旋转台​​，用于将基板盒定位在检测装载/卸载单元中的基板盒的位置，并用传送机器人从基板盒移除基板。

公开(公告)号：US07387717B2

公开(公告)日：2008-06-17

申请号：US10631726

申请日：2003-08-01

申请人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

发明人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

IPC分类号： C25D7/12

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/6723 ,  H01L21/76877 ,  H01L21/76879 ,  H01L2924/0002 ,  H05K3/423 ,  H01L2924/00

摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.

摘要翻译： 用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。 该装置具有基板保持部分36，其水平地保持并旋转基板，其表面被面向上。 密封材料90接触表面的周缘部分，以水密的方式密封该部分。 阴极电极88在与基板接触时通过电流。 阴极部38与基板保持部36一体地旋转。电极臂部30在阴极部38的上方，水平且垂直地移动，阳极98面朝下。 将电镀液注入被镀表面与接近待镀表面的阳极98之间的空间中。 因此，电镀处理和附带的处理可以通过单个单元进行。

公开(公告)号：US07208074B2

公开(公告)日：2007-04-24

申请号：US10742390

申请日：2003-12-22

申请人： Koji Mishima ,  Junji Kunisawa ,  Natsuki Makino ,  Norio Kimura ,  Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto ,  Takahiro Nanjo ,  Mitsuko Odagaki

发明人： Koji Mishima ,  Junji Kunisawa ,  Natsuki Makino ,  Norio Kimura ,  Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto ,  Takahiro Nanjo ,  Mitsuko Odagaki

IPC分类号： C25C28/00 ,  C25D5/10

CPC分类号： H01L21/67109 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67778 ,  H01L21/681

摘要： A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.

摘要翻译： 基板处理装置以限定在半导体基板中的精细互连图案或沟槽中填充诸如铜等的金属。 基板处理装置具有用于放置基板盒以装载和卸载基板的装载/卸载单元，用于处理基板的基板处理单元，以及用于在装载/卸载单元和卸载单元之间传送基板的传送机器人 底物处理单元。 装载/卸载单元，基板处理单元和传送机器人安装在单个设施中。 装载/卸载单元具有可水平旋转的旋转台​​，用于将基板盒定位在检测装载/卸载单元中的基板盒的位置，并用传送机器人从基板盒移除基板。