Semiconductor device including stacked semiconductor patterns

    公开(公告)号:US12191390B2

    公开(公告)日:2025-01-07

    申请号:US18518004

    申请日:2023-11-22

    Abstract: A semiconductor device including a substrate that includes first to third regions; a first channel structure on the first region and including first channel patterns that are vertically stacked on the substrate; a second channel structure on the second region and including a second channel pattern on the substrate; a third channel structure on the third region and including third channel patterns and fourth channel patterns that are vertically and alternately stacked on the substrate; first to third gate electrodes on the first to third channel structures; and first to third source/drain patterns on opposite sides of the first to third channel structures, wherein the first, second, and fourth channel patterns include a first semiconductor material, and the third channel patterns include a second semiconductor material different from the first semiconductor material.

    Semiconductor device
    13.
    发明授权

    公开(公告)号:US11901357B2

    公开(公告)日:2024-02-13

    申请号:US17380232

    申请日:2021-07-20

    CPC classification number: H01L27/088

    Abstract: A semiconductor device including a substrate that includes first and second regions; a first active pattern on the first region, the first active pattern including first source/drain patterns and a first channel pattern between the first source/drain patterns; a second active pattern on the second region, the second active pattern including second source/drain patterns and a second channel pattern between the second source/drain patterns; and a first gate electrode on the first channel pattern and a second gate electrode on the second channel pattern, wherein a length of the first channel pattern is greater than a length of the second channel pattern, each of the first channel pattern and the second channel pattern includes a plurality of semiconductor patterns stacked on the substrate, and at least two semiconductor patterns of the first channel pattern are bent away from or toward a bottom surface of the substrate.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20190319127A1

    公开(公告)日:2019-10-17

    申请号:US16450193

    申请日:2019-06-24

    Abstract: A semiconductor device includes first and second active patterns protruding upward from a substrate, a gate electrode crossing the first and second active patterns and extending in a first direction, a first source/drain region on the first active pattern and on at least one side of the gate electrode, and a second source/drain region on the second active pattern and on at least one side of the gate electrode. The first and second source/drain regions have a conductivity type different from each other, and the second source/drain region has a bottom surface in contact with a top surface of the second active pattern and at a lower level than that of a bottom surface of the first source/drain region in contact with a top surface of the first active pattern. The first active pattern has a first width smaller than a second width of the second active pattern.

    Semiconductor devices
    16.
    发明授权

    公开(公告)号:US10109645B2

    公开(公告)日:2018-10-23

    申请号:US15786864

    申请日:2017-10-18

    Abstract: A semiconductor device includes a first device isolation layer defining active regions spaced apart from each other along a first direction on a substrate, second device isolation layers defining a plurality of active patterns protruding from the substrate, the second device isolation layers extending in the first direction to be spaced apart from each other in a second direction and connected to the first device isolation layer, a gate structure extending in the second direction on the first device isolation layer between the active regions, a top surface of the second device isolation layer being lower than a top surface of the active pattern, a top surface of the first device isolation layer being higher than the top surface of the active pattern, and at least part of a bottom surface of the gate structure being higher than the top surface of the active pattern.

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