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公开(公告)号：US20180061519A1
公开(公告)日：2018-03-01
申请号：US15692492
申请日：2017-08-31
Inventor： Takatoshi ABE , Tomoaki SAWADA
CPC classification number: H01B1/125 , C08F12/08 , C08F20/14 , C08F20/44 , C08F2500/01 , C08K3/08 , C08K9/06 , C08K2003/0806 , C08K2201/001 , C08L33/14
Abstract: The present invention relates to a conductive resin composition comprising, as essential components, a resin (A), a curing agent (B) reacting with the resin (A), and a conductive filler (C), wherein the resin (A) has a functional group, a functional group equivalent of 400 g/eq or more and 10,000 g/eq or less, a Tg (glass transition temperature) or a softening point of 40° C. or less, or an elastic modulus of less than 1.0 GPa at 30° C., and wherein the conductive filler (C) is made of a conductive material having a volume specific resistivity of 1×10−4 Ω·cm or less at room temperature.
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公开(公告)号：US20240147609A1
公开(公告)日：2024-05-02
申请号：US18410564
申请日：2024-01-11
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Kyosuke MICHIGAMI , Qianying LI
CPC classification number: H05K1/0283 , H05K1/181 , H05K3/0058 , H05K3/0094 , H05K3/1283 , H05K2201/0212
Abstract: A method for manufacturing a stretchable circuit board includes preparing a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less, a second stretchable insulating layer, and a fluid; forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface; filling the fluid in the via; laminating the second stretchable insulating layer on the second surface to seal the via; and patterning the metal layer.
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公开(公告)号：US20210337660A1
公开(公告)日：2021-10-28
申请号：US17371955
申请日：2021-07-09
Inventor： Takatoshi ABE , Tomoaki SAWADA , Tomohiro FUKAO
Abstract: A stretchable circuit board includes a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material. The land part is formed of a patterned metal foil, or a printed product of an electroconductive ink containing metal particles. The stretchable base material has a tensile modulus at 25° C. room temperature of 0.5 MPa to 0.5 GPa.
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公开(公告)号：US20210027909A1
公开(公告)日：2021-01-28
申请号：US17041791
申请日：2019-03-29
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE
IPC: H01B1/22 , C08F220/32 , C08K3/08 , C08K3/04
Abstract: A conductive composition is provided and at least includes an acrylic resin and a conductive powder, wherein the acrylic resin at least contains a polymer unit (A) of a (meth)acrylate having an epoxy group and a polymer unit (B) of a (meth)acrylate having an isobornyl group, and an amount of the polymer unit (B) is 5.0 parts by mass or more and 50.0 parts by mass or less based on 100 parts by mass of the acrylic resin.
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公开(公告)号：US20160266668A1
公开(公告)日：2016-09-15
申请号：US14405533
申请日：2014-10-08
Inventor： Tomoaki SAWADA , Shingo YOSHIOKA , Takatoshi ABE
IPC: G06F3/041 , H01B1/24 , H01L31/0224 , H05K1/02 , H05K1/03
CPC classification number: H05K1/0271 , B32B3/12 , B32B3/266 , B32B5/02 , B32B15/08 , B32B15/092 , B32B2260/021 , B32B2260/046 , B32B2262/103 , B32B2262/106 , B32B2262/14 , B32B2307/202 , B32B2307/412 , B32B2307/50 , B32B2363/00 , C08J5/18 , C08J7/047 , C08J2300/21 , C08J2367/02 , C08J2400/21 , C08J2463/00 , C08K7/02 , C08L101/00 , C09D105/16 , C09D163/00 , G06F3/041 , H01B1/02 , H01B1/24 , H01L31/022466 , H01L31/022491 , H05K1/0213 , H05K1/0274 , H05K1/028 , H05K1/0296 , H05K1/0326 , H05K1/0333 , H05K1/0366 , H05K2201/0108 , H05K2201/012 , H05K2201/0323 , H05K2201/0326 , Y10T428/24331 , Y10T428/24917 , C08L63/00
Abstract: The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate (alpha), as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.
Abstract translation: 本发明涉及一种导电膜，其特征在于能够进行弹性变形，几乎没有残余应变率和显示应力松弛性能。 更具体地说，本发明涉及一种导电膜，其中在规定的延伸恢复试验中测量的应力松弛率（R）和残余应变率（α）如下：20％≤R≤95％ 0％≤α≤3％。
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Patent Agency Ranking
公开(公告)号：US20150373838A1
公开(公告)日：2015-12-24
申请号：US14405572
申请日：2014-10-08
Inventor： Tomoaki SAWADA , Shingo YOSHIOKA , Takatoshi ABE
IPC: H05K1/02 , G06F3/041 , H05K1/03 , H01B1/02 , H01L31/0224
CPC classification number: H05K1/0271 , B32B3/12 , B32B3/266 , B32B5/02 , B32B15/08 , B32B15/092 , B32B2260/021 , B32B2260/046 , B32B2262/103 , B32B2262/106 , B32B2262/14 , B32B2307/202 , B32B2307/412 , B32B2307/50 , B32B2363/00 , C08J5/18 , C08J7/047 , C08J2300/21 , C08J2367/02 , C08J2400/21 , C08J2463/00 , C08K7/02 , C08L101/00 , C09D105/16 , C09D163/00 , G06F3/041 , H01B1/02 , H01B1/24 , H01L31/022466 , H01L31/022491 , H05K1/0213 , H05K1/0274 , H05K1/028 , H05K1/0296 , H05K1/0326 , H05K1/0333 , H05K1/0366 , H05K2201/0108 , H05K2201/012 , H05K2201/0323 , H05K2201/0326 , Y10T428/24331 , Y10T428/24917 , C08L63/00
Abstract: The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate a, as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.
Abstract translation: 本发明涉及一种导电膜，其特征在于能够进行弹性变形，几乎没有残余应变率和显示应力松弛性能。 更具体地说，本发明涉及一种导电膜，其中应力松弛率（R）和在规定的延伸 - 恢复试验中测量的残余应变速率a如下：20％＆amp; NlE; R＆lt; L; 95％和 0％＆nlE;α＆nlE; 3％。
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17.发明公开公开(公告)号：US20230167215A1
公开(公告)日：2023-06-01
申请号：US18100960
申请日：2023-01-24
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Kyosuke MICHIGAMI
IPC: C08F220/32 , C08F220/44 , C08F220/18 , C08K5/09 , C08J5/18 , B32B15/082 , B32B15/20
CPC classification number: C08F220/325 , C08F220/44 , C08F220/1811 , C08K5/09 , C08J5/18 , B32B15/082 , B32B15/20 , C08J2333/08 , C08J2333/20 , B32B2457/08 , B32B2307/304 , B32B2311/12
Abstract: An aspect of the present invention relates to a resin composition containing an acrylic resin and a curing agent, in which the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano group, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group, a weight average molecular weight of the acrylic resin is 50,000 or more and 3,000,000 or less, and a storage modulus of a cured product of the resin composition at 200° C. is 0.1 MPa or more and 3.5 MPa or less.
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公开(公告)号：US20220175057A1
公开(公告)日：2022-06-09
申请号：US17603765
申请日：2020-04-16
Inventor： Takatoshi ABE , Tomohiro FUKAO , Tomoaki SAWADA , Susumu FUKUSHIMA
Abstract: A circuit mounted article to be fixed to a fabric is provided and includes a circuit board having flexibility, an electronic component mounted on a fabric facing face side, which faces the fabric, of the circuit board, and further a reinforcing portion to be used for fixing of the circuit mounted article to the fabric on the fabric facing face side of the circuit board.
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公开(公告)号：US20210301137A1
公开(公告)日：2021-09-30
申请号：US16625316
申请日：2018-06-29
Inventor： Takatoshi ABE , Tomoaki SAWADA
IPC: C08L87/00
Abstract: The present invention relates, in one aspect, to a thermosetting resin composition including an epoxy resin, an isocyanate resin, a polyrotaxane resin, and a curing agent, wherein the isocyanate resin includes a hexamethylene skeleton and at least one selected from a biuret skeleton, an isocyanurate skeleton, an allophanate skeleton, a neopentyl skeleton, a butylene skeleton, and a dicarboxyl skeleton in a structure thereof.
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公开(公告)号：US20210161004A1
公开(公告)日：2021-05-27
申请号：US16643764
申请日：2018-09-03
Inventor： Takatoshi ABE , Tomoaki SAWADA , Tomohiro FUKAO
Abstract: The present application relates to a circuit board for use in electronic components. Specifically, the present application relates to a stretchable circuit board including a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material.
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