Abstract:
A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.
Abstract:
A light-emitting device includes a substrate and a plurality of light-emitting elements disposed above the substrate. In the plurality of light-emitting elements, a first light-emitting element and a second light-emitting element different in a rate of decrease in light output along with a temperature increase are included. The plurality of light-emitting elements include: a first serial element group including some light-emitting elements connected in series among the plurality of light-emitting elements; and a second serial element group connected in parallel with the first serial element group and including some light-emitting elements connected in series among the plurality of light-emitting elements. A ratio between a total number of first light-emitting elements and a total number of second light-emitting elements is different between the first serial element group and the second serial element group.
Abstract:
A light-emitting apparatus includes: a base; a wiring pattern disposed on a major surface of the base; a light-emitting element mounted on the major surface of the base; a metal wire that electrically connects the light-emitting element and the wiring pattern; a light-transmissive film that covers the metal wire, at least a portion of the wiring pattern, and at least a portion of the light-emitting element; and a sealant that covers the light-transmissive film. The light-transmissive film includes a wall portion that is located between the metal wire and the base, and that extends from the major surface of the base to the metal wire.
Abstract:
A lighting apparatus includes an LED chip that emits primary light, and phosphor particles that emit secondary light by being excited with the primary light. The lighting apparatus emits light including the primary light and the secondary light. The light has an emission spectrum having a first peak in a wavelength ranging from 420 nm to 460 nm, a second peak in the wavelength ranging from 530 nm to 580 nm, a third peak in the wavelength ranging from 605 nm to 655 nm, a first trough in the wavelength ranging from 440 nm to 480 nm, and a second trough in the wavelength ranging from 555 nm to 605 nm.
Abstract:
A mounting substrate includes: a substrate; a first terminal, a fifth terminal, and a sixth terminal which are disposed in a first region; a second terminal disposed in a second region; a third terminal and a seventh terminal which are disposed in a third region; and a fourth terminal disposed in a fourth region. The mounting substrate includes: a first connecting line which electrically connects the fifth terminal and the second terminal; a second connecting line which electrically connects the sixth terminal and the third terminal; and a third connecting line which electrically connects the seventh terminal and the fourth terminal.
Abstract:
A light-emitting diode (LED) module is provided. The LED module includes a substrate, a metal layer disposed above the substrate, a resist layer disposed above the substrate and including a plurality of layers, an LED chip mounted above the substrate, and a wire connecting the metal layer and the LED chip. In a first region in which the LED chip is mounted, at least a portion of the resist layer is disposed directly on the substrate with the LED chip being mounted above the resist layer via an adhesive. In a second region which includes a connection at which the wire and the metal layer are connected and a periphery of the connection, the metal layer is disposed above the substrate with the resist layer being disposed above the metal layer.
Abstract:
A light emitting device includes: a substrate; a plurality of light emitting elements mounted in a light emitting area of the substrate, and an intermediate line for electrically connecting a plurality of light emitting elements in parallel or series selectively, the intermediate line being disposed in the light emitting area.
Abstract:
A light-emitting apparatus is provided. The light-emitting apparatus includes a first and second light-emitting elements disposed on a substrate. A sealing layer is above the first and second light-emitting elements for sealing the first and second light-emitting elements. A first phosphor layer is above a first portion of the sealing layer. The first phosphor layer includes at least one first phosphor. A second phosphor layer is above a second portion of the sealing layer. The second phosphor layer includes at least one second phosphor. The first phosphor layer is configured to emit light, which is emitted as a result of emission by the first light-emitting element, having a first color. The second phosphor layer is configured to emit light, which is emitted as a result of emission by the second light-emitting element, having a second color different from the first color.
Abstract:
A light-emitting apparatus includes: a substrate; a plurality of LED chips disposed on the substrate and including a plurality of blue LED chips which emit blue light and a plurality of red LED chips which emit red light; and a sealing member that contains a yellow phosphor and seals the plurality of LED chips together. The plurality of LED chips include: a first LED chip group made up of the blue LED chips; a second LED chip group made up of the red LED chips and disposed around the first LED chip group in an annular shape centered on an optical axis; and a third LED chip group made up of the blue LED chips and disposed around the second LED chip group in an annular shape centered on the optical axis.
Abstract:
A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.