Patent search ap:("Noriyoshi KAWASHIMA" OR "Fumiteru ASAI") AND inv:"Fumiteru ASAI" Page 2

11.

发明申请
VISCOELASTIC BODY AND METHOD FOR MANUFACTURING THE SAME 审中-公开
Title translation: 粘弹体及其制造方法

公开(公告)号：US20120065350A1

公开(公告)日：2012-03-15

申请号：US13223523

申请日：2011-09-01

Applicant: Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI

Inventor： Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI

IPC: C08F283/00

CPC classification number: C08F299/065 , C08G18/672 , C08G18/753 , C08G2170/40 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , C08G18/48

Abstract: The present invention provides a resin material which can be used for a pressure-sensitive adhesive sheet for protecting a semiconductor wafer and the like, does not cause curve (warpage) in the semiconductor wafer when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer in a peeling operation. The resin material shall be a viscoelastic body containing a copolymer of a urethane polymer and an acrylic polymer, which is formed through a monomer having a functional group that can form a urethane bond with a urethane polymer and having an activated carbon double bond that can copolymerize with a (meth)acryloyl group, in one molecule.

Abstract translation: 本发明提供一种可用于保护半导体晶片等的压敏粘合片的树脂材料，当半导体晶片被研磨时，不会导致半导体晶片中的弯曲（翘曲），因此具有优异的随机性图案在研磨操作中具有足够的应力分散性，抑制晶片中的裂纹和晶片边缘的碎裂，并且在剥离操作中不会在晶片的表面上留下粘合剂残留物。树脂材料应为包含聚氨酯聚合物和丙烯酸类聚合物的共聚物的粘弹性体，该共聚物通过具有可与氨基甲酸酯聚合物形成氨基甲酸酯键并具有可共聚的活性炭双键的官能团的单体形成与（甲基）丙烯酰基在一个分子中。

12.

发明申请
FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE 有权
Title translation: 片状薄膜型半导体背面膜

公开(公告)号：US20120025404A1

公开(公告)日：2012-02-02

申请号：US13192068

申请日：2011-07-27

Applicant: Goji SHIGA , Naohide TAKAMOTO , Fumiteru ASAI

Inventor： Goji SHIGA , Naohide TAKAMOTO , Fumiteru ASAI

IPC: H01L23/28 , B32B7/12 , H01L21/56

CPC classification number: H01L23/3164 , C09J163/00 , H01L21/561 , H01L21/6836 , H01L23/3114 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L2221/68327 , H01L2221/68377 , H01L2221/68386 , H01L2223/54433 , H01L2223/54473 , H01L2224/13099 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/73204 , H01L2224/81815 , H01L2224/8191 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01073 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , Y10T428/28 , H01L2924/00014 , H01L2924/01083 , H01L2924/00

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on the back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface having a tensile storage elastic modulus at 25° C. after thermal curing within a range of from 10 GPa to 30 GPa, in which the tensile storage elastic modulus at 25° C. after thermal curing of the film for flip chip type semiconductor back surface falls within a range of from 4 times to 20 times the tensile storage elastic modulus at 25° C. before thermal curing thereof.

Abstract translation: 本发明涉及一种用于倒装芯片型半导体背表面的薄膜，该薄膜形成在与被粘物相连的半导体元件倒装芯片的背面上，该倒装芯片型半导体背表面膜的拉伸储能弹性模量为25 在热固化后在10GPa至30GPa的范围内的热固化温度，其中用于倒装芯片型半导体背表面的膜的热固化后25℃下的拉伸储存弹性模量落在4倍至25℃下的拉伸储存弹性模量的20倍。

13.

发明申请
FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND FLIP CHIP TYPE SEMICONDUCTOR DEVICE 有权
Title translation: 用于倒圆片型半导体背表面的薄膜，用于半导体背面的双面复合薄膜，用于制造半导体器件的方法和片状芯片型半导体器件

公开(公告)号：US20120018902A1

公开(公告)日：2012-01-26

申请号：US13184994

申请日：2011-07-18

Applicant: Naohide TAKAMOTO , Goji SHIGA , Fumiteru ASAI

Inventor： Naohide TAKAMOTO , Goji SHIGA , Fumiteru ASAI

IPC: H01L23/48 , B32B27/20 , C08L71/10 , H01L21/78

CPC classification number: C09J163/00 , H01L2224/16225 , H01L2924/0002 , H01L2924/00

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface containing an inorganic filler in an amount within a range of 70% by weight to 95% by weight based on the whole of the film for flip chip type semiconductor back surface.

Abstract translation: 本发明涉及一种用于倒装芯片型半导体背表面的薄膜，该薄膜形成在与被粘物相连的半导体元件倒装芯片的背面上，所述薄膜半导体背面的薄膜包含无机填料的量基于用于倒装芯片型半导体背表面的整个膜的70重量％至95重量％的范围。

14.

发明申请
ROLLED ADHESIVE TAPE OR SHEET 审中-公开
Title translation: 滚动胶带或薄片

公开(公告)号：US20110244229A1

公开(公告)日：2011-10-06

申请号：US13074361

申请日：2011-03-29

Applicant: Shigeki ISHIGURO , Takumi YUTOU , Hiroki SENDA , Masamichi MATSUMOTO , Kenichi NISHIJIMA , Toshitaka SUZUKI , Fumiteru ASAI , Isamu MIYOSHI , Michihito OOISHI , Toshimasa SUGIMURA

Inventor： Shigeki ISHIGURO , Takumi YUTOU , Hiroki SENDA , Masamichi MATSUMOTO , Kenichi NISHIJIMA , Toshitaka SUZUKI , Fumiteru ASAI , Isamu MIYOSHI , Michihito OOISHI , Toshimasa SUGIMURA

IPC: C09J7/02 , C09J11/06 , C09J133/08

CPC classification number: C09J133/10 , C08K5/20 , C09J7/22 , C09J7/245 , C09J7/38 , C09J133/08 , C09J2205/102 , C09J2205/106 , C09J2427/00 , C09J2433/00 , Y10T428/28 , Y10T428/2852 , Y10T428/2891 , C08L27/06

Abstract: A rolled adhesive tape or sheet which is wound in a rolled configuration having; a thermoplastic resin film, and a pressure sensitive adhesive layer formed on one side of the thermoplastic resin film, a fatty acid bisamide as well as a fatty acid monoamide and/or fatty acid are contained at least one of the thermoplastic resin film and the pressure sensitive adhesive layer.

Abstract translation: 以卷绕构造卷绕的卷状粘合带或片材具有：热塑性树脂膜和形成在热塑性树脂膜，脂肪酸双酰胺以及脂肪酸单酰胺和/或脂肪酸的一面上的压敏粘合剂层包含至少一种热塑性树脂膜和压力敏感层。

15.

发明申请
RE-PEELABLE ADHESIVE SHEET 审中-公开
Title translation: 可再生胶粘剂

公开(公告)号：US20110097576A1

公开(公告)日：2011-04-28

申请号：US12908626

申请日：2010-10-20

Applicant: Takashi HABU , Fumiteru ASAI , Toshio SHINTANI , Takatoshi SASAKI , Kouji MIZUNO

Inventor： Takashi HABU , Fumiteru ASAI , Toshio SHINTANI , Takatoshi SASAKI , Kouji MIZUNO

IPC: B32B33/00 , B32B15/082 , B32B5/00

CPC classification number: B32B27/40 , B32B27/16 , B32B27/281 , B32B27/302 , B32B27/304 , B32B27/32 , B32B27/34 , B32B27/36 , B32B2307/308 , B32B2307/50 , B32B2307/51 , B32B2307/748 , B32B2405/00 , B32B2457/14 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2433/00 , Y10T428/265 , Y10T428/28 , Y10T428/2891

Abstract: A re-peelable adhesive sheet for grinding a semiconductor wafer comprises: a base film, and an adhesive layer laminated on the base film, the re-peelable adhesive sheet has a modulus of elasticity of at least 103 MPa, and a heating shrinkage factor of 1% or less, after heating for 10 minutes to 60° C., and the adhesive layer is set to a thickness at which the maximum point stress is 200 g/cm or less, at a pressing amount of 30 μm from the adhesive layer side in a three-point bend test. The present invention can provide a re-peelable adhesive sheet that can reduce wafer warping, cracking, and edge chipping, that can improve the adhesive force in relation to temperature variations and/or reduce contamination of the adherend when re-peeling, and that can facilitate film re-peel.

Abstract translation: 用于研磨半导体晶片的可再剥离粘合片包括：基膜和层压在基膜上的粘合剂层，可再剥离粘合片的弹性模量至少为103MPa，加热收缩率 1％以下，加热10分钟〜60℃后，将粘合剂层设定为最大点应力为200g / cm以下的厚度，从粘合层30μm的压制量侧面进行三点弯曲试验。本发明可以提供一种能够减少晶片翘曲，开裂和边缘碎裂的可再剥离粘合片，其可以改善相对于温度变化的粘合力和/或减少再剥离时被粘物的污染，并且可以促进胶片再剥离。

16.

发明申请
PRESSURE-SENSITIVE ADHESIVE SHEET FOR LASER PROCESSING AND LASER PROCESSING METHOD 审中-公开
Title translation: 用于激光加工和激光加工方法的压敏粘合片

公开(公告)号：US20100032087A1

公开(公告)日：2010-02-11

申请号：US12482136

申请日：2009-06-10

Applicant: Tomokazu TAKAHASHI , Fumiteru ASAI , Yuki HIGASHIBEPPU

Inventor： Tomokazu TAKAHASHI , Fumiteru ASAI , Yuki HIGASHIBEPPU

IPC: B32B38/00 , B32B27/00 , B32B27/32

CPC classification number: B23K26/18 , B23K26/40 , B23K2101/40 , B23K2103/50 , C09J7/29 , C09J2423/006 , C09J2433/00 , H01L21/67132 , H01L21/78 , Y10T428/263 , Y10T428/264 , Y10T428/265 , Y10T428/28 , Y10T428/2848

Abstract: In performing the laser processing of a workpiece with laser light, there are provided a pressure-sensitive adhesive sheet for laser processing and a laser processing method that can perform the laser processing of a workpiece easily with good production efficiency by preventing the fusion of a substrate and an adsorption stage. According to the invention, an pressure-sensitive adhesive sheet for laser processing that is used for laser processing of a workpiece with laser light having a wavelength in an ultraviolet region or with laser light that enables light absorption in an ultraviolet region that has passed a multiphoton absorption process, comprising a substrate and an pressure-sensitive adhesive layer disposed on one surface of the substrate, wherein a melting point of the substrate at another surface is 80° C. or higher, and an etching rate (etching speed/energy fluence) in a case of radiating the laser light onto the other surface is 0.1 [(μm/pulse)/(J/cm2)] or lower.

Abstract translation: 在用激光进行工件的激光加工时，提供了一种用于激光加工的压敏粘合片和激光加工方法，其可以通过防止基板的熔化而容易地以良好的生产效率对工件进行激光加工和吸附阶段。根据本发明，一种用于激光加工的压敏粘合片，其用于具有在紫外区域中具有波长的激光的工件的激光加工或者通过能够通过多光子的紫外线区域中的光吸收的激光吸收处理，其包括基板和设置在基板的一个表面上的压敏粘合剂层，其中另一表面的基板的熔点为80℃以上，蚀刻速度（蚀刻速度/能量密度）在另一面上照射激光的情况为0.1 [（mum / pulse）/（J / cm 2）]以下。

17.

发明申请
PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROCESSING 审中-公开
Title translation: 压敏粘合片用于加工

公开(公告)号：US20080248296A1

公开(公告)日：2008-10-09

申请号：US11842981

申请日：2007-08-22

Applicant: Toshio SHINTANI , Fumiteru ASAI , Kazuhiko YAMAMOTO

Inventor： Toshio SHINTANI , Fumiteru ASAI , Kazuhiko YAMAMOTO

IPC: B32B7/12

CPC classification number: H01L21/6836 , C08K5/0008 , C08L2312/06 , C09D133/08 , C09J7/50 , C09J2203/326 , C09J2427/006 , C09J2433/001 , H01L2221/68327 , Y10T428/2809

Abstract: The present invention relates to a pressure-sensitive adhesive sheet for processing, which includes a substrate; a pressure-sensitive adhesive layer containing a radiation-polymerizable compound; and an interlayer containing an acrylic polymer having a glass transition temperature of 20° C. or higher as a main component, the interlayer being disposed between the substrate and the pressure-sensitive adhesive layer. The pressure-sensitive adhesive sheet of the invention is excellent in pressure-sensitive adhesive properties, releasability, and expansibility.

Abstract translation: 本发明涉及一种用于加工的压敏粘合片，其包括基底; 含有放射线聚合性化合物的压敏粘合剂层; 以及含有玻璃化转变温度为20℃以上的丙烯酸类聚合物为主要成分的中间层，所述中间层配置在所述基材和所述粘合剂层之间。本发明的粘合片的粘合性，脱模性，膨胀性优异。

18.

发明申请
TAPE FOR HOLDING CHIP, METHOD OF HOLDING CHIP-SHAPED WORKPIECE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING TAPE FOR HOLDING CHIP, AND METHOD OF MANUFACTURING TAPE FOR HOLDING CHIP 审中-公开
Title translation: 用于控股芯片的胶带，保持芯片形成的工件的方法，使用用于控制芯片的带的半导体器件的制造方法以及用于保持芯片的制造带的方法

公开(公告)号：US20120107576A1

公开(公告)日：2012-05-03

申请号：US13347432

申请日：2012-01-10

Applicant: Shuhei MURATA , Takeshi MATSUMURA , Koji MIZUNO , Fumiteru ASAI

Inventor： Shuhei MURATA , Takeshi MATSUMURA , Koji MIZUNO , Fumiteru ASAI

IPC: B32B7/12 , B05D3/06 , B05D3/02 , B05D5/08

CPC classification number: H01L21/67132 , B32B7/12 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2203/326 , H01L24/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/181 , H01L2924/3025 , Y10T428/24331 , Y10T428/24777 , Y10T428/24802 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

Abstract: The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region.

Abstract translation: 本发明的目的在于提供一种用于保持芯片的带状物，其使得片状工件的粘贴和剥离变得容易。用于保持具有在基材上形成压敏粘合剂层的构造的芯片的胶带，其中粘合剂层具有将片状工件粘贴到其上的切屑状工件粘贴区域以及粘贴安装框架的框架粘贴区域，并且通过将安装框架粘贴到框架粘贴区域来使用，其中压敏粘合剂层的180度剥离粘合力到硅镜晶片框状粘贴区域是片状工件粘贴区域的粘合剂层向硅镜面晶片的180度剥离粘合力的5倍以上。