公开(公告)号：US20240274517A1

公开(公告)日：2024-08-15

申请号：US18418419

申请日：2024-01-22

Applicant: MEDIATEK INC.

Inventor： Fa-Chuan CHEN ,  Ta-Jen YU ,  Bo-Jiun YANG ,  Tsung-Yu PAN ,  Tai-Yu CHEN ,  Nai-Wei LIU ,  Shih-Chin LIN ,  Wen-Sung HSU

IPC: H01L23/498 ,  H01L21/28 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49816 ,  H01L21/28132 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/13 ,  H01L25/0652 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2924/01029 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/351

Abstract: A semiconductor package structure includes a first component, a bonding structure on the first component, a second component connected to the first component, and a copper connector on the second component. The bonding structure includes a copper base on the first component and copper protruding portions on the copper base. The second component is connected to the first component by bonding the copper protruding portions to the copper connector, and the copper protruding portions are in contact with the copper connector.

公开(公告)号：US20230056550A1

公开(公告)日：2023-02-23

申请号：US18046218

申请日：2022-10-13

Applicant: MEDIATEK INC.

Inventor： Yen-Yao CHI ,  Nai-Wei LIU ,  Tzu-Hung LIN

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01Q1/22 ,  H01Q1/38

Abstract: An electronic device that has an antenna device that includes a conductive pattern layer comprising a first antenna element, the conductive pattern layer formed in an insulating substrate and adjacent to a first surface of the insulating substrate, and a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The electronic device further has a semiconductor package that includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer, a first electronic component electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first electronic component.

公开(公告)号：US20220336374A1

公开(公告)日：2022-10-20

申请号：US17810625

申请日：2022-07-04

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung LIN ,  Chia-Cheng CHANG ,  I-Hsuan PENG ,  Nai-Wei LIU

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/043 ,  H01L23/13 ,  H01L23/538

Abstract: A semiconductor package structure includes a substrate having a wiring structure. A first semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure. A second semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure, wherein the first semiconductor die and the second semiconductor die are arranged side-by-side. A hole is formed on a surface of the substrate, wherein the hole is located within projection of the first semiconductor die or the second semiconductor die on the substrate. Further, a molding material, surrounding the first semiconductor die and the second semiconductor die, and surfaces of the first semiconductor die and the second semiconductor die facing away from the substrate, are exposed by the molding material.

公开(公告)号：US20200312732A1

公开(公告)日：2020-10-01

申请号：US16903458

申请日：2020-06-17

Applicant: MEDIATEK INC.

Inventor： Yen-Yao CHI ,  Nai-Wei LIU ,  Ta-Jen YU ,  Tzu-Hung LIN ,  Wen-Sung HSU ,  Shih-Chin LIN

IPC: H01L23/31 ,  H01L23/29 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor package structure includes a semiconductor die, a redistribution layer (RDL) structure, a protective insulating layer, and a conductive structure. The semiconductor die has a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. The RDL structure is on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The protective insulating layer covers the RDL structure, the second surface and the third surface of the semiconductor die. The conductive structure passes through the protective insulating layer and is electrically coupled to the RDL structure.

公开(公告)号：US20190131233A1

公开(公告)日：2019-05-02

申请号：US16232129

申请日：2018-12-26

Applicant: MEDIATEK INC.

Inventor： Nai-Wei LIU ,  Tzu-Hung LIN ,  I-Hsuan PENG ,  Che-Hung KUO ,  Che-Ya CHOU ,  Wei-Che HUANG

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor package assembly includes a redistribution layer (RDL) structure, which RDL structure includes a conductive trace. A redistribution layer (RDL) contact pad is electrically coupled to the conductive trace, and the RDL contact pad is composed of a symmetrical portion and an extended wing portion connected to the symmetrical portion. The RDL structure includes a first region for a semiconductor die to be disposed thereon and a second region surrounding the first region, and the extended wing portion of the RDL contact pad is offset from a center of the first region.

公开(公告)号：US20180269164A1

公开(公告)日：2018-09-20

申请号：US15906098

申请日：2018-02-27

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung LIN ,  Chia-Cheng CHANG ,  I-Hsuan PENG ,  Nai-Wei LIU

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/043 ,  H01L23/31 ,  H01L25/065

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate having a first surface and a second surface opposite thereto. The substrate includes a wiring structure. The semiconductor package structure also includes a first semiconductor die disposed over the first surface of the substrate and electrically coupled to the wiring structure. The semiconductor package structure further includes a second semiconductor die disposed over the first surface of the substrate and electrically coupled to the wiring structure. The first semiconductor die and the second semiconductor die are separated by a molding material. In addition, the semiconductor package structure includes a first hole and a second hole formed on the second surface of the substrate.

公开(公告)号：US20170141041A1

公开(公告)日：2017-05-18

申请号：US15338652

申请日：2016-10-31

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung LIN ,  Nai-Wei LIU ,  I-Hsuan PENG ,  Wei-Che HUANG

IPC: H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L23/31

Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a redistribution layer (RDL) structure having a first surface and a second surface opposite to the first substrate. The RDL structure includes a redistribution layer (RDL) contact pad arranged close to the second surface. A passivation layer is disposed on the RDL contact pad. The passivation layer has an opening corresponding to the RDL contact pad such that the RDL contact pad is exposed to the opening. A first distance between a first position of the opening and a central point of the opening is different from a second distance between a second position of the opening and the central point of the opening in a plan view.

公开(公告)号：US20170040266A1

公开(公告)日：2017-02-09

申请号：US15331016

申请日：2016-10-21

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung LIN ,  I-Hsuan PENG ,  Nai-Wei LIU ,  Wei-Che HUANG ,  Che-Ya CHOU

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1421 ,  H01L2924/1435 ,  H01L2924/1438 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025

Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first redistribution layer (RDL) structure having a first surface and a second surface opposite to the first substrate. The first RDL structure includes a plurality of first conductive traces close to the first surface of the first RDL structure. An antenna pattern is disposed close to the second surface of the first RDL structure. A first semiconductor die is disposed on the first surface of the first RDL structure and electrically coupled to the first RDL structure. A plurality of conductive structures is disposed on the first surface of the first RDL structure and electrically coupled to the first RDL structure. The plurality of conductive structures is spaced apart from the antenna pattern through the plurality of first conductive traces of the first RDL structure.

Abstract translation: 本发明提供一种半导体封装组件。 半导体封装组件包括第一半导体封装，其包括具有第一表面和与第一基板相对的第二表面的第一再分布层（RDL）结构。 第一RDL结构包括靠近第一RDL结构的第一表面的多个第一导电迹线。 天线图案靠近第一RDL结构的第二表面设置。 第一半导体管芯设置在第一RDL结构的第一表面上并电耦合到第一RDL结构。 多个导电结构设置在第一RDL结构的第一表面上并电耦合到第一RDL结构。 多个导电结构通过第一RDL结构的多个第一导电迹线与天线图案间隔开。

公开(公告)号：US20240297120A1

公开(公告)日：2024-09-05

申请号：US18407783

申请日：2024-01-09

Applicant: MEDIATEK INC.

Inventor： Wei-Yu CHEN ,  Yi-Lin TSAI ,  Nai-Wei LIU ,  Shih-Chin LIN ,  Wen-Sung HSU

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H01L25/16

CPC classification number: H01L23/5381 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19011 ,  H01L2924/19106

Abstract: A semiconductor package structure includes a first redistribution layer, a first semiconductor die, a second semiconductor die, a bridge structure, and a plurality of conductive bumps. The first semiconductor die and the second semiconductor die are disposed over the first redistribution layer. The bridge structure is disposed under the first redistribution layer. The first semiconductor die is electrically coupled to the second semiconductor die through the first redistribution layer and the bridge structure. The conductive bumps are disposed under the first redistribution layer and are coupled to the first redistribution layer. The bridge structure is disposed between at least two of the conductive bumps.

公开(公告)号：US20240178112A1

公开(公告)日：2024-05-30

申请号：US18388275

申请日：2023-11-09

Applicant: MEDIATEK INC.

Inventor： Yu-Tung CHEN ,  Kuo-Lung FAN ,  Yen-Yao CHI ,  Nai-Wei LIU ,  Pei-Haw TSAO

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/532

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/49838 ,  H01L23/53238 ,  H01L23/53266

Abstract: A semiconductor package structure includes a semiconductor substrate, a conductive pad on the semiconductor substrate, and a passivation layer on the semiconductor substrate and the conductive pad. The passivation layer exposes a portion of the top surface of the conductive pad. The semiconductor package structure also includes a conductive adhesive layer on the conductive pad, and a dielectric layer on the passivation layer and the conductive adhesive layer. The dielectric layer exposes a portion of the conductive adhesive layer. The semiconductor package structure also includes a redistribution layer (RDL) structure on the dielectric layer and electrically connected to the conductive pad through the conductive adhesive layer. The semiconductor package structure also includes a bump structure over the RDL structure.