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11.发明申请公开(公告)号：US20160284679A1
公开(公告)日：2016-09-29
申请号：US15036794
申请日：2014-10-23
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Jürgen Moosburger , Markus Pindl , Simon Jerebic , Frank Singer
CPC classification number: H01L25/50 , H01L33/46 , H01L33/483 , H01L33/54 , H01L33/60 , H01L2933/0025 , H01L2933/0033 , H01L2933/0058
Abstract: A method for producing a plurality of optoelectronic semiconductor devices is provided. A number of semiconductor chips are fastened on an auxiliary support. The semiconductor chips are spaced apart from one another in a lateral direction. A reflective layer is formed, at least in regions between the semiconductor chips. A composite package body is formed at least in certain regions between the semiconductor chips. The auxiliary support is removed and the composite housing body is separated into a number of optoelectronic semiconductor devices. Each optoelectronic semiconductor device has at least one semiconductor chip, part of the reflective layer and part of the composite package body as a package body.
Abstract translation: 提供了一种制造多个光电半导体器件的方法。 许多半导体芯片被紧固在辅助支架上。 半导体芯片在横向彼此间隔开。 至少在半导体芯片之间的区域中形成反射层。 至少在半导体芯片之间的某些区域中形成复合封装体。 辅助支撑件被移除并且复合壳体被分离成多个光电子半导体器件。 每个光电半导体器件具有至少一个半导体芯片，反射层的一部分和作为封装体的复合封装体的一部分。
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公开(公告)号：US20150214446A1
公开(公告)日：2015-07-30
申请号：US14410956
申请日：2013-06-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Boss , Markus Pindl , Tobias Gebuhr , Simon Jerebic , Martin Brandl
CPC classification number: H01L33/54 , H01L21/565 , H01L21/78 , H01L23/29 , H01L23/49811 , H01L23/49861 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2933/005 , H01L2924/00014
Abstract: An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.
Abstract translation: 电气部件包括具有通道开口的封闭引线框架，所述通道开口至少设置在通道开口内的电气部件，所述电气部件包括在所述电气部件的一侧上的第一接触焊盘和所述电气部件的第二侧上的第二接触焊盘 其中所述第二侧面向所述第一侧，并且所述第二接触焊盘电耦合到所述引线框架; 以及封装，其将所述电气部件机械耦合到所述引线框架，其中所述引线框架包括在一侧上的凹部，所述凹部从所述引线框架的边缘延伸到所述通道开口，并且将至少一个电连接元件从所述边缘 引导框架布置在通道开口中的部件。
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公开(公告)号：US20190386186A1
公开(公告)日：2019-12-19
申请号：US16485412
申请日：2018-03-01
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Pindl , Simon Jerebic
Abstract: A method for producing optoelectronic semiconductor components is disclosed. In an embodiment a method includes A) applying radiation-emitting semiconductor chips to an intermediate carrier, wherein the semiconductor chips are volume emitters configured to emit radiation at light exit main sides and on chip side surfaces; B) applying a clear potting permeable to the radiation directly onto the chip side surfaces so that the chip side surfaces are predominantly or completely covered by the clear potting and a thickness of the clear potting in each case decreases monotonically in a direction away from the main light exit sides; C) producing a reflection element so that the reflection element and the clear potting touch on an outer side of the clear potting opposite the chip side surfaces; and D) detaching the semiconductor chips from the intermediate carrier and attaching the semiconductor chips to a component carrier so that the light exit main sides of the semiconductor chips face away from the component carrier.
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14.发明授权公开(公告)号：US10217913B2
公开(公告)日：2019-02-26
申请号：US15036413
申请日：2014-10-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Pindl , Thomas Schwarz , Frank Singer , Sandra Sobczyk
IPC: H01L33/54 , H01L33/00 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/50 , H01L33/48 , H01L33/56 , H01L21/56
Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.
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15.发明申请公开(公告)号：US20190036299A1
公开(公告)日：2019-01-31
申请号：US16074925
申请日：2017-02-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Tobias Gebuhr , Markus Pindl
Abstract: A method of producing an optoelectronic lighting device includes providing a laser chip carrier on which two edge emitting laser chips, arranging a carrier including two optical elements onto the laser chip carrier, forming a respective optical connection by an optical material between a respective laser facet and a respective optical element, singulating the two laser chips by dividing the laser chip carrier between the two laser chips to form two mutually divided laser chip carrier parts, wherein the dividing includes dividing the carrier between the two optical elements to form two mutually divided carrier parts each including one of the two optical elements, such that two singulated laser chips arranged on the respective divided laser chip carrier part are formed, the respective laser facets of which are optically connected to the respective optical element of the respective carrier part by the optical material.
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Patent Agency Ranking
公开(公告)号：US20160284943A1
公开(公告)日：2016-09-29
申请号：US15034017
申请日：2014-11-04
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Andreas Gruendl , Tobias Gebuhr , Markus Pindl
CPC classification number: H01L33/483 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: An optoelectronic component includes a housing having a top side, wherein an anchoring structure which is a positive relief is arranged at the top side, a covering element is arranged above the top side and anchored at the anchoring structure, and the covering element completely covers the top side.
Abstract translation: 光电部件包括具有顶侧的壳体，其中在顶侧布置有正浮雕的锚定结构，覆盖元件布置在顶侧上方并锚定在锚定结构处，并且覆盖元件完全覆盖 顶端。
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公开(公告)号：US09209367B2
公开(公告)日：2015-12-08
申请号：US14410956
申请日：2013-06-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Boss , Markus Pindl , Tobias Gebuhr , Simon Jerebic , Martin Brandl
IPC: H01L33/00 , H01L33/54 , H01L33/48 , H01L33/62 , H01L21/56 , H01L21/78 , H01L23/29 , H01L23/498 , H01L33/58
CPC classification number: H01L33/54 , H01L21/565 , H01L21/78 , H01L23/29 , H01L23/49811 , H01L23/49861 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2933/005 , H01L2924/00014
Abstract: An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.
Abstract translation: 电气部件包括具有通道开口的封闭引线框架，所述通道开口至少设置在通道开口内的电气部件，所述电气部件包括在所述电气部件的一侧上的第一接触焊盘和所述电气部件的第二侧上的第二接触焊盘 其中所述第二侧面向所述第一侧，并且所述第二接触焊盘电耦合到所述引线框架; 以及封装，其将所述电气部件机械耦合到所述引线框架，其中所述引线框架包括在一侧上的凹部，所述凹部从所述引线框架的边缘延伸到所述通道开口，并且将至少一个电连接元件从所述边缘 引导框架布置在通道开口中的部件。
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公开(公告)号：US11355896B2
公开(公告)日：2022-06-07
申请号：US16488573
申请日：2018-02-27
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Markus Pindl
Abstract: An optoelectronic component comprising a laser diode is disclosed. In an embodiment an optoelectronic component includes a carrier, a laser diode arranged on the carrier, wherein the laser diode is configured to emit electromagnetic radiation in a lateral radiation and a radiation-guiding layer arrangement located in front of the lateral face of the laser diode, wherein the layer arrangement includes at least a first layer and a second layer, wherein the first layer is arranged on the carrier, wherein the second layer is arranged on the first layer, wherein the first layer and the second layer abut each other, wherein the second layer is transparent for the electromagnetic radiation, wherein the first layer has a smaller refractive index than the second layer, and wherein the layer arrangement is arranged such that the electromagnetic radiation of the laser diode is coupled into the second layer, guided in the second layer to a radiation surface of the second layer, and emitted via the radiation surface of the second layer.
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公开(公告)号：US11158771B2
公开(公告)日：2021-10-26
申请号：US16485412
申请日：2018-03-01
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Pindl , Simon Jerebic
Abstract: A method for producing optoelectronic semiconductor components is disclosed. In an embodiment a method includes A) applying radiation-emitting semiconductor chips to an intermediate carrier, wherein the semiconductor chips are volume emitters configured to emit radiation at light exit main sides and on chip side surfaces; B) applying a clear potting permeable to the radiation directly onto the chip side surfaces so that the chip side surfaces are predominantly or completely covered by the clear potting and a thickness of the clear potting in each case decreases monotonically in a direction away from the main light exit sides; C) producing a reflection element so that the reflection element and the clear potting touch on an outer side of the clear potting opposite the chip side surfaces; and D) detaching the semiconductor chips from the intermediate carrier and attaching the semiconductor chips to a component carrier so that the light exit main sides of the semiconductor chips face away from the component carrier.
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公开(公告)号：US10937933B2
公开(公告)日：2021-03-02
申请号：US16490944
申请日：2018-03-08
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Brandl , Markus Pindl
Abstract: A light-emitting component includes a light-emitting element and a housing with a cavity. The housing includes a housing material that absorbs at least 80 percent of light in the visible range. The cavity is formed by a limiting wall, formed by a housing surface, and a plane of the element. The light-emitting element arranged within the cavity of the housing and positioned above the element plane includes an emission side located opposite to the element plane. The cavity is at least partially filled with a transparent material composed of a first material and a second material, wherein the first material at least partially covers the limiting wall, and the second material at least partially covers the emission side. A boundary surface is formed between the first material and the second material. A first refractive index of the first material is smaller than a second refractive index of the second material.
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