公开(公告)号：US20250006775A1

公开(公告)日：2025-01-02

申请号：US18883501

申请日：2024-09-12

Applicant: Rohm Co., Ltd.

Inventor： Hiroaki MATSUBARA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor element includes a main body having an obverse surface and a reverse surface facing away from each other in a first direction and a plurality of electrodes disposed on the obverse surface and electrically conducting to the main body. The main body has a first side surface facing in the second direction x. The first side surface includes a first edge that is farthest from the reverse surface. The main body has a second side surface connected to the first edge and located between the first side surface and the obverse surface in the first direction z. The second side surface overlaps with the reverse surface as viewed in the first direction z. The surface roughness of the first side surface differs from that of the second side surface.

公开(公告)号：US20240047438A1

公开(公告)日：2024-02-08

申请号：US18267455

申请日：2021-11-22

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Taro NISHIOKA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Moe YAMAGUCHI ,  Ryohei UMENO

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L25/16 ,  H01L23/3107 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/46 ,  H01L2224/48195 ,  H01L2224/48245 ,  H01L2224/48991 ,  H01L2224/48455 ,  H01L2924/19042 ,  H01L2924/3512

Abstract: A semiconductor device includes first and second semiconductor elements, and first and second circuits at different potentials. The second semiconductor element, electrically connected to the first semiconductor element, relays mutual signals between the first and the second circuits, while insulating them. The semiconductor device further includes a first terminal lead electrically connected to the first semiconductor element, a first wire connected to the first and the second semiconductor elements, and a second wire connected to the first semiconductor element and the first terminal lead. The first wire contains a first metal. The second wire includes a first core containing a second metal, and a first surface layer containing a third metal and covering the first core. The second metal has a smaller atomic number than that of the first metal. The third metal has a greater bonding strength with respect to the first terminal lead than the second metal.

公开(公告)号：US20230335529A1

公开(公告)日：2023-10-19

申请号：US18340346

申请日：2023-06-23

Applicant: ROHM CO., LTD.

Inventor： Ryohei UMENO ,  Taro NISHIOKA ,  Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Moe YAMAGUCHI

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L24/48 ,  H01L23/49562 ,  H01L23/4952 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/48137 ,  H01L2924/13091 ,  H01L2924/13055 ,  H01L2224/32245 ,  H01L2224/73265

Abstract: A semiconductor device includes: a semiconductor element; an island lead on which the semiconductor element is mounted; a terminal lead electrically connected to the semiconductor element; a wire connected to the semiconductor element and the terminal lead; and a sealing resin covering the semiconductor element, the island lead, the terminal lead, and the wire. The terminal lead includes a base member having an obverse surface facing in a thickness direction of the terminal lead, and a metal layer located between the obverse surface and the wire. The base member has a greater bonding strength with respect to the sealing resin than the metal layer. The obverse surface includes an opposing side facing the island lead. The obverse surface includes a first portion that includes at least a portion of the opposing side and that is exposed from the metal layer.

公开(公告)号：US20230335475A1

公开(公告)日：2023-10-19

申请号：US18339616

申请日：2023-06-22

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L24/48 ,  H01L23/49503 ,  H01L23/49524 ,  H01L2224/48175

Abstract: A semiconductor device includes a first die pad, a second die pad, a first semiconductor element, a second semiconductor element, an insulating element, first terminals, second terminals, and a sealing resin. The sealing resin has a first side surface located on one side of a first direction, a second side surface located on the other side of the first direction, and third and fourth side surfaces that are separated from each other in a second direction orthogonal to both a thickness direction and the first direction and are connected to the first and second side surfaces. A first gate mark having a surface roughness larger than the other regions of the third side surface is formed on the third side surface. When viewed along the second direction, the first gate mark overlaps a pad gap provided between the first die pad and the second die pad in the first direction

公开(公告)号：US20220020678A1

公开(公告)日：2022-01-20

申请号：US17365065

申请日：2021-07-01

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Kaori SUMITOMO ,  Maki MOROI ,  Naoki KINOSHITA

IPC: H01L23/498

Abstract: A semiconductor device includes: a chip; a circuit element formed in the chip; an insulating layer formed over the chip so as to cover the circuit element; a multilayer wiring region formed in the insulating layer and including a plurality of wirings laminated and arranged in a thickness direction of the insulating layer so as to be electrically connected to the circuit element; at least one insulating region which does not include the wirings in an entire region in the thickness direction of the insulating layer and is formed in a region outside the multilayer wiring region in the insulating layer; and at least one terminal electrode disposed over the insulating layer so as to face the chip with the at least one insulating region interposed between the at least one terminal electrode and the chip.

公开(公告)号：US20190157236A1

公开(公告)日：2019-05-23

申请号：US16217605

申请日：2018-12-12

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA ,  Taro NISHIOKA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/544 ,  H01L23/495

CPC classification number: H01L24/32 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/544 ,  H01L23/564 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54486 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/06155 ,  H01L2224/29139 ,  H01L2224/29239 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32013 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/05442 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/207

Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.

公开(公告)号：US20180047659A1

公开(公告)日：2018-02-15

申请号：US15792212

申请日：2017-10-24

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/49575 ,  H01L21/48 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05014 ,  H01L2224/05554 ,  H01L2224/0612 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

公开(公告)号：US20180040540A1

公开(公告)日：2018-02-08

申请号：US15666055

申请日：2017-08-01

Applicant: ROHM CO., LTD.

Inventor： Yasumasa KASUYA ,  Hiroaki MATSUBARA ,  Hiroshi KUMANO ,  Toshio NAKAJIMA ,  Shigeru HIRATA ,  Yuji ISHIMATSU

IPC: H01L23/495 ,  H02P6/12 ,  H02P6/14

Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.

公开(公告)号：US20160307854A1

公开(公告)日：2016-10-20

申请号：US15095848

申请日：2016-04-11

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/49575 ,  H01L21/48 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05014 ,  H01L2224/05554 ,  H01L2224/0612 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

Abstract translation: 半导体器件包括半导体元件电路，导电支撑体和密封树脂。 导电支撑件包括：芯片焊盘，沿第一方向隔开的第一端子，在垂直于第一方向的第二方向上在第一方向上与第一端子相对的第二端子和与第一方向相反的第二端子，以及连接到管芯焊盘的支撑端子。 密封树脂封装第一和第二端子的一部分，支撑端子的一部分，半导体元件电路和管芯焊盘。 密封树脂具有在第二方向上间隔开的两个第一侧表面和沿第一方向隔开的两个第二侧表面。 第一端子和第二端子从第一侧表面露出，而导电支撑件的元件都不会从第二侧表面露出。

公开(公告)号：US20250062199A1

公开(公告)日：2025-02-20

申请号：US18934548

申请日：2024-11-01

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/64

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.