公开(公告)号：US20220254750A1

公开(公告)日：2022-08-11

申请号：US17169098

申请日：2021-02-05

Applicant: Raytheon Company

Inventor： Patrick E. Boyle ,  James E. Benedict ,  Erika Klek ,  Mikhail Pevzner

IPC: H01L23/00

Abstract: Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.

公开(公告)号：US11375609B2

公开(公告)日：2022-06-28

申请号：US17091585

申请日：2020-11-06

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  James E. Benedict ,  John P. Haven ,  Andrew R. Southworth ,  Semira M. Azadzoi

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/04 ,  H05K3/36 ,  H05K3/40 ,  H01P3/08 ,  H05K3/46

Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

公开(公告)号：US11122692B1

公开(公告)日：2021-09-14

申请号：US16898930

申请日：2020-06-11

Applicant: RAYTHEON COMPANY

Inventor： James E. Benedict ,  Gregory G. Beninati ,  Mikhail Pevzner ,  Thomas V. Sikina ,  Andrew R. Southworth

IPC: H05K3/34 ,  H05K3/00

Abstract: A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.

公开(公告)号：US10813210B2

公开(公告)日：2020-10-20

申请号：US16184571

申请日：2018-11-08

Applicant: RAYTHEON COMPANY

Inventor： Semira M. Azadzoi ,  James E. Benedict ,  John P. Haven ,  Thomas V. Sikina ,  Andrew R. Southworth

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46

Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.

公开(公告)号：US20190269021A1

公开(公告)日：2019-08-29

申请号：US16287260

申请日：2019-02-27

Applicant: RAYTHEON COMPANY

Inventor： Jonathan E. Nufio-Molina ,  Thomas V. Sikina ,  James E. Benedict ,  Andrew R. Southworth ,  Semira M. Azadzoi

IPC: H05K3/46 ,  H05K1/02

Abstract: A method of manufacturing a power divider circuit includes milling a conductive material disposed upon a first substrate to form a signal trace. The signal trace includes a division from a single trace to two arm traces, with each of the two arm traces having a proximal end electrically connected to the single trace and a distal end electrically connected to each of two secondary traces. The method further includes depositing a resistive ink between the two distal ends to form a resistive electrical connection between the two arm traces, bonding a second substrate to the first substrate to substantially encapsulate the traces between the first substrate and the second substrate, and milling through at least one of the first substrate or the second substrate to provide access to at least one of the traces. A signal divider is further disclosed.

公开(公告)号：US20190150271A1

公开(公告)日：2019-05-16

申请号：US16184571

申请日：2018-11-08

Applicant: RAYTHEON COMPANY

Inventor： Semira M. Azadzoi ,  James E. Benedict ,  John P. Haven ,  Thomas V. Sikina ,  Andrew R. Southworth

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0218 ,  H01P3/08 ,  H01P11/003 ,  H05K1/0219 ,  H05K1/0221 ,  H05K1/0251 ,  H05K1/112 ,  H05K3/0044 ,  H05K3/107 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4611 ,  H05K2201/0707 ,  H05K2201/09036 ,  H05K2201/09545 ,  H05K2203/0228

Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.

公开(公告)号：US20190148832A1

公开(公告)日：2019-05-16

申请号：US16180822

申请日：2018-11-05

Applicant: RAYTHEON COMPANY

Inventor： Peter J. Adams ,  Thomas V. Sikina ,  John P. Haven ,  James E. Benedict

IPC: H01Q9/27 ,  H01Q1/38

Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

公开(公告)号：US20230209728A1

公开(公告)日：2023-06-29

申请号：US18173390

申请日：2023-02-23

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  Gregory G. Beninati ,  James E. Benedict ,  Andrew R. Southworth

IPC: H05K3/46

CPC classification number: H05K3/465 ,  H05K3/4679

Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.

公开(公告)号：US11606865B2

公开(公告)日：2023-03-14

申请号：US16678188

申请日：2019-11-08

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  Gregory G. Beninati ,  James E. Benedict ,  Andrew R. Southworth

IPC: H05K3/46

Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.

公开(公告)号：US20220140485A1

公开(公告)日：2022-05-05

申请号：US17578034

申请日：2022-01-18

Applicant: RAYTHEON COMPANY

Inventor： Peter J. Adams ,  Thomas V. Sikina ,  John P. Haven ,  James E. Benedict

IPC: H01Q9/27 ,  H05K1/02 ,  H05K3/42 ,  H05K3/40 ,  H01Q1/38

Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.