公开(公告)号：US09805953B2

公开(公告)日：2017-10-31

申请号：US14699576

申请日：2015-04-29

Applicant: Semiconductor Energy Laboratory Co., LTD.

Inventor： Masakatsu Ohno ,  Satoru Idojiri ,  Kanpei Kikuchi ,  Yoshiharu Hirakata ,  Kohei Yokoyama

IPC: B32B38/10 ,  H01L21/463 ,  H01L21/67 ,  H01L21/683 ,  B32B43/00

CPC classification number: H01L21/463 ,  B32B38/10 ,  B32B43/006 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1928 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1978

Abstract: A wedge-shaped jig (6) is inserted into a gap between a first substrate (21) and a second substrate (22) at a corner (221) of the second substrate (22) and separation of the attached first substrate (21) and second substrate (22) starts to proceed; then, a second suction pad (53) of a second suction portion (51), which is the closest to the corner (221), moves upward. Then, first suction pads (43) of first suction portions (41a), (41b), and (41c) sequentially move upward such that one side of the second substrate (22) separates from the stacked body. Although the second substrate (22) warps as the separation of the second substrate (22) proceeds, each of the plurality of first suction pads (43) elastically deforms. Therefore, the first suction pads (43) can be prevented from being detached from the second substrate (22), and the substrate (22) can be securely separated from the stacked body.

公开(公告)号：US09437832B2

公开(公告)日：2016-09-06

申请号：US14621914

申请日：2015-02-13

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Tatsuya Sakuishi ,  Yutaka Uchida ,  Hiroki Adachi ,  Saki Eguchi ,  Junpei Yanaka ,  Kayo Kumakura ,  Seiji Yasumoto ,  Kohei Yokoyama ,  Akihiro Chida

IPC: H01L51/00 ,  B32B7/02 ,  B32B38/10 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B17/00 ,  B32B27/20 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/02 ,  B32B37/18 ,  B32B37/12 ,  H01L51/52

CPC classification number: H01L51/0097 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B17/00 ,  B32B17/06 ,  B32B27/20 ,  B32B27/286 ,  B32B27/30 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B37/02 ,  B32B37/10 ,  B32B37/1292 ,  B32B37/18 ,  B32B38/10 ,  B32B2250/05 ,  B32B2255/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2307/202 ,  B32B2307/40 ,  B32B2307/50 ,  B32B2307/536 ,  B32B2307/558 ,  B32B2310/0843 ,  B32B2315/08 ,  B32B2457/20 ,  H01L51/003 ,  H01L51/5253 ,  H01L2251/5338 ,  Y02E10/549 ,  Y02P70/521

Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.

Abstract translation: 提供了灵活的设备。 柔性装置的粘合层的硬度设定为高于70°的肖氏D值，或优选高于或等于邵氏D的80°。挠性装置的柔性基板的膨胀系数设定得较小 比58ppm /℃，或优选小于或等于30ppm /℃

公开(公告)号：US20140332150A1

公开(公告)日：2014-11-13

申请号：US14270676

申请日：2014-05-06

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yoshiharu Hirakata ,  Akihiro Chida ,  Kohei Yokoyama

IPC: B32B38/10 ,  B32B43/00

CPC classification number: B32B38/10 ,  B32B38/1858 ,  B32B41/00 ,  B32B43/006 ,  Y10T156/1944

Abstract: A method and an apparatus for manufacturing an object which involve a separation technique are provided. A first substrate provided with an object is attached to a second substrate and is then suction-fixed by using a suction chuck (also referred to as a suction stage or a vacuum chuck) including portions with different suction capabilities or by using its functional equivalent, and the second substrate is separated from the first substrate. Accordingly, the object is separated from the first substrate and transferred to the second substrate. An apparatus for achieving this is also provided. A substrate fixture surface of the suction chuck or its functional equivalent includes a plurality of portions provided with suction micro-holes and a portion provided with no holes. Owing to the plurality of portions provided with suction micro-holes, a plurality of objects can be transferred from the first substrate to the second substrate.

Abstract translation: 提供了一种涉及分离技术的用于制造物体的方法和装置。 设置有物体的第一基板被附接到第二基板，然后通过使用包括具有不同吸力的部分的吸入卡盘（也称为抽吸台或真空卡盘）或通过使用其功能等效物进行抽吸固定， 并且第二基板与第一基板分离。 因此，物体与第一基板分离并转移到第二基板。 还提供了一种用于实现这一点的装置。 吸盘卡盘的基板夹具表面或其功能性等效物包括多个具有抽吸微孔的部分和不设孔的部分。 由于设置有吸引微孔的多个部分，可以将多个物体从第一基板转移到第二基板。

公开(公告)号：US20140175470A1

公开(公告)日：2014-06-26

申请号：US14132852

申请日：2013-12-18

Applicant: Sharp Kabushiki Kaisha ,  Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kohei Yokoyama ,  Tomohiro Kosaka ,  Fumikazu Shimoshikiryoh ,  Shinichi Kawato ,  Katsuhiro Kikuchi ,  Manabu Niboshi ,  Takashi Ochi ,  Yuto Tsukamoto ,  Tomofumi Osaki

IPC: H01L33/62 ,  H01L27/15

CPC classification number: H01L27/3246 ,  H01L27/3211 ,  H01L51/5056 ,  H01L51/5072 ,  H01L2251/558

Abstract: The light-emitting device includes a first lower electrode, a second lower electrode, a partition, a layer with high conductivity, light-emitting layers, and an upper electrode. The conductivity of the layer with high conductivity is higher than the conductivity of each of the light-emitting layers and lower than the conductivity of each of the lower electrodes and the upper electrode. The partition includes a first slope located on a first lower electrode side and a second slope located on a second lower electrode side. The thickness of the layer with high conductivity located over the first slope in a direction perpendicular to the first slope is different from the thickness of the layer with high conductivity located over the second slope in a direction perpendicular to the second slope.

Abstract translation: 发光装置包括第一下电极，第二下电极，隔板，具有高导电性的层，发光层和上电极。 具有高导电性的层的导电性高于每个发光层的导电率，并且低于每个下电极和上电极的导电率。 分隔件包括位于第一下电极侧的第一斜面和位于第二下电极侧的第二斜面。 位于第一斜坡上方的垂直于第一斜坡的方向上的具有高导电率的层的厚度不同于在垂直于第二斜率的方向上位于第二斜率上的具有高导电性的层的厚度。

公开(公告)号：US20130178004A1

公开(公告)日：2013-07-11

申请号：US13782554

申请日：2013-03-01

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yoshiharu Hirakata ,  Yosuke Sato ,  Kohei Yokoyama ,  Hideaki Kuwabara ,  Shunpei Yamazaki

IPC: H01L33/08

CPC classification number: H01L33/08 ,  H01L27/3244 ,  H01L27/3281 ,  H01L51/5036 ,  H01L51/5048 ,  H01L51/5265 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A full-color light-emitting device is achieved with plural kinds of light-emitting elements in each of which a stacked layer of a first material layer formed selectively with a droplet discharge apparatus and a second material layer formed by vapor-deposition method using the conductive-surface plate on which a layer containing an organic compound is formed is provided between a pair of electrodes. The first material layer is a layer in which an organic compound and a metal oxide which is an inorganic compound are mixed. By adjusting the thickness of the first material layer of each light-emitting element, which is different depending on an emission color, a blue light emission component, a green light emission component, or a red light emission component among a plurality of components for white light emission can be selectively emphasized and taken out by light interference phenomenon.

Abstract translation: 实现了具有多种发光元件的全彩色发光装置，每种发光元件是选择性地由液滴喷射装置形成的第一材料层的堆叠层和通过气相沉积法形成的第二材料层 形成有含有有机化合物的层的导电性表面板设置在一对电极之间。 第一材料层是混合作为无机化合物的有机化合物和金属氧化物的层。 通过根据发光颜色调整各发光元件的第一材料层的厚度，在白色的多个成分中的蓝色发光成分，绿色发光成分或红色发光成分 可以通过光线干涉现象有选择地强调光取出光。

公开(公告)号：US11785827B2

公开(公告)日：2023-10-10

申请号：US17521283

申请日：2021-11-08

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Shunpei Yamazaki ,  Kohei Yokoyama ,  Takaaki Nagata ,  Tatsuya Sakuishi ,  Akio Yamashita ,  Yasuhiro Jinbo ,  Hideaki Shishido ,  Tetsuji Ishitani

IPC: H10K59/50 ,  G02F1/1333 ,  G02F1/1362 ,  G02F1/1368

CPC classification number: H10K59/50 ,  G02F1/1368 ,  G02F1/133345 ,  G02F1/136286 ,  G02F2203/64

Abstract: A display device that can switch between normal display and see-through display is provided. Visibility in see-through display is improved. A liquid crystal element overlaps with a light-emitting element. The light-emitting element, a transistor, and the like overlapping with the liquid crystal element transmit visible light. When the liquid crystal element blocks external light, an image is displayed with the light-emitting element. When the liquid crystal element transmits external light, an image displayed with the light-emitting element is superimposed on a transmission image through the liquid crystal element.

公开(公告)号：US11552107B2

公开(公告)日：2023-01-10

申请号：US16793543

申请日：2020-02-18

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Hisao Ikeda ,  Kouhei Toyotaka ,  Hideaki Shishido ,  Hiroyuki Miyake ,  Kohei Yokoyama ,  Yasuhiro Jinbo ,  Yoshitaka Dozen ,  Takaaki Nagata ,  Shinichi Hirasa

IPC: H01L27/12 ,  H01L27/32 ,  G09G3/3233 ,  H01L29/786 ,  G09G3/20 ,  G09G3/36 ,  G09G5/391

Abstract: Provided is a display device with extremely high resolution, a display device with higher display quality, a display device with improved viewing angle characteristics, or a flexible display device. Same-color subpixels are arranged in a zigzag pattern in a predetermined direction. In other words, when attention is paid to a subpixel, another two subpixels exhibiting the same color as the subpixel are preferably located upper right and lower right or upper left and lower left. Each pixel includes three subpixels arranged in an L shape. In addition, two pixels are combined so that pixel units including subpixel are arranged in matrix of 3×2.

公开(公告)号：US11444255B2

公开(公告)日：2022-09-13

申请号：US16611503

申请日：2018-05-11

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Takaaki Nagata ,  Tatsuya Sakuishi ,  Kohei Yokoyama ,  Yasuhiro Jinbo ,  Taisuke Kamada ,  Akihiro Chida

IPC: H01L51/00 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  H05K1/18

Abstract: A flexible display device is manufactured with high yield. A display device having high resistance to repeated bending is provided. The display device is manufactured by forming a separation layer over a support substrate; forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion; forming a display element over the inorganic insulating layer to be overlapped with the first portion; forming a connection electrode over the inorganic insulating layer to be overlapped with the second portion; sealing the display element; separating the support substrate and the inorganic insulating layer using the separation layer; attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and etching the second portion using the substrate as a mask to expose the connection electrode.

公开(公告)号：US11075232B2

公开(公告)日：2021-07-27

申请号：US16522182

申请日：2019-07-25

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Shunpei Yamazaki ,  Yoshiharu Hirakata ,  Takashi Hamada ,  Kohei Yokoyama ,  Yasuhiro Jinbo ,  Tetsuji Ishitani ,  Daisuke Kubota

IPC: H01L27/12 ,  H01L51/52 ,  G02F1/1368 ,  G02F1/1362 ,  G02F1/1333 ,  G02F1/1335 ,  G02F1/1339 ,  H01L29/786 ,  H01L27/32 ,  H01L51/00

Abstract: A display device in which a peripheral circuit portion has high operation stability is provided. The display device includes a first substrate and a second substrate. A first insulating layer is provided over a first surface of the first substrate. A second insulating layer is provided over a first surface of the second substrate. The first surface of the first substrate and the first surface of the second substrate face each other. An adhesive layer is provided between the first insulating layer and the second insulating layer. A protective film in contact with the first substrate, the first insulating layer, the adhesive layer, the second insulating layer, and the second substrate is formed in the vicinity of a peripheral portion of the first substrate and the second substrate.

公开(公告)号：US11071224B2

公开(公告)日：2021-07-20

申请号：US14922753

申请日：2015-10-26

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Kohei Yokoyama ,  Yoshiharu Hirakata

IPC: H05K7/02 ,  H01L51/52 ,  G09F9/00 ,  H01L23/10

Abstract: A novel, highly convenient or reliable functional panel is provided. A novel, highly convenient or reliable method for manufacturing a functional panel is provided. The functional panel includes a first base; a second base having a region overlapping with the first base; a bonding layer that bonds the first base to the second base; and an insulating layer in contact with the first base, the second base, and the bonding layer. With this structure, an opening which is formed easily in a region where the bonding layer is in contact with the first base or the second base can be filled with the insulating layer, which can prevent impurities from being diffused into the functional layer located in a region surrounded by the first base, the second base, and the bonding layer that bonds the first base to the second base.