摘要:
A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.
摘要:
A flip chip package mainly comprises a chip, a leadless lead frame. The leadless lead frame has a die paddle and a plurality of leads. The active surface of the chip has a plurality of bonding pads formed thereon. Besides, a plurality of bumps formed on the bonding pads are electrically connected to the chip, the leads and the die paddle. Therein, the die paddle electrically connected to the chip via the bumps not only prevents the chip from being dislocated but also provides another grounding and heat transmission paths to enhance the electrical, thermal and mechanical performance of the flip chip package. Similarly, the bumps formed on the bonding pads of the chip are electrically connected to the leads so as to fix the chip to the lead frame more securely.
摘要:
A flip chip interconnected structure comprises a chip having an active surface in which a plurality of bonding pads are formed on the active surface of the chip. A substrate has a surface and a chip locating region. The chip locating region is on the surface of the substrate and a plurality of nodes are formed on the chip locating region. A plurality of solder balls are respectively connected to the bonding pads and the nodes. The solder balls have various sizes. The chip is bonded to the chip locating region of the substrate by the solder balls.
摘要:
A light-emitting device comprises a substrate, and a light-emitting structure formed on the substrate. The light-emitting structure comprises a first active layer emitting the light with a first wavelength, and a second active layer emitting the light with a second wavelength. The light-emitting structure is formed by the first active layer and the second active layer stacked alternately.
摘要:
A light-emitting device comprises a substrate, and a light-emitting structure formed on the substrate. The light-emitting structure comprises a first active layer emitting the light with a first wavelength, and a second active layer emitting the light with a second wavelength. The light-emitting structure is formed by the first active layer and the second active layer stacked alternately.
摘要:
A polarity-reversible dimming controller having function of switching light source has a power supply module and a dimming control module. The dimming control module receives an external PWM dimming signal to control a feedback signal of the power supply module so as to dim or power on/off an LED lamp. The dimming control module has an output current switching circuit, a switch control circuit and a dimming control circuit. The output current switching circuit performs a PWM control over a current outputted from the power supply module by using the external PWM dimming signal to maintain chromacity of the LED lamp as a constant. The switch control circuit turns off the PWM controller to enter a standby mode for saving power once the PWM dimming signal exceeds a threshold value. As a full-wave rectification is performed on the PWM dimming signal, the polarity match issue upon assembling can be disregarded.
摘要:
A solar cell includes a substrate; a buffer layer located on the substrate; a SixGe(1-x) bottom cell located on the buffer layer; a first tunneling layer located on the SixGe(1-x) bottom cell; a GaNyAs(1-y) middle cell located on the first tunneling layer; a second tunneling cell located on the GaNyAs(1-y) middle cell; a GazIn(1-z)P top cell located on the second tunneling layer; and a contact layer located on the GazIn(1-z)P top cell.
摘要:
A current-sharing power supply apparatus includes a conversion circuit, a square-wave generating circuit, a resonant circuit, a rectifier circuit, and a filter circuit. The conversion circuit has two transformers, and each of the transformers has a primary winding and at least one secondary winding. More particularly, two secondary windings of the two transformers are electrically connected in series. The square-wave generating circuit is electrically connected to a DC voltage to switch the DC voltage into a pulsating voltage. The resonant circuit is electrically connected to the square-wave generating circuit, and having a first capacitor and the primary windings of the transformers. The rectifier circuit has at least two switch components, and electrically connected to the secondary windings of the transformers to rectify an AC output voltage into a rectified voltage, and the rectified voltage is outputted to at least one voltage output terminal.
摘要:
A method for balancing molding flow during the assembly of semiconductor packages with defective carrying units includes providing a chip carrier, which includes a number of good carrying units and at least a defective carrying unit. Then, a number of chips are attached to the good carrying units of the chip carrier, and a chip-imitative glue is formed on the defective carrying unit of the chip carrier. Next, a molding compound is formed on the chip carrier via molding to seal the chips and the chip-imitative glue, thereby improving the balance of molding flow.
摘要:
A Stackable package module comprises a plurality of semiconductor devices in stack. One of the semiconductor devices includes a chip with an active surface and a corresponding back surface, a plurality of solder bumps and a plurality of stud bumps. The solder bumps are formed on the active surface. The stud bumps are formed on the back surface. Each stud bump has a bump body and a protruding trail by wire-bonding and cutting. Bumps of another package are bonded on the stub bumps for replacing known intermediate substrate in conventional stacked package module.