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11.发明申请公开(公告)号：US20190264099A1
公开(公告)日：2019-08-29
申请号：US16254118
申请日：2019-01-22
Inventor： Masumi ABE , Toshiaki KURACHI
Abstract: A resin powder includes resin particles each binding a first quantum dot phosphor.
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公开(公告)号：US20180069162A1
公开(公告)日：2018-03-08
申请号：US15692527
申请日：2017-08-31
Inventor： Masumi ABE , Toshifumi OGATA , Toshiaki KURACHI
IPC: H01L33/50 , H01L25/075 , H01L27/15 , H01L33/56
CPC classification number: H01L33/507 , H01L25/0753 , H01L27/156 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48137
Abstract: A light-emitting apparatus includes a first relay line and a second relay line. The first and second relay lines are disposed between a first region and a second region of a substrate. Further, the first and second relay lines extend at least partially parallel to each other in a second direction that crosses a first direction in which the first region and the second region are aligned. The first relay line electrically connects a first light-emitting element group disposed in the first region and a third light-emitting element group disposed in the second region. The second relay line electrically connects a second light-emitting element group disposed in the first region and a fourth light-emitting element group disposed in the second region.
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公开(公告)号：US20180062058A1
公开(公告)日：2018-03-01
申请号：US15666935
申请日：2017-08-02
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
IPC: H01L33/64 , C09K11/02 , C09K11/62 , C09K11/77 , H01L33/56 , H01L33/50 , H01L33/60 , H01L33/32 , H01L33/62 , H01L25/075 , F21V29/75 , F21V3/02 , F21V7/22 , F21V29/89 , F21V23/02
CPC classification number: H01L33/644 , C09K11/025 , C09K11/0883 , C09K11/62 , C09K11/7706 , F21S8/026 , F21V3/02 , F21V7/22 , F21V23/023 , F21V29/75 , F21V29/89 , F21Y2115/10 , H01L25/0753 , H01L33/32 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes: a substrate; an LED chip on the substrate; and a sealant which seals the LED chip. The sealant includes at least 0.05 wt % oxide of a transition metal as an additive for inhibiting deterioration of a base material of the sealant. Additionally or alternatively, the sealant includes at least one of a metal salt of a transition metal and an organic complex of a transition metal, as the additive.
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公开(公告)号：US20170040508A1
公开(公告)日：2017-02-09
申请号：US15220790
申请日：2016-07-27
Inventor： Naoki TAGAMI , Masumi ABE , Hisaki FUJITANI , Kosuke TAKEHARA , Toshiaki KURACHI
CPC classification number: H01L33/62 , H01L33/60 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.
Abstract translation: 一种发光二极管（LED）模块，包括：基板; 抗蚀剂，其包括在所述基板上方的多个层; 以及安装在基板上方的LED元件。 作为多个层的最上层的第二层中的苯基，酯键和碳双键中的至少一个的含量百分比低于所述至少一个苯基的含量百分比 ，酯键和作为多个层的下层的第一层中的碳双键，下层位于最上层的下方。
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公开(公告)号：US20160265748A1
公开(公告)日：2016-09-15
申请号：US15055937
申请日：2016-02-29
Inventor： Masumi ABE , Yasuharu UENO , Koji OMURA , Kenji SUGIURA , Toshifumi OGATA , Atsuyoshi ISHIMORI , Toshiaki KURACHI
CPC classification number: H05B33/0821 , F21S8/026 , F21Y2105/18 , F21Y2113/10 , F21Y2115/10 , H01L25/0753 , H01L2224/48463 , H01L2924/181 , H01L2924/00012
Abstract: A light-emitting device includes a substrate and a plurality of light-emitting elements disposed above the substrate. In the plurality of light-emitting elements, a first light-emitting element and a second light-emitting element different in a rate of decrease in light output along with a temperature increase are included. The plurality of light-emitting elements include: a first serial element group including some light-emitting elements connected in series among the plurality of light-emitting elements; and a second serial element group connected in parallel with the first serial element group and including some light-emitting elements connected in series among the plurality of light-emitting elements. A ratio between a total number of first light-emitting elements and a total number of second light-emitting elements is different between the first serial element group and the second serial element group.
Abstract translation: 发光装置包括基板和设置在基板上方的多个发光元件。 在多个发光元件中，包括与温度升高一起的光输出的降低速度不同的第一发光元件和第二发光元件。 多个发光元件包括：包括在多个发光元件中串联连接的一些发光元件的第一串联元件组; 以及与第一串联元件组并联连接的第二串联元件组，并且包括在多个发光元件之间串联连接的一些发光元件。 第一串联元件组和第二串联元件组之间的第一发光元件的总数与第二发光元件的总数的比率不同。
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Patent Agency Ranking
公开(公告)号：US20190257482A1
公开(公告)日：2019-08-22
申请号：US16253982
申请日：2019-01-22
Inventor： Masumi ABE , Toshiaki KURACHI
Abstract: A light-emitting apparatus includes: a base; a wiring pattern disposed on a major surface of the base; a light-emitting element mounted on the major surface of the base; a metal wire that electrically connects the light-emitting element and the wiring pattern; a light-transmissive film that covers the metal wire, at least a portion of the wiring pattern, and at least a portion of the light-emitting element; and a sealant that covers the light-transmissive film. The light-transmissive film includes a wall portion that is located between the metal wire and the base, and that extends from the major surface of the base to the metal wire.
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公开(公告)号：US20190103522A1
公开(公告)日：2019-04-04
申请号：US16141320
申请日：2018-09-25
Inventor： Masumi ABE , Toshiaki KURACHI , Yuya YAMAMOTO , Koji OMURA , Kosuke TAKEHARA
Abstract: A lighting apparatus includes an LED chip that emits primary light, and phosphor particles that emit secondary light by being excited with the primary light. The lighting apparatus emits light including the primary light and the secondary light. The light has an emission spectrum having a first peak in a wavelength ranging from 420 nm to 460 nm, a second peak in the wavelength ranging from 530 nm to 580 nm, a third peak in the wavelength ranging from 605 nm to 655 nm, a first trough in the wavelength ranging from 440 nm to 480 nm, and a second trough in the wavelength ranging from 555 nm to 605 nm.
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公开(公告)号：US20180216803A1
公开(公告)日：2018-08-02
申请号：US15875316
申请日：2018-01-19
Inventor： Masumi ABE , Toshifumi OGATA , Toshiaki KURACHI
CPC classification number: F21V19/0025 , F21V9/08 , F21V19/002 , H01L25/0753 , H01L33/486 , H01L33/62 , H05K1/0274 , H05K2201/10106
Abstract: A mounting substrate includes: a substrate; a first terminal, a fifth terminal, and a sixth terminal which are disposed in a first region; a second terminal disposed in a second region; a third terminal and a seventh terminal which are disposed in a third region; and a fourth terminal disposed in a fourth region. The mounting substrate includes: a first connecting line which electrically connects the fifth terminal and the second terminal; a second connecting line which electrically connects the sixth terminal and the third terminal; and a third connecting line which electrically connects the seventh terminal and the fourth terminal.
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公开(公告)号：US20170263823A1
公开(公告)日：2017-09-14
申请号：US15454310
申请日：2017-03-09
Inventor： Masumi ABE , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48095 , H01L2224/48465 , H01L2224/73265
Abstract: A light-emitting diode (LED) module is provided. The LED module includes a substrate, a metal layer disposed above the substrate, a resist layer disposed above the substrate and including a plurality of layers, an LED chip mounted above the substrate, and a wire connecting the metal layer and the LED chip. In a first region in which the LED chip is mounted, at least a portion of the resist layer is disposed directly on the substrate with the LED chip being mounted above the resist layer via an adhesive. In a second region which includes a connection at which the wire and the metal layer are connected and a periphery of the connection, the metal layer is disposed above the substrate with the resist layer being disposed above the metal layer.
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公开(公告)号：US20160260878A1
公开(公告)日：2016-09-08
申请号：US15012133
申请日：2016-02-01
Inventor： Kosuke TAKEHARA , Hisaki FUJITANI , Naoki TAGAMI , Toshiaki KURACHI
CPC classification number: H01L33/62 , H01L33/50 , H01L33/505 , H01L33/52 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H05K1/0274 , H05K2201/0195 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first white resist layer that covers the connection conductors; and a second white resist layer that covers the first white resist. Each of the connection conductors includes a copper foil and a plating layer partly formed on the copper foil. The plating layer is formed of metal having oxidation-resistant and corrosion-resistant characteristics higher than those of copper. The first white resist layer is formed with first openings that respectively expose the plating layers of the connection conductors. The second white resist layer covers a periphery of each plating layer of the connection conductors in planar view.
Abstract translation: 安装基板包括：包含树脂和玻璃的绝缘基板; 形成在所述绝缘基板的表面上的连接导体; 覆盖连接导体的第一白色抗蚀剂层; 以及覆盖第一白色抗蚀剂的第二白色抗蚀剂层。 每个连接导体包括铜箔和部分地形成在铜箔上的镀层。 镀层由具有比铜高的抗氧化性和耐腐蚀性的金属形成。 第一白色抗蚀剂层形成有分别暴露连接导体的镀层的第一开口。 第二白色抗蚀剂层在平面图中覆盖连接导体的每个镀层的周边。
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