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    Suspension board with circuit
    12.
    发明授权
    Suspension board with circuit 有权
    悬挂板带电路

    公开(公告)号：US09502058B2

    公开(公告)日：2016-11-22

    申请号：US14878319

    申请日：2015-10-08

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yoshito Fujimura ,  Hiroyuki Tanabe ,  Saori Kanezaki ,  Naohiro Terada ,  Yuu Sugimoto

    IPC: G11B5/48

    CPC classification number: G11B5/4853 ,  G11B5/4826 ,  G11B5/484

    Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.

    Abstract translation: 具有电路的悬挂板包括金属支撑层，在其一个厚度方向上的绝缘基底层，设置在绝缘基底层上的导电图案，设置在绝缘基底层上以覆盖导电性的绝缘覆盖层 图案，以及用于支撑包括薄基座部分的滑块的基座。 薄基座部分包括基底绝缘层中包括的基座基层，包括在基座基层上的导电图案中的基座导电层，以及包括在绝缘覆盖层中并设置在基座导电 层。 导电图案包括放置成在具有较窄部分的绝缘基底层上延伸的第一线，并且基座导电层的尺寸为较窄部分的尺寸的0.5至3倍。

    Production method of wired circuit board
    14.
    发明授权
    Production method of wired circuit board 有权

    公开(公告)号：US10558121B2

    公开(公告)日：2020-02-11

    申请号：US15605259

    申请日：2017-05-25

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yuu Sugimoto ,  Hiroyuki Tanabe ,  Yoshito Fujimura

    IPC: G03F7/20 ,  G03F1/38 ,  G03F7/039 ,  G03F7/26 ,  G03F7/38 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18

    Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.

    Wired circuit board and producing method thereof
    15.
    发明授权
    Wired circuit board and producing method thereof 有权

    公开(公告)号：US10257926B2

    公开(公告)日：2019-04-09

    申请号：US15463538

    申请日：2017-03-20

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yuu Sugimoto ,  Yoshito Fujimura ,  Hiroyuki Tanabe

    IPC: H05K1/02 ,  H05K1/05 ,  H05K3/06 ,  H05K3/46 ,  H05K3/00 ,  H05K3/10

    Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

    Printed circuit board and method of manufacturing the same
    16.
    发明授权
    Printed circuit board and method of manufacturing the same 有权

    公开(公告)号：US10154579B2

    公开(公告)日：2018-12-11

    申请号：US15597686

    申请日：2017-05-17

    Applicant: Nitto Denko Corporation

    Inventor： Daisuke Yamauchi ,  Hiroyuki Tanabe

    IPC: H05K1/02 ,  H05K1/05 ,  H05K1/09 ,  H05K3/46 ,  H05K1/11 ,  G11B5/48 ,  H05K1/18

    Abstract: A first insulating layer is formed on a support substrate. The first insulating layer includes a first portion and a second portion. The second portion has a thickness smaller than that of the first portion. A ground layer having electric conductivity higher than that of the support substrate is formed on the second portion of the first insulating layer. The ground layer is electrically connected to the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer. A write wiring trace is formed on the second insulating layer to overlap with the first portion and the second portion of the first insulating layer.

    Producing method of suspension board with circuit
    17.
    发明授权
    Producing method of suspension board with circuit 有权

    公开(公告)号：US09693467B2

    公开(公告)日：2017-06-27

    申请号：US14558070

    申请日：2014-12-02

    Applicant: NITTO DENKO CORPORATION

    Inventor： Hiroyuki Tanabe ,  Hitoki Kanagawa

    IPC: H05K3/46 ,  C25D5/02 ,  G11B5/48 ,  H05K3/44 ,  H05K1/05

    CPC classification number: H05K3/4661 ,  C25D5/02 ,  G11B5/4873 ,  H05K1/056 ,  H05K3/44

    Abstract: A method for producing a suspension board with circuit includes the steps of (7) removing a first electroless plating layer corresponding to a first terminal and/or a second electroless plating layer corresponding to a second terminal by etching, (8) removing a metal supporting board in contact with the lower surface of a first conductive layer filling the inside of a first opening portion, and (9) providing an electrolytic plating layer on the surface of the first terminal with the first electroless plating layer removed and/or the surface of the second terminal with the second electroless plating layer removed and the lower surface of the first conductive layer exposed from the inside of the first opening portion by electrolytic plating supplying electricity from the metal supporting board.

    Wired circuit board and producing method thereof
    18.
    发明授权
    Wired circuit board and producing method thereof 有权
    有线电路板及其制造方法

    公开(公告)号：US09538639B2

    公开(公告)日：2017-01-03

    申请号：US14619508

    申请日：2015-02-11

    Applicant: NITTO DENKO CORPORATION

    Inventor： Hiroyuki Tanabe

    IPC: H05K1/02 ,  G11B5/48 ,  H05K1/05 ,  H05K3/24 ,  G11B5/00

    CPC classification number: H05K1/0266 ,  G11B5/484 ,  G11B5/4853 ,  G11B2005/0021 ,  H05K1/0269 ,  H05K1/056 ,  H05K3/244 ,  Y10T29/49128

    Abstract: A wired circuit board includes a first insulating layer, a first conductive layer provided over the first insulating film and including a first wire, a second insulating layer provided over the first insulating layer so as to cover the first wire, and a second conductive layer provided over the second insulating layer and including a second wire. The second conductive layer includes a first terminal portion for electrically connecting the first wire to an outside, a second terminal portion for electrically connecting the second wire to an outside, and a connection portion electrically connecting the first terminal portion and the first wire.

    Abstract translation: 布线电路板包括：第一绝缘层，设置在第一绝缘膜上并包括第一布线的第一导电层，设置在第一绝缘层上以覆盖第一布线的第二绝缘层;以及第二导电层， 并且包括第二导线。 第二导电层包括用于将第一线电连接到外部的第一端子部分，用于将第二线缆电连接到外部的第二端子部分和将第一端子部分和第一线路电连接的连接部分。

    Wired circuit board and producing method thereof
    20.
    发明授权
    Wired circuit board and producing method thereof 有权

    公开(公告)号：US11026334B2

    公开(公告)日：2021-06-01

    申请号：US16860383

    申请日：2020-04-28

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yuu Sugimoto ,  Hiroyuki Tanabe ,  Yoshito Fujimura

    IPC: G11B5/60 ,  H05K3/02 ,  H05K1/02 ,  H05K3/46 ,  H05K3/10

    Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

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