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公开(公告)号:US10764966B2
公开(公告)日:2020-09-01
申请号:US15586178
申请日:2017-05-03
Applicant: LAM RESEARCH CORPORATION
Inventor: Yuma Ohkura , Darrell Ehrlich , Eric A. Pape
Abstract: A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, at least one of a heating layer and a ceramic layer arranged on the baseplate, and a plurality of heating elements provided within the at least one of the heating layer and the ceramic layer. The plurality of heating elements includes a first material having a first electrical resistance. Wiring is provided through the baseplate in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone to a first heating element of the plurality of heating elements. The first heating element is arranged in a second zone of the plurality of heating zones and the electrical connection includes a second material having a second electrical resistance that is less than the first electrical resistance.
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公开(公告)号:US20200243307A1
公开(公告)日:2020-07-30
申请号:US16845723
申请日:2020-04-10
Applicant: Lam Research Corporation
Inventor: Ryan Bise , Rajinder Dhindsa , Alexei Marakhtanov , Lumin Li , Sang Ki Nam , Jim Rogers , Eric Hudson , Gerardo Delgadino , Andrew D. Bailey, III , Mike Kellogg , Anthony de la Llera , Darrell Ehrlich
IPC: H01J37/32
Abstract: A plasma processing system includes a plasma chamber having a substrate support, and a multi-zone gas injection upper electrode disposed opposite the substrate support. An inner plasma region is defined between the upper electrode and the substrate support. The multi-zone gas injection upper electrode has a plurality of concentric gas injection zones. A confinement structure, which surrounds the inner plasma region, has an upper horizontal wall that interfaces with the outer electrode of the upper electrode. The confinement structure has a lower horizontal wall that interfaces with the substrate support, and includes a perforated confinement ring and a vertical wall that extends from the upper horizontal wall to the lower horizontal wall. The lower surface of the upper horizontal wall, an inner surface of the vertical wall, and an upper surface of the lower horizontal wall define a boundary of an outer plasma region, which surrounds the inner plasma region.
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公开(公告)号:US20170332481A1
公开(公告)日:2017-11-16
申请号:US15586203
申请日:2017-05-03
Applicant: Lam Research Corporation
Inventor: Yuma Ohkura , Darrell Ehrlich , Eric A. Pape
Abstract: A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, a heating layer arranged on the baseplate, a ceramic layer arranged on the heating layer, and wiring provided through the baseplate, the heating layer, and into the ceramic layer in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone, across the ceramic layer to a second zone of the plurality of heating zones, and to a heating element in the heating layer in the second zone.
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公开(公告)号:US20150243487A1
公开(公告)日:2015-08-27
申请号:US14710100
申请日:2015-05-12
Applicant: Lam Research Corporation
Inventor: Darrell Ehrlich , Daniel Arthur Brown , Ian Kenworthy
IPC: H01J37/32 , H01L21/3065
CPC classification number: H01J37/32541 , C23C16/4557 , H01J37/32091 , H01J37/3244 , H01J37/32522 , H01L21/3065 , Y10T29/49002 , Y10T29/49083 , Y10T29/49098 , Y10T29/49117 , Y10T29/49803
Abstract: A compression member for use in a showerhead electrode assembly of a capacitively coupled plasma chamber. The member applies a compression force to a portion of a film heater adjacent a power supply boot on an upper surface of a thermal control plate and is located between the thermal control plate and a temperature-controlled top plate. The member is composed of an electrically insulating elastomeric material which can work over a large range of compressions and temperatures.
Abstract translation: 一种用于电容耦合等离子体室的喷头电极组件中的压缩构件。 该构件对与热控制板的上表面相邻的电源罩的薄膜加热器的一部分施加压缩力,并且位于热控制板和温度控制的顶板之间。 该构件由电绝缘的弹性体材料组成,其可在大范围的压缩和温度下工作。
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公开(公告)号:US11967517B2
公开(公告)日:2024-04-23
申请号:US17429434
申请日:2020-01-27
Applicant: LAM RESEARCH CORPORATION
Inventor: Feng Wang , Keith Gaff , Christopher Kimball , Darrell Ehrlich
CPC classification number: H01L21/6833 , C04B37/001 , C04B41/009 , C04B41/4531 , H01J37/32715 , H01J37/32091 , H01J2237/2007
Abstract: An electrostatic chuck for a substrate processing system includes a monolithic body made of ceramic. A plurality of first electrodes are arranged in the monolithic body adjacent to a top surface of the monolithic body and that are configured to selectively receive a chucking signal. A gas channel is formed in the monolithic body and is configured to supply back side gas to the top surface. Coolant channels are formed in the monolithic body and are configured to receive fluid to control a temperature of the monolithic body.
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公开(公告)号:US20220270863A1
公开(公告)日:2022-08-25
申请号:US17671211
申请日:2022-02-14
Applicant: LAM RESEARCH CORPORATION
Inventor: Christopher Kimball , Hema Swaroop Mopidevi , Saravanapriyan Sriraman , Tom A. Kamp , Darrell Ehrlich , Anthony Contreras , Chiara Helena Catherina Giammanco Macpherson
IPC: H01J37/32 , H01L21/687
Abstract: A moveable edge ring system for a plasma processing system includes a top edge ring and a first edge ring arranged below the top edge ring. A second edge ring is made of conductive material and includes an upper portion, a middle portion and a lower portion. The top edge ring and the second edge ring are configured to move in a vertical direction relative to a substrate support and the first edge ring when biased upwardly by a lift pin. The second edge ring is arranged below the top edge ring and radially outside of the first edge ring.
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公开(公告)号:US10667379B2
公开(公告)日:2020-05-26
申请号:US15586203
申请日:2017-05-03
Applicant: Lam Research Corporation
Inventor: Yuma Ohkura , Darrell Ehrlich , Eric A. Pape
IPC: H05B3/03 , H05B3/06 , H05B3/28 , H05K1/11 , H05K3/10 , H05K1/02 , H05K1/03 , H05B3/26 , H01L21/683 , H01L21/67
Abstract: A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, a heating layer arranged on the baseplate, a ceramic layer arranged on the heating layer, and wiring provided through the baseplate, the heating layer, and into the ceramic layer in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone, across the ceramic layer to a second zone of the plurality of heating zones, and to a heating element in the heating layer in the second zone.
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公开(公告)号:US09922804B2
公开(公告)日:2018-03-20
申请号:US14710100
申请日:2015-05-12
Applicant: Lam Research Corporation
Inventor: Darrell Ehrlich , Daniel Arthur Brown , Ian Kenworthy
IPC: H01J37/32 , H01L21/3065 , C23C16/455
CPC classification number: H01J37/32541 , C23C16/4557 , H01J37/32091 , H01J37/3244 , H01J37/32522 , H01L21/3065 , Y10T29/49002 , Y10T29/49083 , Y10T29/49098 , Y10T29/49117 , Y10T29/49803
Abstract: A compression member for use in a showerhead electrode assembly of a capacitively coupled plasma chamber. The member applies a compression force to a portion of a film heater adjacent a power supply boot on an upper surface of a thermal control plate and is located between the thermal control plate and a temperature-controlled top plate. The member is composed of an electrically insulating elastomeric material which can work over a large range of compressions and temperatures.
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公开(公告)号:US20170098564A1
公开(公告)日:2017-04-06
申请号:US14874991
申请日:2015-10-05
Applicant: Lam Research Corporation
Inventor: Eric Pape , Darrell Ehrlich , Mike Jing
IPC: H01L21/67 , G01K7/00 , H01L21/673
CPC classification number: H01L21/67248 , G01K1/026 , G01K1/14 , G01K7/00 , H01L21/67103 , H01L21/67109 , H01L21/67346 , H01L21/6833
Abstract: A substrate holder includes a base plate, a bond layer disposed over the base plate, and a ceramic layer disposed over the bond layer. The ceramic layer has a top surface including an area configured to support a substrate. A number of temperature measurement electrical devices are attached to the ceramic layer. Electrically conductive traces are embedded within the ceramic layer and positioned and routed to electrically connect with one or more of electrical contacts of the number of temperature measurement electrical devices. Electrical wires are disposed to electrically contact the electrically conductive traces. The electrical wires extend from the ceramic layer through the bond layer and through the base plate to a control circuit.
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