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公开(公告)号：US09437832B2
公开(公告)日：2016-09-06
申请号：US14621914
申请日：2015-02-13
发明人： Tatsuya Sakuishi , Yutaka Uchida , Hiroki Adachi , Saki Eguchi , Junpei Yanaka , Kayo Kumakura , Seiji Yasumoto , Kohei Yokoyama , Akihiro Chida
IPC分类号： H01L51/00 , B32B7/02 , B32B38/10 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B17/00 , B32B27/20 , B32B27/28 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B37/02 , B32B37/18 , B32B37/12 , H01L51/52
CPC分类号： H01L51/0097 , B32B7/02 , B32B7/06 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B17/00 , B32B17/06 , B32B27/20 , B32B27/286 , B32B27/30 , B32B27/325 , B32B27/34 , B32B27/36 , B32B27/365 , B32B37/02 , B32B37/10 , B32B37/1292 , B32B37/18 , B32B38/10 , B32B2250/05 , B32B2255/20 , B32B2260/021 , B32B2260/046 , B32B2264/102 , B32B2307/202 , B32B2307/40 , B32B2307/50 , B32B2307/536 , B32B2307/558 , B32B2310/0843 , B32B2315/08 , B32B2457/20 , H01L51/003 , H01L51/5253 , H01L2251/5338 , Y02E10/549 , Y02P70/521
摘要： A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
摘要翻译： 提供了灵活的设备。 柔性装置的粘合层的硬度设定为高于70°的肖氏D值，或优选高于或等于邵氏D的80°。挠性装置的柔性基板的膨胀系数设定得较小 比58ppm /℃，或优选小于或等于30ppm /℃
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公开(公告)号：US20140332150A1
公开(公告)日：2014-11-13
申请号：US14270676
申请日：2014-05-06
CPC分类号： B32B38/10 , B32B38/1858 , B32B41/00 , B32B43/006 , Y10T156/1944
摘要： A method and an apparatus for manufacturing an object which involve a separation technique are provided. A first substrate provided with an object is attached to a second substrate and is then suction-fixed by using a suction chuck (also referred to as a suction stage or a vacuum chuck) including portions with different suction capabilities or by using its functional equivalent, and the second substrate is separated from the first substrate. Accordingly, the object is separated from the first substrate and transferred to the second substrate. An apparatus for achieving this is also provided. A substrate fixture surface of the suction chuck or its functional equivalent includes a plurality of portions provided with suction micro-holes and a portion provided with no holes. Owing to the plurality of portions provided with suction micro-holes, a plurality of objects can be transferred from the first substrate to the second substrate.
摘要翻译： 提供了一种涉及分离技术的用于制造物体的方法和装置。 设置有物体的第一基板被附接到第二基板，然后通过使用包括具有不同吸力的部分的吸入卡盘（也称为抽吸台或真空卡盘）或通过使用其功能等效物进行抽吸固定， 并且第二基板与第一基板分离。 因此，物体与第一基板分离并转移到第二基板。 还提供了一种用于实现这一点的装置。 吸盘卡盘的基板夹具表面或其功能性等效物包括多个具有抽吸微孔的部分和不设孔的部分。 由于设置有吸引微孔的多个部分，可以将多个物体从第一基板转移到第二基板。
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公开(公告)号：US20140175470A1
公开(公告)日：2014-06-26
申请号：US14132852
申请日：2013-12-18
发明人： Kohei Yokoyama , Tomohiro Kosaka , Fumikazu Shimoshikiryoh , Shinichi Kawato , Katsuhiro Kikuchi , Manabu Niboshi , Takashi Ochi , Yuto Tsukamoto , Tomofumi Osaki
CPC分类号： H01L27/3246 , H01L27/3211 , H01L51/5056 , H01L51/5072 , H01L2251/558
摘要： The light-emitting device includes a first lower electrode, a second lower electrode, a partition, a layer with high conductivity, light-emitting layers, and an upper electrode. The conductivity of the layer with high conductivity is higher than the conductivity of each of the light-emitting layers and lower than the conductivity of each of the lower electrodes and the upper electrode. The partition includes a first slope located on a first lower electrode side and a second slope located on a second lower electrode side. The thickness of the layer with high conductivity located over the first slope in a direction perpendicular to the first slope is different from the thickness of the layer with high conductivity located over the second slope in a direction perpendicular to the second slope.
摘要翻译： 发光装置包括第一下电极，第二下电极，隔板，具有高导电性的层，发光层和上电极。 具有高导电性的层的导电性高于每个发光层的导电率，并且低于每个下电极和上电极的导电率。 分隔件包括位于第一下电极侧的第一斜面和位于第二下电极侧的第二斜面。 位于第一斜坡上方的垂直于第一斜坡的方向上的具有高导电率的层的厚度不同于在垂直于第二斜率的方向上位于第二斜率上的具有高导电性的层的厚度。
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公开(公告)号：US20130178004A1
公开(公告)日：2013-07-11
申请号：US13782554
申请日：2013-03-01
IPC分类号： H01L33/08
CPC分类号： H01L33/08 , H01L27/3244 , H01L27/3281 , H01L51/5036 , H01L51/5048 , H01L51/5265 , H01L2924/0002 , H01L2924/00
摘要： A full-color light-emitting device is achieved with plural kinds of light-emitting elements in each of which a stacked layer of a first material layer formed selectively with a droplet discharge apparatus and a second material layer formed by vapor-deposition method using the conductive-surface plate on which a layer containing an organic compound is formed is provided between a pair of electrodes. The first material layer is a layer in which an organic compound and a metal oxide which is an inorganic compound are mixed. By adjusting the thickness of the first material layer of each light-emitting element, which is different depending on an emission color, a blue light emission component, a green light emission component, or a red light emission component among a plurality of components for white light emission can be selectively emphasized and taken out by light interference phenomenon.
摘要翻译： 实现了具有多种发光元件的全彩色发光装置，每种发光元件是选择性地由液滴喷射装置形成的第一材料层的堆叠层和通过气相沉积法形成的第二材料层 形成有含有有机化合物的层的导电性表面板设置在一对电极之间。 第一材料层是混合作为无机化合物的有机化合物和金属氧化物的层。 通过根据发光颜色调整各发光元件的第一材料层的厚度，在白色的多个成分中的蓝色发光成分，绿色发光成分或红色发光成分 可以通过光线干涉现象有选择地强调光取出光。
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公开(公告)号：US11818856B2
公开(公告)日：2023-11-14
申请号：US17378840
申请日：2021-07-19
IPC分类号： H10K50/84 , H10K50/844 , H10K50/852 , H05K7/02 , G09F9/00 , H01L23/10
CPC分类号： H05K7/02 , G09F9/00 , H01L23/10 , H10K50/84 , H10K50/844 , H10K50/852
摘要： A novel, highly convenient or reliable functional panel is provided. A novel, highly convenient or reliable method for manufacturing a functional panel is provided. The functional panel includes a first base; a second base having a region overlapping with the first base; a bonding layer that bonds the first base to the second base; and an insulating layer in contact with the first base, the second base, and the bonding layer. With this structure, an opening which is formed easily in a region where the bonding layer is in contact with the first base or the second base can be filled with the insulating layer, which can prevent impurities from being diffused into the functional layer located in a region surrounded by the first base, the second base, and the bonding layer that bonds the first base to the second base.
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公开(公告)号：US10583641B2
公开(公告)日：2020-03-10
申请号：US15804319
申请日：2017-11-06
发明人： Masakatsu Ohno , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo , Hisao Ikeda , Kohei Yokoyama , Hiroki Adachi , Satoru Idojiri
IPC分类号： B32B37/00 , B32B38/18 , B32B27/08 , B32B27/20 , B32B27/36 , B32B37/12 , B32B17/10 , B32B38/00
摘要： A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
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公开(公告)号：US10367014B2
公开(公告)日：2019-07-30
申请号：US14922658
申请日：2015-10-26
发明人： Shunpei Yamazaki , Yoshiharu Hirakata , Takashi Hamada , Kohei Yokoyama , Yasuhiro Jinbo , Tetsuji Ishitani , Daisuke Kubota
IPC分类号： G02F1/1333 , H01L27/12 , H01L51/52 , G02F1/1368 , G02F1/1362 , G02F1/1335 , G02F1/1339 , H01L29/786 , H01L27/32 , H01L51/00
摘要： A display device in which a peripheral circuit portion has high operation stability is provided. The display device includes a first substrate and a second substrate. A first insulating layer is provided over a first surface of the first substrate. A second insulating layer is provided over a first surface of the second substrate. The first surface of the first substrate and the first surface of the second substrate face each other. An adhesive layer is provided between the first insulating layer and the second insulating layer. A protective film in contact with the first substrate, the first insulating layer, the adhesive layer, the second insulating layer, and the second substrate is formed in the vicinity of a peripheral portion of the first substrate and the second substrate.
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公开(公告)号：US10155368B2
公开(公告)日：2018-12-18
申请号：US14270676
申请日：2014-05-06
摘要： A method and an apparatus for manufacturing an object which involve a separation technique are provided. A first substrate provided with an object is attached to a second substrate and is then suction-fixed by using a suction chuck (also referred to as a suction stage or a vacuum chuck) including portions with different suction capabilities or by using its functional equivalent, and the second substrate is separated from the first substrate. Accordingly, the object is separated from the first substrate and transferred to the second substrate. An apparatus for achieving this is also provided. A substrate fixture surface of the suction chuck or its functional equivalent includes a plurality of portions provided with suction micro-holes and a portion provided with no holes. Owing to the plurality of portions provided with suction micro-holes, a plurality of objects can be transferred from the first substrate to the second substrate.
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公开(公告)号：US09925749B2
公开(公告)日：2018-03-27
申请号：US14468818
申请日：2014-08-26
发明人： Masakatsu Ohno , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo , Hisao Ikeda , Kohei Yokoyama , Hiroki Adachi , Satoru Idojiri
IPC分类号： B32B37/00 , B32B37/12 , B32B38/18 , B32B17/10 , B32B27/08 , B32B27/20 , B32B27/36 , B32B38/00
CPC分类号： B32B37/0046 , B32B17/10431 , B32B27/08 , B32B27/20 , B32B27/36 , B32B37/0015 , B32B37/003 , B32B37/1284 , B32B38/0008 , B32B38/18 , B32B38/1841 , B32B38/1858 , B32B2264/102 , B32B2264/105 , B32B2309/68 , B32B2457/14 , B32B2457/20 , H01L2224/01 , Y10T156/15 , Y10T156/1798
摘要： A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
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20.发明授权公开(公告)号：US09728737B2
公开(公告)日：2017-08-08
申请号：US14297004
申请日：2014-06-05
发明人： Hisao Ikeda , Kohei Yokoyama , Satoshi Seo
CPC分类号： H01L51/5203 , H01L51/5212 , H01L51/5228 , H01L2251/5361 , H05B33/22 , H05B33/26
摘要： The manufacturing method of the light-emitting device is provided in which an auxiliary electrode in contact with an electrode formed using a transparent conductive film of a light-emitting element is formed using a mask, and direct contact between the auxiliary electrode and an EL layer is prevented by oxidizing the auxiliary electrode. Further, the light-emitting device manufactured according to the method and the lighting device including the light-emitting device are provided.
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