公开(公告)号：US06964885B2

公开(公告)日：2005-11-15

申请号：US10752255

申请日：2004-01-06

申请人： Patrick Anthony Coico ,  James H. Covell ,  Benjamin V. Fasano ,  Lewis S. Goldman ,  Ronald L. Hering ,  Sundar Kamath ,  Kenneth Charles Marston ,  Frank Louis Pompeo ,  Karl J. Puttlitz ,  Jeffrey Allen Zitz

发明人： Patrick Anthony Coico ,  James H. Covell ,  Benjamin V. Fasano ,  Lewis S. Goldman ,  Ronald L. Hering ,  Sundar Kamath ,  Kenneth Charles Marston ,  Frank Louis Pompeo ,  Karl J. Puttlitz ,  Jeffrey Allen Zitz

IPC分类号： H01L21/50 ,  H01L23/04 ,  H01L25/065 ,  H05K1/02 ,  H05K3/30 ,  H01L21/44 ,  H01L21/48

CPC分类号： H01L21/50 ,  H01L23/04 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/301 ,  H01L2224/0401

摘要： An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.

摘要翻译： 集成电路模块，焊盘栅阵列模块以及用于形成模块的方法包括安装一个或多个芯片或分立电子部件的基板以及用于覆盖基板的盖，并且包括至少一个连接到 用于在致动期间限制基板的弯曲量的盖。 所述至少一个突起可以刚性地固定到盖上或者可调节地插入通过盖。

公开(公告)号：US6068175A

公开(公告)日：2000-05-30

申请号：US162739

申请日：1998-09-29

申请人： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

发明人： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

IPC分类号： B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/91 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34 ,  B23K37/02 ,  B23K1/00 ,  B23K5/00 ,  B23K31/00 ,  B23K31/02

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/914 ,  C08L63/00 ,  C08L67/02 ,  C08L71/126 ,  H01L24/75 ,  H05K3/3415 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K2201/10734 ,  H05K2203/0173 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1572 ,  H05K2203/176 ,  H05K3/3436 ,  Y02P70/613 ,  Y10S29/024 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53265

摘要： Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

摘要翻译： 用于使用接合材料将第一区域阵列部件连接到基板的装置。 该装置具有将第一区域阵列部件和第一区域阵列部件下方的基板部分朝着第二区域阵列部件的两个热导向的喷嘴，以熔化接合材料。 弹性密封件接触基板并防止热量影响与第一区域阵列部件相邻的其他部件。 喷嘴被压靠在基板上以抑制基板的翘曲，这可能是由第一区域阵列部件的加热引起的，并且防止损坏基板。 喷嘴可以倾斜使其符合基板的表面。 允许第一区域阵列部件在加热期间在熔融接合材料的表面张力下在基板的平面方向上自由移动以使第一区域阵列部件居中。

公开(公告)号：US5721299A

公开(公告)日：1998-02-24

申请号：US193926

申请日：1994-02-09

申请人： Marie Angelopoulos ,  Ali Afzali-Ardakani ,  Jack A. Dickerson ,  Thomas B. Pillsbury ,  Karl J. Puttlitz ,  Jane M. Shaw ,  Jeffrey D. Gelorme

发明人： Marie Angelopoulos ,  Ali Afzali-Ardakani ,  Jack A. Dickerson ,  Thomas B. Pillsbury ,  Karl J. Puttlitz ,  Jane M. Shaw ,  Jeffrey D. Gelorme

IPC分类号： C08G61/12 ,  H01B1/12 ,  H01J29/86 ,  H01L23/498 ,  H01L23/60 ,  H01L33/38 ,  H01L33/42 ,  H05K9/00 ,  H01B1/06

CPC分类号： H05K9/0079 ,  C08G61/12 ,  H01B1/125 ,  H01B1/127 ,  H01B1/128 ,  H01J29/868 ,  H01L23/49894 ,  H01L23/60 ,  H01L33/40 ,  H01L33/42 ,  H01L2924/0002

摘要： Electrically conductive and abrasion resistant polymeric compositions, methods of fabrication thereof and uses thereof are described. Admixtures of abrasion resistant materials and electrically conductive polymeric materials are formed. Many of these admixtures are light transmitting and can be used as an abrasion resistant light transmitting electrostatic discharge layers. The light transmitting discharge layer is useful as a surface coating for visual displays such as CRT screens to avoid electrostatic accumulation of dust and scratching. The compositions can be admixtures of abrasion resistant silicones, polysiloxanes, acrylates, epoxies, methacrylates, epoxyacrylates, epoxymethacrylates, styrenes and electrically conductive polymers selected from the group of substituted and unsubstituted polyanilines, polyparaphenylenevinyles, substituted and unsubstituted polythiophenes substituted and unsubstituted poly-p-phenylene sulfides, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophenes, polyacetylines formed from soluble precursors, combinations thereof and blends thereof with other polymers. The compositions can be a layer of an electrically conductive polymer with an abrasion resistant layer thereover.

摘要翻译： 描述了导电和耐磨聚合物组合物，其制造方法及其用途。 形成耐磨材料和导电聚合材料的外加剂。 这些混合物中的许多是透光性的并且可以用作耐磨光透射静电放电层。 透光放电层可用作诸如CRT屏幕的视觉显示器的表面涂层，以避免灰尘和划痕的静电积累。 组合物可以是耐磨硅氧烷，聚硅氧烷，丙烯酸酯，环氧树脂，甲基丙烯酸酯，环氧丙烯酸酯，环氧甲基丙烯酸酯，苯乙烯和选自取代和未取代的聚苯胺的聚合物，聚对亚苯基乙烯基，取代和未取代的聚噻吩的取代和未取代的聚对 - 取代和未取代的聚吡咯，取代和未取代的聚硒吩，可溶性前体形成的聚乙酰胺，其组合以及与其它聚合物的共混物。 组合物可以是其上具有耐磨层的导电聚合物层。

公开(公告)号：US5620132A

公开(公告)日：1997-04-15

申请号：US461960

申请日：1995-06-05

申请人： Andrew J. Downing ,  Donald C. Foster ,  Karl J. Puttlitz

发明人： Andrew J. Downing ,  Donald C. Foster ,  Karl J. Puttlitz

IPC分类号： B23K1/018 ,  H01L21/44

CPC分类号： B23K1/018 ,  B23K2201/36

摘要： The present invention relates generally to a new apparatus and method for removing solid material and liquid material that may contain solid material from a substrate. More particularly, the invention encompasses an apparatus and method for removing molten solder which may contain solid particles and solder balls or columns from a substrate using a unique squeegee. Also, disclosed is a method for removing solder balls or columns from a substrate using a backer having an adhesive thereon.

摘要翻译： 本发明一般涉及一种用于从固体材料中除去固体材料和液体材料的新装置和方法，所述固体材料和液体材料可以含有来自基底的固体材料。 更具体地说，本发明包括一种用于去除熔融焊料的装置和方法，该装置和方法可以使用独特的刮板从基板上包含固体颗粒和焊球或者列。 此外，公开了一种使用其上具有粘合剂的衬垫从衬底去除焊球或柱的方法。

公开(公告)号：US5284286A

公开(公告)日：1994-02-08

申请号：US786201

申请日：1991-10-31

申请人： Peter J. Brofman ,  Shaji Farooq ,  Kathleen A. Lidestri ,  Gregg B. Monjeau ,  Karl J. Puttlitz

发明人： Peter J. Brofman ,  Shaji Farooq ,  Kathleen A. Lidestri ,  Gregg B. Monjeau ,  Karl J. Puttlitz

IPC分类号： B22F3/11 ,  B23K3/08 ,  B23K1/018

CPC分类号： B23K3/08 ,  B22F3/11 ,  B22F2998/00 ,  B22F2999/00

摘要： A porous metal block for selectively removing solder or braze from a substrate is disclosed. The block comprises a plurality of protrusions which absorb solder or braze through capillary action. The number and dimensions of the protrusions vary depending on the application. Also disclosed is a process for making such a block involving a unique two steps sintering process.

摘要翻译： 公开了一种用于从衬底选择性地去除焊料或钎焊的多孔金属块。 该块包括通过毛细管作用吸收焊料或钎焊的多个突起。 突起的数量和尺寸根据应用而变化。 还公开了一种制造这种涉及独特的两步烧结工艺的块的方法。

公开(公告)号：US4160893A

公开(公告)日：1979-07-10

申请号：US865768

申请日：1977-12-29

申请人： Robert H. Meyen ,  Karl J. Puttlitz ,  Karl Schink ,  Herbert Wenskus

发明人： Robert H. Meyen ,  Karl J. Puttlitz ,  Karl Schink ,  Herbert Wenskus

IPC分类号： H05K3/34 ,  B23K1/005 ,  H01L21/60 ,  H05K13/00 ,  B23K1/00 ,  B23K1/04

CPC分类号： H01L24/81 ,  B23K1/0053 ,  H01L24/75 ,  H01L24/80 ,  H01L2224/75 ,  H01L2224/75283 ,  H01L2224/75301 ,  H01L2224/75302 ,  H01L2224/75745 ,  H01L2224/75981 ,  H01L2224/8123 ,  H01L2224/81801 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025

摘要： An individual chip joining machine is designed primarily to bond a single chip to a multi-chip substrate. The machine includes an X-Y table for moving a substrate to locate a chip site beneath a probe. The probe serves to pick up a chip and either place it on the substrate or remove it therefrom and further serves to heat the chip to join it to the substrate by solder reflow or to melt the solder and allow the chip to be removed. The probe is mounted on a Z direction placement mechanism that also includes means to allow the probe to be backed off a fixed distance from a chip, once the chip has been placed on the substrate preparatory to joining thereto. A second heater heats the substrate to a bias temperature, this heating being controlled through use of a surrogate substrate having a thermocouple attached thereto.

摘要翻译： {PG，1单个芯片接合机主要设计为将单个芯片连接到多芯片基板。 该机器包括用于移动衬底以在探针下方定位芯片位置的X-Y工作台。 探头用于拾取芯片并将其放置在基板上或将其从中移除，并进一步用于加热芯片以通过焊料回流将其连接到基板，或熔化焊料并允许芯片被去除。 探针安装在Z方向放置机构上，一旦芯片已经放置在准备连接到其上的基板上，该Z方向放置机构还包括允许探针从芯片背离固定距离的装置。 第二加热器将基板加热至偏压温度，该加热通过使用附接有热电偶的替代基板进行控制。