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公开(公告)号：US10944033B2
公开(公告)日：2021-03-09
申请号：US16066552
申请日：2017-01-10
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Luca Haiberger , David Racz , Matthias Sperl
IPC: H01L33/00 , H01L33/62 , H01L31/024 , H01L33/64 , H01L31/0224 , H01L31/02 , H01L33/38 , H01L33/54 , H01L31/0304 , H01L31/0352 , H01L33/06 , H01L33/30
Abstract: An optoelectronic component includes a radiation side, a contact side opposite a radiation side with at least two electrically conductive contact elements for external electrical contacting of the component, and a semiconductor layer sequence arranged between the radiation side and the contact side with an active layer that emits or absorbs electromagnetic radiation during normal operation, wherein the contact elements are spaced apart from each other at the contact side and are completely or partially exposed at the contact side in the unmounted state of the component, the region of the contact side between the contact elements is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K), and in plan view of the contact side the cooling element covers one or both contact elements partially.
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公开(公告)号：US20190237590A1
公开(公告)日：2019-08-01
申请号：US16339523
申请日：2017-10-05
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Dirk Becker , Matthias Sperl
CPC classification number: H01L31/02002 , H01L25/167 , H01L31/16 , H01L33/0025 , H01L33/0095 , H01L33/44 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2933/0033 , H01L2933/0066
Abstract: A sensor includes a printed circuit board; at least one semiconductor chip arranged on the printed circuit board and includes a front-side contact, wherein the semiconductor chip is a radiation-detecting semiconductor chip; an embedding layer arranged on the printed circuit board and laterally adjoining the at least one semiconductor chip; and a contact layer connected to the front-side contact of the at least one semiconductor chip.
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公开(公告)号：US20190157514A1
公开(公告)日：2019-05-23
申请号：US15779310
申请日：2016-11-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Pindl , Matthias Sperl
Abstract: A method of producing an optoelectronic component includes providing a carrier; securing a sheet including a wavelength-converting material on a top side of the carrier; arranging a grid structure on a top side of the sheet; arranging an optoelectronic semiconductor chip in an opening of the grid structure on the top side of the sheet; arranging a potting material on the top side of the sheet, wherein the grid structure and the optoelectronic semiconductor chip are at least partly embedded into the potting material, and a composite body including the potting material, the sheet, the grid structure and the optoelectronic semiconductor chip is formed; and detaching the composite body from the carrier.
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公开(公告)号：US20190148606A1
公开(公告)日：2019-05-16
申请号：US16098172
申请日：2017-05-10
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： David Racz , Matthias Sperl
Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a method includes providing at least one light-emitting semiconductor chip comprising a sapphire substrate and an epitaxially grown layer sequence, arranging the light-emitting semiconductor chip with a side facing away from the sapphire substrate on a carrier, detaching the sapphire substrate from the semiconductor chip, applying a converter element on a region of the semiconductor chip in which the sapphire substrate was detached, arranging the semiconductor chip on an auxiliary carrier so that the converter element faces the auxiliary carrier and detaching the carrier from the semiconductor chip.
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公开(公告)号：US20170323872A1
公开(公告)日：2017-11-09
申请号：US15523812
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Jürgen Moosburger , Matthias Sabathil , Matthias Sperl , Björn Hoxhold
CPC classification number: H01L25/167 , H01L21/565 , H01L23/291 , H01L23/296 , H01L23/3171 , H01L23/3185 , H01L33/20 , H01L33/382 , H01L33/385 , H01L33/387 , H01L33/405 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2933/0025 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein an electrically conductive through contact extends from a top side of the composite body to an underside of the composite body through the molded body, a top side of the optoelectronic semiconductor chip is at least partly not covered by the molded body, the chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, the optoelectronic component includes an upper insulation layer extending over the first top side metallization, and the optoelectronic component includes a second top side metallization arranged above the upper insulation layer and electrically insulated with respect to the first top side metallization by the upper insulation layer.
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Patent Agency Ranking
公开(公告)号：US20170288108A1
公开(公告)日：2017-10-05
申请号：US15507767
申请日：2015-08-31
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Schumann , Tobias Gebuhr , David Racz , Matthias Sperl
CPC classification number: H01L33/62 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2224/05555 , H01L2224/0603 , H01L2224/48091 , H01L2924/00014 , H01L2924/181 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H05K1/18 , H05K3/284 , H05K3/32 , H05K2201/10106 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: An optoelectronic device includes a printed circuit board, and a light source arranged on a surface of the printed circuit board, said light source comprising at least one luminous face formed by at least one light-emitting diode wherein the light-emitting diode is electrically connected to the printed circuit board, wherein the light-emitting diode is at least partly enclosed by molding by a potting compound.
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公开(公告)号：US10978597B2
公开(公告)日：2021-04-13
申请号：US16339523
申请日：2017-10-05
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Dirk Becker , Matthias Sperl
IPC: H01L29/16 , H01L31/02 , H01L25/16 , H01L33/44 , H01L33/48 , H01L33/62 , H01L31/16 , H01L33/00 , H01L33/58
Abstract: A sensor includes a printed circuit board; at least one semiconductor chip arranged on the printed circuit board and includes a front-side contact, wherein the semiconductor chip is a radiation-detecting semiconductor chip; an embedding layer arranged on the printed circuit board and laterally adjoining the at least one semiconductor chip; and a contact layer connected to the front-side contact of the at least one semiconductor chip.
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公开(公告)号：US10580942B2
公开(公告)日：2020-03-03
申请号：US15877270
申请日：2018-01-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Luca Haiberger , Matthias Sperl
Abstract: An electronic component, an optoelectronic component, and a component arrangement are disclosed. In an embodiment the electronic component includes an electronic semiconductor chip and a molded body, wherein the molded body covers at least one side face of the electronic semiconductor chip, wherein a surface of the electronic semiconductor chip is at least partly not covered by the molded body, wherein the molded body includes a first side face with a peg, and wherein the molded body includes a second side face with a groove matching the peg.
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公开(公告)号：US20200018692A1
公开(公告)日：2020-01-16
申请号：US16323504
申请日：2017-08-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Matthias Sperl
IPC: G01N21/3504
Abstract: A detection assembly and a method for producing a detection assemblies are disclosed. In an embodiment a detection arrangement includes an emitter configured to generate radiation having a peak wavelength in an infrared spectral range, a detector configured to receive the radiation, a mounting surface comprising at least a first contact surface and a second contact surface for external electrical connection of the detection arrangement, a form body adjoining the emitter and the detector at least in places and deflection optics, on which the radiation impinges during operation of the detection arrangement so that an optical path is formed between the emitter and the detector by the deflection optics, wherein the deflection optics include a scattering body into which the radiation enters during the operation through a surface of the scattering body facing the emitter.
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20.发明申请公开(公告)号：US20190013451A1
公开(公告)日：2019-01-10
申请号：US16066552
申请日：2017-01-10
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Luca Haiberger , David Racz , Matthias Sperl
IPC: H01L33/62 , H01L33/64 , H01L31/02 , H01L31/024
Abstract: An optoelectronic component includes a radiation side, a contact side opposite a radiation side with at least two electrically conductive contact elements for external electrical contacting of the component, and a semiconductor layer sequence arranged between the radiation side and the contact side with an active layer that emits or absorbs electromagnetic radiation during normal operation, wherein the contact elements are spaced apart from each other at the contact side and are completely or partially exposed at the contact side in the unmounted state of the component, the region of the contact side between the contact elements is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K), and in plan view of the contact side the cooling element covers one or both contact elements partially.
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