公开(公告)号：US20200095114A1

公开(公告)日：2020-03-26

申请号：US16560518

申请日：2019-09-04

Applicant: STMicroelectronics S.r.l.

Inventor： Anna Angela Pomarico ,  Giuditta Roselli ,  Daniele Caltabiano ,  Roberto Brioschi ,  Mohammad Abbasi Gavarti

IPC: B81B3/00 ,  B60T1/06 ,  B60T8/171 ,  B60T8/17 ,  G01L1/18 ,  G01L3/00 ,  G01L9/06

Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.

公开(公告)号：US10338378B2

公开(公告)日：2019-07-02

申请号：US15264446

申请日：2016-09-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Brioschi

IPC: G02B26/10 ,  B81B7/00 ,  G02B26/08

Abstract: The mirror group is formed by a monolithic frame bent along a bending line and including a first and a second supporting portions carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions are arranged on opposite sides of the bending line of the frame, angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.

公开(公告)号：US10189703B2

公开(公告)日：2019-01-29

申请号：US15362556

申请日：2016-11-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Marco Omar Ghidoni ,  Roberto Brioschi

IPC: B81B7/02 ,  H04R1/04 ,  B81B7/00 ,  B81C1/00 ,  H04R1/40 ,  H04R19/00

Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

公开(公告)号：US20160236471A1

公开(公告)日：2016-08-18

申请号：US15138997

申请日：2016-04-26

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics S.r.l. ,  STMicroelectronics Asia Pacific Pte Ltd

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dana Gruenbacher ,  Roberto Brioschi ,  Teck Khim Neo ,  Dave Hunt ,  Faiz Sherman

IPC: B41J2/16 ,  H01L23/00 ,  B41J2/14 ,  H05K1/02

CPC classification number: B41J2/1623 ,  B05B1/14 ,  B05B11/0054 ,  B05B15/40 ,  B41J2/14024 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/162 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L41/1132 ,  H01L2224/2732 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48096 ,  H01L2224/48097 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/19106 ,  H05K1/0272 ,  H05K1/09 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10083 ,  H05K2201/10515 ,  H05K2201/10545 ,  Y02P70/613 ,  Y10T156/1089 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

Abstract translation: 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可以阻挡或减少通过喷嘴的流体流动。

公开(公告)号：US11851319B2

公开(公告)日：2023-12-26

申请号：US16560518

申请日：2019-09-04

Applicant: STMicroelectronics S.r.l.

Inventor： Anna Angela Pomarico ,  Giuditta Roselli ,  Daniele Caltabiano ,  Roberto Brioschi ,  Mohammad Abbasi Gavarti

IPC: B81B3/00 ,  B60T1/06 ,  B60T8/17 ,  B60T8/171 ,  G01L1/18 ,  G01L3/00 ,  G01L9/06

CPC classification number: B81B3/0072 ,  B60T1/065 ,  B60T8/17 ,  B60T8/171 ,  G01L1/18 ,  G01L3/00 ,  G01L9/06 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2203/0127 ,  B81B2203/0315

Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.

公开(公告)号：US10597287B2

公开(公告)日：2020-03-24

申请号：US16233682

申请日：2018-12-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Marco Omar Ghidoni ,  Roberto Brioschi

IPC: B81B7/02 ,  B81B7/00 ,  B81C1/00 ,  H04R1/40 ,  H04R1/04 ,  H04R19/00

Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

公开(公告)号：US10531204B2

公开(公告)日：2020-01-07

申请号：US16137439

申请日：2018-09-20

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Brioschi ,  Marco Omar Ghidoni

IPC: B06B1/02 ,  B81B7/02 ,  B81B7/04 ,  B81C1/00 ,  H04R1/44 ,  H04R3/00 ,  H04R7/06 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

公开(公告)号：US20190028815A1

公开(公告)日：2019-01-24

申请号：US16137439

申请日：2018-09-20

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Brioschi ,  Marco Omar Ghidoni

IPC: H04R19/04 ,  H04R7/06 ,  H04R31/00 ,  H04R19/00 ,  H04R3/00 ,  B81C1/00 ,  B06B1/02 ,  H04R1/44 ,  B81B7/04

CPC classification number: H04R19/04 ,  B06B1/0292 ,  B81B7/02 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2201/047 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/44 ,  H04R3/005 ,  H04R7/06 ,  H04R19/005 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

公开(公告)号：US10159150B2

公开(公告)日：2018-12-18

申请号：US15253615

申请日：2016-08-31

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS S.R.L.

Inventor： Simon Dodd ,  Roberto Brioschi

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/40 ,  H05K3/10

Abstract: The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.

公开(公告)号：US10091587B2

公开(公告)日：2018-10-02

申请号：US15377627

申请日：2016-12-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Brioschi ,  Marco Omar Ghidoni

IPC: H04R25/00 ,  H04R19/04 ,  B06B1/02 ,  B81C1/00 ,  H04R3/00 ,  H04R19/00 ,  B81B7/04 ,  H04R1/44 ,  H04R7/06 ,  H04R31/00

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.