摘要:
Provided is a method for producing a Group III nitride-based compound semiconductor having an M-plane main surface. The method employs a sapphire substrate having a main surface which is inclined by 30° with respect to R-plane about a line of intersection Lsapph-AM formed by R-plane and A-plane perpendicular thereto. R-plane surfaces of the sapphire substrate are exposed, and a silicon dioxide mask is formed on the main surface of the substrate. AlN buffer layers are formed on the exposed R-plane surfaces. A GaN layer is formed on the AlN buffer layers. At an initial stage of GaN growth, the top surface of the sapphire substrate is entirely covered with the GaN layer through lateral growth. The GaN layer is grown so that the a-axis of the layer is perpendicular to the exposed R-plane surfaces of the sapphire substrate; the c-axis of the layer is parallel to the axis direction Lsapph-AM of the sapphire substrate; and the m-axis of the layer, which is inclined by 30° from the a-axis thereof, is perpendicular to the main surface (inclined by 30° from the exposed R-plane surfaces) of the sapphire substrate.
摘要:
A planetary mixer which is used for production steps of various products in chemistry, medical treatment, electronics, ceramics, medicines, foods, feed and the like, and in which flame-shaped stirring blades are allowed to perform planetary motion in a tank, by which solid/liquid type treatment materials are subjected to stirring, blending, mixing/kneading, kneading or the like and it is intended to prevent adhesion of materials to a vertical side portion of the flame-shaped stirring blades.The vertical side portion 22 of the frame-shaped stirring blades 20 is constituted to have a cross-sectional configuration which has two slope faces 25, 26 slanting toward an inner wall of the tank, an edge face 29 connecting outward front ends 28 of the slope faces, and an arcuate inner face 30 connecting inward front ends 27 of the slope faces. The inward front ends are located far apart from the inner wall of the tank and the outward front ends are located near the inner wall of the tank, in which the distance between the inward front ends is broad and the distance between the outward front ends is narrow. Since the inner face 30 of the vertical side portion is formed into an arcuate configuration, the materials can flow without backwater, and adhesion and fixing thereof can be prevented.
摘要:
A semiconductor laser 101 comprises a sapphire substrate 1, an AlN buffer layer 2, Si-doped GaN n-layer 3, Si-doped Al0.1Ga0.9N n-cladding layer 4, Si-doped GaN n-guide layer 5, an active layer 6 having multiple quantum well (MQW) structure in which about 35 Å in thickness of GaN barrier layer 62 and about 35 Å in thickness of Ga0.95In0.05N well layer 61 are laminated alternately, Mg-doped GaN p-guide layer 7, Mg-doped Al0.1Ga0.9N p-cladding layer 8, and Mg-doped GaN p-contact layer 9 are formed successively thereon. A ridged hole injection part B which contacts to a ridged resonator part A is formed to have the same width as the width w of an Ni electrode 10. Holes transmitted from the Ni electrode 10 are injected to the active layer 6 with high current density, and electric current threshold for laser oscillation can be decreased. Electric current threshold can be improved more effectively by forming also the p-guide layer 7 to have the same width as the width w of the Ni electrode 10.
摘要翻译:半导体激光器101包括蓝宝石衬底1,AlN缓冲层2,掺杂Si的GaN n层3,掺杂Si的Al 0.1 Ga 0.9 N n包层4,掺杂Si的GaN n引导层5, 具有多个量子阱(MQW)结构的有源层6,其中厚度约为35的GaN阻挡层62和约35厚度的Ga0.95In0.05N阱层61交替层叠,掺杂Mg的GaN p引导层 如图7所示,依次形成Mg掺杂的Al 0.1 Ga 0.9 N p包覆层8和Mg掺杂的GaN p接触层9。 与脊状谐振器部件A接触的脊状空穴注入部分B形成为具有与Ni电极10的宽度w相同的宽度。从Ni电极10传输的孔以高电流密度注入到有源层6中, 可以降低激光振荡的电流阈值。 也可以通过将p导向层7形成为具有与Ni电极10的宽度w相同的宽度来更有效地提高电流阈值。
摘要:
A monolithic refractory depositing system capable of improving working environment and working efficiency and of spraying a material in a uniform thickness is provided. The monolithic refractory depositing system is capable of carrying out both a spraying process and a casting process. The monolithic refractory depositing system comprises a carriage (4) placed on rails (2) laid near a molten metal container (ladle) (1) so as to travel along the rails (2), a truck (7) capable of moving in directions perpendicular to the moving directions of the carriage (4), a post (8) set up on the traverse truck (7), an elevating frame (10) mounted for vertical movement on the traverse truck (7), a material feed pipe (9) inserted in an upper part of the elevating frame (10) and a spray nozzle (27) (or a pouring pipe (39)) detachably connected to a lower end of the material feed pipe (9), and a bendable support means (20) capable of moving together with the elevating frame (10) and connected to a part of the material feed pipe (9) on an upper side of the elevating frame (10).
摘要:
As a method for manufacturing a laser diode using a group III nitride compound semiconductor, independent dry etching process for forming electrodes and mirror facets are adopted. A portion of an upper semiconductor layer is etched for forming a window. An electrode for a lower semiconductor layer is formed through the window. After electrodes are formed, then, etching is carried out for forming mirror facets of laser cavity. This method realizes high oscillation, because the method enhances parallel and vertical degrees of the mirror facets. Further, cleanness of the mirror facets are improved, because they are formed after the electrodes are formed. The method further lowers resistivity of lower semiconductor layer, because its thickness can be controlled easily without etching excessively. As a result, luminous efficiency is improved.
摘要:
A planetary mixer has stirring blades that undergo planetary motion within a tank in close proximity to an inner wall of the tank for stirring solid/liquid type treatment materials received by the tank. Each of the stirring blades includes a vertical side portion having two slope faces slanting toward the inner wall of the tank, an edge face connecting outward front ends of the slope faces, and an inner face connecting inward front ends of the slope faces. The outward front ends are disposed closer to the tank inner wall than are the inward front ends, with a distance between the inward front ends being greater than a distance between the outward front ends. The inner face is formed in the shape of an arc having a center located at an intersection of a line interconnecting the inward front ends and centerline running through a center of the edge face.
摘要:
A first Group III nitride compound semiconductor layer 31 is etched, to thereby form an island-like structure such as a dot-like, stripe-shaped, or grid-like structure, so as to provide a trench/mesa such that layer different from the first Group III nitride compound semiconductor layer 31 is exposed at the bottom portion of the trench. Thus, a second Group III nitride compound layer 32 can be epitaxially grown, laterally, with a top surface of the mesa and a sidewall/sidewalls of the trench serving as a nucleus, to thereby bury the trench and also grow the layer in the vertical direction. In this case, propagation of threading dislocations contained in the first Group III nitride compound semiconductor layer 31 can be prevented in the upper portion of the second Group III nitride compound semiconductor 32 that is formed through lateral epitaxial growth. Etching may be performed until a cavity portion is provided in the substrate. The layer serving as a nucleus of ELO may be doped with indium (In) having an atomic radius greater than that of gallium (Ga) serving as a predominant element. The first semiconductor layer may be a multi-component layer containing a plurality of numbers of repetitions of a unit of a buffer layer and a single-crystal layer.
摘要:
A seed layer as a laminate of a GaN layer (second seed layer) and an AlN buffer layer (first seed layer) is formed on a sapphire substrate. A front surface thereof is etched in the form of stripes with a stripe width (seed width) of about 5 μm, a wing width of about 15 μm and a depth of about 0.5 μm. As a result, mesa portions each shaped like nearly a rectangle in sectional view are formed. Non-etched portions each having the seed multilayer as its flat top portion are arranged at arrangement intervals of L≈20 μm. Part of the sapphire substrate is exposed in trough portions of wings. The ratio S/W of the seed width to the wing width is preferably selected to be in a range of from about ⅓ to about ⅕. Then, a semiconductor crystal A is grown to obtain a thickness of not smaller than 50 μm. The semiconductor crystal is separated from the starting substrate to thereby obtain a high-quality single crystal independent of the starting substrate. When a halide vapor phase epitaxy method is used in the condition that the V/III ratio is selected to be in a range of from 30 to 80, both inclusively, a semiconductor crystal free from cracks can be obtained.
摘要:
The present invention provides a Group III nitride compound semiconductor with suppressed generation of threading dislocations. A GaN layer 31 is subjected to etching, so as to form an island-like structure having a shape of, for example, dot, strip, or grid, thereby providing a trench/mesa structure, and a mask 4 is formed at the bottom of the trench such that the upper surface of the mask 4 is positioned below the top surface of the GaN layer 31. A GaN layer 32 is lateral-epitaxially grown with the top surface 31a of the mesa and sidewalls 31b of the trench serving as nuclei, to thereby bury the trench, and then epitaxial growth is effected in the vertical direction. In the upper region of the GaN layer 32 formed above the mask 4 through lateral epitaxial growth, propagation of threading dislocations contained in the GaN layer is 31 can be prevented.
摘要:
A method for manufacturing a laser diode using Group III nitride compound semiconductor comprising a buffer layer 2, an n+ layer 3, a cladding layer 4, an active layer 5, a p-type cladding layer 61, a contact layer 62, an SiO2 layer 9, an electrode 7 which is formed on the window formed in a portion of the SiO2 layer 9, and an electrode 8 which is formed on a portion of the n+ layer 3 by etching a portion of 4 layers from the contact layer 62 down to the cladding layer 4. One pair of opposite facets S of a cavity is formed by RIBE, and then the facets are etched by gas cluster ion beam etching using Ar gas. As a result, the facets S are flatted and the mirror reflection of the facets S is improved.