PRODUCTION OF SPHEROIDAL METAL PARTICLES
    15.
    发明申请
    PRODUCTION OF SPHEROIDAL METAL PARTICLES 审中-公开
    生产金属颗粒

    公开(公告)号:US20120195786A1

    公开(公告)日:2012-08-02

    申请号:US13203145

    申请日:2010-02-25

    CPC classification number: C22C23/00 B22F1/0048 B22F9/08 B22F2009/0896

    Abstract: An apparatus and method for producing spheroidal metal particles having high size and shape uniformity from a melt from a highly reactive metal melt, with the following steps: melting the metal starting material under a hermetic seal; transporting the metal melt in a closed granulating tube from the melting furnace to at least one melt outlet; discharging the metal from the metal outlet via a rotary plate in the form of discrete drops to a melt stream which disintegrates into drops by the time it strikes the rotary plate; conducting a shielding gas flow into the region of the melt exiting from the melt outlet, collecting the melt on the rotary plate in the form of discrete melt drop, solidifying the melt drops into granule particles by contact with the colder surface of the rotary plate, and conducting the granule particles off the rotary plate for packaging/further processing.

    Abstract translation: 一种用于从高反应性金属熔体的熔体制备具有高尺寸和形状均匀性的球形金属颗粒的装置和方法,其具有以下步骤:在气密密封下熔化金属原料; 将密闭的造粒管中的金属熔体从熔化炉输送到至少一个熔体出口; 通过离散液滴形式的旋转板从金属出口将金属从金属出口排出到在撞击旋转板时分解成液滴的熔体流; 将保护气体流入从熔体出口排出的熔体区域中,以分散的熔滴的形式收集旋转板上的熔体,通过与旋转板的较冷的表面接触将熔滴固化成颗粒, 并将颗粒颗粒从旋转板上排出以进行包装/进一步处理。

    Systems structures and materials for electronic device cooling
    19.
    发明授权
    Systems structures and materials for electronic device cooling 有权
    用于电子设备冷却的系统结构和材料

    公开(公告)号:US08587945B1

    公开(公告)日:2013-11-19

    申请号:US13559739

    申请日:2012-07-27

    Abstract: An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

    Abstract translation: 具有在运行中产生热量的一个或多个部件的电子设备包括用于温度管理和散热的结构。 用于温度管理和散热的结构包括具有与周围环境热连通的表面的传热基板和与电子设备的一个或多个部件的至少一部分物理接触的温度管理材料, 至少一部分传热基板。 温度管理材料包括具有至少5焦耳/克的潜热和0℃至100℃之间的转变温度和导热填料的聚合物相变材料。

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