Abstract:
A light emitting device includes a support member having a mounting surface. The support member includes an insulating member having top surface and a plurality of side surfaces, a first metal pattern disposed on the top surface of the insulating member, and a second metal pattern disposed on the side surface of the insulating member such that a side surface of the second metal pattern is continuous with a top surface of the first metal pattern. The light emitting device further includes a light emitting element mounted on the mounting surface at a location of the first metal pattern, and a bonding member that bonds the light emitting element to the mounting surface. The bonding member covers at least a portion of the first metal pattern and at least a portion of the second metal pattern.
Abstract:
A light emitting device includes a support member having a mounting surface. The support member includes an insulating member having top surface and a plurality of side surfaces, a first metal pattern disposed on the top surface of the insulating member, and a second metal pattern disposed on the side surface of the insulating member such that a side surface of the second metal pattern is continuous with a top surface of the first metal pattern. The light emitting device further includes a light emitting element mounted on the mounting surface at a location of the first metal pattern, and a bonding member that bonds the light emitting element to the mounting surface. The bonding member covers at least a portion of the first metal pattern and at least a portion of the second metal pattern.
Abstract:
A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).
Abstract:
A light emitting device includes a substrate; a light emitting element mounted on an upper surface of the substrate; a light-reflecting member surrounding lateral surfaces of the light emitting element; and a sealing member disposed over an upper surface of the light emitting element and an upper surface of the light-reflecting member. An outer edge of the upper surface of the light-reflecting member coincides with an outer edge of a lower surface of the sealing member.
Abstract:
A light emitting device includes: a substrate having a base body and a plurality of wiring parts provided on at least one side of the base body; a first covering part that covers part of the wiring parts; a plurality of light emitting elements that are disposed on the wiring parts exposed from the first covering part; a second covering part that is disposed on the first covering part surrounding the light emitting elements and is formed from a material whose reflectivity is higher than that of the first covering part, and a resin component that seals the substrate and the light emitting elements, and is disposed in contact with the first covering part and the second covering part.
Abstract:
A light emitting device includes a substrate member having a flexible base member, a plurality of wiring portions disposed on the base member, and a covering layer covering the wiring portions and having openings exposing a part of wiring portions, a plurality of light emitting elements electrically connected to the wiring portions, and a plurality of sealing members sealing the plurality of light emitting elements, respectively. The light emitting device has a weight of 1 g/cm2 or less.
Abstract translation:发光装置包括具有柔性基底构件的基板构件,设置在基底构件上的多个布线部分和覆盖布线部分并且具有露出布线部分的一部分的开口的覆盖层,多个发光元件电 连接到所述布线部分,以及分别密封所述多个发光元件的多个密封构件。 发光装置的重量为1g / cm 2以下。
Abstract:
A light emitting device includes a substrate, a light emitting element, a first resin member and a second resin member. The substrate includes a base member, a plurality of wiring portions disposed on a surface of the base member, and a covering layer covering the wiring portions with an opening formed in a part of the covering layer. The light emitting element is arranged on the substrate in the opening of the covering layer and having an upper surface at a position higher than the covering layer. The first resin member is arranged at least in the opening of the covering layer and at periphery of the light emitting element. The second resin member seals the substrate and the light emitting element. The second resin member is disposed in contact with the first resin member.