Vortex pneumatic classifier
    11.
    发明授权
    Vortex pneumatic classifier 失效
    涡流式气动分选机

    公开(公告)号:US5533629A

    公开(公告)日:1996-07-09

    申请号:US313263

    申请日:1994-09-03

    IPC分类号: B07B7/083 B04B5/12

    CPC分类号: B07B7/083

    摘要: Precise classifying of granular or powdered raw material at the desired classifying point by means of a vortex pneumatic classifier comprising: a rotor, a plurality of vortex flow adjusting vanes provided on the said rotor, a classifying chamber defined around the said vortex flow adjusting vanes, and guide vanes radially opposing the said vortex flow adjusting vanes across the said classifying chamber, wherein the mounting pitch P of the said vortex flow adjusting vanes is determined in relation to the classifying particle diameter Dp(th) so as to meet the condition of the following relation expressionP.ltoreq.1.04.times.Dp(th).sup.0.365.

    摘要翻译: PCT No.PCT / JP94 / 00502 Sec。 371日期1994年9月30日 102(e)1994年9月30日PCT 1994年3月29日PCT公布。 第WO94 / 22599号公报 日期:1994年10月13日。通过涡流气动分选机在期望的分级点精确地分级粒状或粉末状原料,包括:转子,设置在所述转子上的多个涡流流量调节叶片,围绕 所述涡流流量调节叶片和与所述涡流流量调节叶片径向相对的所述分流室的引导叶片,其中所述涡流流量调节叶片的安装间距P相对于分级粒径Dp(th)确定 以满足以下关系表达式P <= 1.04×Dp(th)0.365的条件。

    Thin film capacitor and method of manufacturing the same
    12.
    发明授权
    Thin film capacitor and method of manufacturing the same 失效
    薄膜电容器及其制造方法

    公开(公告)号:US5406445A

    公开(公告)日:1995-04-11

    申请号:US216966

    申请日:1994-03-24

    IPC分类号: H01G4/20 H01L29/04 H01L23/48

    摘要: A NaCl oxide thin layer oriented to (100) face or a spinel oxide thin layer oriented to (100) face, a perovskite dielectric thin layer oriented to (100) face and a metal electrode are sequentially laminated on a metal electrode, thus providing a thin film capacitor. Or alternatively, a thin film capacitor is manufactured by sequentially laminating a NaCl oxide thin layer oriented to (100) face or a spinel oxide thin layer oriented to (100) face, a platinum thin layer as a lower electrode oriented to (100) face, a perovskite dielectric thin layer oriented to (100) face and a metal thin layer as an upper electrode on a substrate. A plasma-enhanced CVD method is applied to form a NaCl oxide thin layer, a spinel oxide thin layer and a perovskite dielectric thin layer while a vacuum deposition method, a sputtering method, a CVD method or a plasma-enhanced CVD method is applied for the formation of a metal electrode.

    摘要翻译: 将取向为(100)面的NaCl氧化物薄层或取向为(100)面的尖晶石氧化物薄层,朝向(100)面的钙钛矿电介质薄层和金属电极依次层压在金属电极上,从而提供 薄膜电容器。 或者,通过依次层叠取向于(100)面的氧化锌薄膜或取向为(100)面的尖晶石氧化物薄层,将铂薄层作为朝向(100)面的下部电极而制造薄膜电容器 取向为(100)面的钙钛矿电介质薄层和在基板上作为上部电极的金属薄层。 当采用真空沉积法,溅射法,CVD法或等离子体增强CVD法应用等离子体增强CVD法形成NaCl氧化物薄层,尖晶石氧化物薄层和钙钛矿电介质薄层 形成金属电极。

    Conductive ink composition and method of forming a conductive thick film
pattern
    13.
    发明授权
    Conductive ink composition and method of forming a conductive thick film pattern 失效
    导电油墨组合物和形成导电厚膜图案的方法

    公开(公告)号:US5366760A

    公开(公告)日:1994-11-22

    申请号:US950596

    申请日:1992-09-25

    CPC分类号: H05K1/092 C09D11/52 H01B1/22

    摘要: A method of forming a conductive thick film pattern comprises the steps of filling grooves of an intaglio with a conductive ink, transferring the conductive ink in the grooves onto a blanket of which surface is coated with an elastic material, transferring and printing a conductive thick film pattern transferred on the blanket onto a substrate, firing the conductive pattern to scatter the organic matter, and sintering the conductive pattern. A conductive ink comprises conductive metal powder, glass frit, transition metal oxide, dispersing agent, and vehicle containing an organic binder comprising at least one of poly-iso-butyl methacrylate, poly-iso-propyl methacrylate, polymethyl methacrylate, poly-4-fluoroethylene, and poly-.alpha.-methyl styrene.

    摘要翻译: 形成导电厚膜图案的方法包括以下步骤:用导电油墨填充凹版的凹槽,将凹槽中的导电油墨转移到其表面涂覆有弹性材料的毯子上,转印和印刷导电厚膜 在衬垫上转印到衬底上,烧制导电图案以散射有机物质,并烧结导电图案。 导电油墨包括导电金属粉末,玻璃料,过渡金属氧化物,分散剂和载体,其含有有机粘合剂,该有机粘合剂包含甲基丙烯酸异丁酯,甲基丙烯酸异丙酯,聚甲基丙烯酸甲酯,聚甲基丙烯酸甲酯, 氟乙烯和聚-α-甲基苯乙烯。

    Nonvolatile memory element, nonvolatile memory device, nonvolatile semiconductor device, and method of manufacturing nonvolatile memory element
    15.
    发明授权
    Nonvolatile memory element, nonvolatile memory device, nonvolatile semiconductor device, and method of manufacturing nonvolatile memory element 有权
    非易失性存储元件,非易失性存储器件,非易失性半导体器件以及制造非易失性存储元件的方法

    公开(公告)号:US08445886B2

    公开(公告)日:2013-05-21

    申请号:US13147321

    申请日:2010-02-02

    IPC分类号: H01L29/02

    摘要: A nonvolatile memory element comprises a first electrode (103); a second electrode (105); and a resistance variable layer (104) disposed between the first electrode (103) and the second electrode (105), resistance values of the resistance variable layer reversibly changing in response to electric signals applied between the electrodes (103, 105); the resistance variable layer (104) including a first tantalum oxide layer (107) comprising a first tantalum oxide and a second tantalum oxide layer (108) comprising a second tantalum oxide which is different in oxygen content from the first tantalum oxide, the first tantalum oxide layer and the second tantalum oxide layer being stacked together, and being configured such that 0

    摘要翻译: 非易失性存储元件包括第一电极(103); 第二电极(105); 以及设置在所述第一电极(103)和所述第二电极(105)之间的电阻变化层(104),所述电阻变化层的电阻值响应于施加在所述电极(103,105)之间的电信号而可逆地变化; 电阻变化层(104)包括包含第一钽氧化物的第一钽氧化物层(107)和包含与第一钽氧化物不同氧含量的第二氧化钽的第二钽氧化物层(108),第一钽 氧化物层和第二钽氧化物层堆叠在一起,并且被配置为当第一钽氧化物表示为TaO x时满足0

    METHOD OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR MEMORY ELEMENT AND METHOD OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE
    17.
    发明申请
    METHOD OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR MEMORY ELEMENT AND METHOD OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE 有权
    制造非易失性半导体存储器元件的方法和制造非易失性半导体存储器件的方法

    公开(公告)号:US20120295413A1

    公开(公告)日:2012-11-22

    申请号:US13574254

    申请日:2010-12-28

    IPC分类号: H01L21/02

    摘要: A method of manufacturing a non-volatile semiconductor memory element including a variable resistance element and a non-ohmic element. The variable resistance element includes a first electrode, a variable resistance layer, and a shared electrode. The non-ohmic element includes the shared electrode, a semiconductor or insulator layer, and a second electrode. The method includes: forming the first electrode on a substrate; forming the variable resistance layer on the first electrode; forming the shared electrode by nitriding a front surface of the variable resistance layer; forming the semiconductor or insulator layer on the shared electrode; and forming the second electrode. In the forming of the shared electrode, a front surface of a transition metal oxide is nitrided by a plasma nitriding process to form the shared electrode comprising a transition metal nitride.

    摘要翻译: 一种制造包括可变电阻元件和非欧姆元件的非易失性半导体存储元件的方法。 可变电阻元件包括第一电极,可变电阻层和共用电极。 非欧姆元件包括共用电极,半导体或绝缘体层和第二电极。 该方法包括:在基板上形成第一电极; 在所述第一电极上形成所述可变电阻层; 通过对可变电阻层的前表面进行氮化而形成共用电极; 在共用电极上形成半导体层或绝缘体层; 并形成第二电极。 在共用电极的形成中,通过等离子体氮化处理使过渡金属氧化物的前表面氮化,形成包含过渡金属氮化物的共用电极。

    NONVOLATILE MEMORY ELEMENT, NONVOLATILE MEMORY DEVICE, NONVOLATILE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING NONVOLATILE MEMORY ELEMENT
    18.
    发明申请
    NONVOLATILE MEMORY ELEMENT, NONVOLATILE MEMORY DEVICE, NONVOLATILE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING NONVOLATILE MEMORY ELEMENT 有权
    非易失性存储器元件,非易失性存储器件,非易失性半导体器件以及制造非易失性存储器元件的方法

    公开(公告)号:US20110284816A1

    公开(公告)日:2011-11-24

    申请号:US13147321

    申请日:2010-02-02

    IPC分类号: H01L45/00

    摘要: A nonvolatile memory element comprises a first electrode (103); a second electrode (105); and a resistance variable layer (104) disposed between the first electrode (103) and the second electrode (105), resistance values of the resistance variable layer reversibly changing in response to electric signals applied between the electrodes (103, 105); the resistance variable layer (104) including a first tantalum oxide layer (107) comprising a first tantalum oxide and a second tantalum oxide layer (108) comprising a second tantalum oxide which is different in oxygen content from the first tantalum oxide, the first tantalum oxide layer and the second tantalum oxide layer being stacked together, and being configured such that 0

    摘要翻译: 非易失性存储元件包括第一电极(103); 第二电极(105); 以及设置在所述第一电极(103)和所述第二电极(105)之间的电阻变化层(104),所述电阻变化层的电阻值响应于施加在所述电极(103,105)之间的电信号而可逆地变化; 电阻变化层(104)包括包含第一钽氧化物的第一钽氧化物层(107)和包含与第一钽氧化物不同氧含量的第二氧化钽的第二钽氧化物层(108),第一钽 氧化物层和第二钽氧化物层堆叠在一起,并且被配置为当第一钽氧化物表示为TaO x并且x