摘要:
An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas.
摘要:
A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.
摘要:
Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.
摘要:
A method of producing flexible interconnections for integrated circuits, and, in particular, the forming of flexible or compliant interconnections preferably by a laser-assisted chemical vapor deposition process in semiconductor or glass substrate-based carriers which are employed for mounting and packaging multiple integrated circuit chips and selectively, other devices in the technology.
摘要:
An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide cote fiducials to accurately position the optical element with respect to the core in an X-Y plane A method of alignment is also provided
摘要:
A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.
摘要:
A multiple laser beam scanning optical system for correcting monochromatic and polychromatic aberrations comprising a doublet cylindrical lens for receiving the multiple beams and directing them to a rotating polygonal mirror. Scanning lens means are located to receive the beams from the mirror and direct them to the image plane. The scanning lens is comprised of at least one doublet wherein both elements have approximately the same index of refraction but different dispersion factors at a nominal wavelength
摘要:
This is an electronic scheme for correcting for mechanical misalignment and chromatic aberrations from laser beam to laser beam in the scan direction of a multiple beam laser scanning system for use in an electrophotographic machine. Each beam is first corrected for mechanical misalignment and thereafter for chromatic aberrations. A reference laser beam produces two pulses near the start of scan (SOS) and two pulses near the end of scan (EOS). A non-reference laser beam then produces SOS and EOS pulses from which the mechanical misalignment is calculated. A gated clock is energized by the reference pulse and a tapped delay line is used for nanosecond resolution. After accomplishing correction for mechanical misalignment, chromatic aberrations are corrected by measuring the amount of total pel displacement of the non-reference scan line relative to the reference scan line and inserting appropriate delays at selected intervals throughout the non-reference scan in order to maintain pel placement accuracy to a desired tolerance.
摘要:
Error correction in a feedback servo system. The feedback servo loop in, for example, a head positioning circuit in an optical disk data recording and retrieval system is provided with means for forcing the feedback signal to zero when the head is positioned at best focus as determined by a peak in the laser monitoring diode. The head in such a system must be dynamically maintained at a best focus position but, through use and transporting, the alignment of the head position error detecting system can be disturbed. In some cases, the loop circuit parameters may drift from their original values. To correct for errors introduced from such causes, the head is positioned at best focus and the focus error (head position error) signal is sensed. A correction system forces the sensed value to zero, e.g, by adjusting the gain of amplifiers used in the feedback loop.
摘要:
Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.