公开(公告)号：US20230013064A1

公开(公告)日：2023-01-19

申请号：US17947397

申请日：2022-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonseop LEE ,  Hwanwook PARK ,  Jeonghoon BAEK ,  Dohyung KIM ,  Seunghee MUN ,  Dongyoon SEO ,  Jinoh AHN

IPC: H05K1/02 ,  H01L25/11 ,  H01L25/065 ,  G11C5/06 ,  G11C8/18 ,  G06F13/40 ,  G11C5/04

Abstract: A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.

公开(公告)号：US20220159832A1

公开(公告)日：2022-05-19

申请号：US17360417

申请日：2021-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongyoon SEO ,  Geunje PARK ,  Dohyung KIM ,  Hwanwook PARK ,  Dongmin JANG ,  Jaeseok JANG

IPC: H05K1/11 ,  H05K1/18

Abstract: A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.

公开(公告)号：US20210247112A1

公开(公告)日：2021-08-12

申请号：US17172399

申请日：2021-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongmin JEON ,  Dohyung KIM ,  Kookjeong SEO ,  Kyunghoon CHOI ,  Heeyuel ROH ,  Insub LEE

IPC: F25B39/02 ,  F25D17/06 ,  F28F3/02

Abstract: Disclosed herein is a refrigerator. The refrigerator includes a cabinet, a first storage compartment formed in the cabinet, a second storage compartment formed in the cabinet to be separated from the first storage compartment, a cooling chamber including an evaporator configured to generate cold air, the cooling chamber connected to the first storage compartment to allow the cold air to be supplied to the first storage compartment, a cold air duct connected to the evaporator to receive the cold air, and a cooling plate configured to exchange heat with cold air in the cold air duct and provided to form one surface of the second storage compartment.

公开(公告)号：US20210219408A1

公开(公告)日：2021-07-15

申请号：US16927050

申请日：2020-07-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyung KIM ,  Seongchul HONG ,  Kyungsik KANG ,  Insung KIM ,  Motoshi SAKAI ,  Seulgi LEE ,  Jungchul LEE

IPC: H05G2/00 ,  H01S3/23 ,  G02B19/00 ,  H01S3/00 ,  G02B26/08

Abstract: A laser beam delivery apparatus of an extreme ultra violet light source may include a high power seed module configured to generate a laser beam, a power amplifier configured to amplify the laser beam generated by the high power seed module, a beam transfer module configured to collect and move the laser beam amplified by the power amplifier, a final focusing assembly optical platform configured to adjust focus of the laser beam collected and moved by the beam transfer module, and a focusing unit configured to focus the laser beam with the focus adjusted by the final focusing assembly optical platform to a target droplet. The power amplifier may include a position adjuster configured to adjust a position of the laser beam. The position adjuster may include a refraction plate having a flat surface. The power amplifier may include a pointing adjuster, which may include a mirror.

公开(公告)号：US20150041747A1

公开(公告)日：2015-02-12

申请号：US14259594

申请日：2014-04-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyung KIM

IPC: H01L45/00

CPC classification number: H01L45/144 ,  H01L27/2409 ,  H01L27/2463 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/124 ,  H01L45/1246 ,  H01L45/126 ,  H01L45/1616 ,  H01L45/1683

Abstract: A phase change material layer includes germanium (Ge), antimony (Sb), tellurium (Te) and at least one impurity elements. An atomic concentration of impurity elements ranges from about 0

Abstract translation: 相变材料层包括锗（Ge），锑（Sb），碲（Te）和至少一种杂质元素。 杂质元素的原子浓度范围为约0

公开(公告)号：US20250038580A1

公开(公告)日：2025-01-30

申请号：US18610709

申请日：2024-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungwook JUNG ,  Dohyung KIM ,  Jaesup LEE ,  Solhee IN

IPC: H02J50/80 ,  H02J50/20 ,  H02J50/40

Abstract: A wireless power transmission system including: a first wireless power transmitter to receive a beacon signal through a first array antenna unit, estimate a characteristic of a first wireless channel based on the beacon signal, and generate and output first power signals, wherein phases and amplitudes of the first power signals are adjusted based on a characteristic of the first wireless channel and a time reversal algorithm; and a first wireless power receiver to output the beacon signal through a first antenna unit, receive the first power signals through the first antenna unit, and generate an operating voltage based on the first power signals, wherein the first power signals are adjusted differently based on a quantity of wireless power transmitters, a quantity of wireless power receivers, a movement of the first wireless power transmitter, or a movement of the first wireless power receiver.

公开(公告)号：US20240203943A1

公开(公告)日：2024-06-20

申请号：US18346921

申请日：2023-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyoung KIM ,  Jiwon KIM ,  Minyong LEE ,  Dohyung KIM ,  Sukkang SUNG

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/528 ,  H10B80/00

CPC classification number: H01L25/0657 ,  H01L23/528 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H10B80/00 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/80379 ,  H01L2225/0651 ,  H01L2225/06562

Abstract: The inventive concept provides a chip stack structure including a first semiconductor chip and a second semiconductor chip bonded to each other, and a semiconductor package including a plurality of chip stack structures stacked in a vertical direction.

公开(公告)号：US20240071712A1

公开(公告)日：2024-02-29

申请号：US18226644

申请日：2023-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SeungWan YOO ,  Jeongyeon LEE ,  Dohyung KIM ,  Jaehong PARK ,  Dong-Chan LIM

IPC: H01J37/20 ,  H01J37/317

CPC classification number: H01J37/20 ,  H01J37/3178 ,  H01J2237/201 ,  H01J2237/20214

Abstract: An ion beam deposition method includes placing a substrate into an ion beam deposition apparatus, irradiating an ion beam from an ion beam source toward a target plate, and rotating the target plate during the irradiating of the ion beam. The target plate includes a first region that includes a first material, and a second region that includes a second material different from the first material.

公开(公告)号：US20240062996A1

公开(公告)日：2024-02-22

申请号：US18234123

申请日：2023-08-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SeungWan YOO ,  Jeongyeon LEE ,  Dohyung KIM ,  Jaehong PARK ,  Dong-Chan LIM

IPC: H01J37/32 ,  C23C14/34

CPC classification number: H01J37/32697 ,  H01J37/3211 ,  C23C14/3442 ,  H01J37/34

Abstract: An ion beam source including a plasma chamber including a plasma generating space, a plasma generator configured to generate plasma in the plasma generating space, a first grid connected to the plasma chamber, a second grid connected to the plasma chamber, and a first grid driver connected to the first grid. The first grid driver may be configured to move the first grid relative to the second grid.

公开(公告)号：US20150130027A1

公开(公告)日：2015-05-14

申请号：US14538100

申请日：2014-11-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se jun PARK ,  Ho jun KIM ,  Jaihyung WON ,  Gyuwan CHOI ,  Dohyung KIM

IPC: H01L21/308 ,  H01L21/311 ,  H01L29/06 ,  H01L21/033

CPC classification number: H01L21/0332 ,  C23C16/26 ,  C23C16/50 ,  H01L21/02118 ,  H01L21/02274

Abstract: A method of forming a carbon-containing thin film and a method of manufacturing a semiconductor device using the method of forming the carbon-containing thin film are described. The method of forming a carbon-containing thin film includes the steps of introducing a substrate into a chamber, injecting hydrocarbon gas and at least nitrogen gas simultaneously into the chamber, and depositing a carbon-containing thin film including carbon and nitrogen on the substrate, thereby forming a carbon-containing thin film having high selectivity and uniform thickness.

Abstract translation: 描述了形成含碳薄膜的方法和使用形成含碳薄膜的方法制造半导体器件的方法。 形成含碳薄膜的方法包括以下步骤：将基材引入室中，同时将烃气体和至少氮气注入到室中，以及在基板上沉积包含碳和氮的含碳薄膜， 从而形成具有高选择性和均匀厚度的含碳薄膜。