Contact sensor package structure
    11.
    发明申请
    Contact sensor package structure 有权
    接触传感器封装结构

    公开(公告)号:US20050274597A1

    公开(公告)日:2005-12-15

    申请号:US10868496

    申请日:2004-06-14

    IPC分类号: H03K17/975

    摘要: A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.

    摘要翻译: 接触传感器封装具有衬底,膜,密封剂和设置在衬底上的多个接触传感器。 接触传感器设置在由基板,膜和密封剂限定的封闭空间内。 接触传感器封装还具有至少形成在基板上的接地导电迹线和形成在膜的表面上并电连接到接地导电迹线的静电电荷耗散层。 静电电荷耗散层具有作为用于检测接触工件的接触面的上表面。

    LIGHT-EMITTING DEVICE
    15.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号:US20120138892A1

    公开(公告)日:2012-06-07

    申请号:US13313645

    申请日:2011-12-07

    IPC分类号: H01L33/04

    CPC分类号: H01L27/15 H01L33/08 H01L33/32

    摘要: A light-emitting device comprises a substrate, and a light-emitting structure formed on the substrate. The light-emitting structure comprises a first active layer emitting the light with a first wavelength, and a second active layer emitting the light with a second wavelength. The light-emitting structure is formed by the first active layer and the second active layer stacked alternately.

    摘要翻译: 发光器件包括衬底和形成在衬底上的发光结构。 发光结构包括发射具有第一波长的光的第一有源层和发射具有第二波长的光的第二有源层。 发光结构由交替堆叠的第一有源层和第二有源层形成。

    Polarity-reversible dimming controller having function of switching light source
    16.
    发明申请
    Polarity-reversible dimming controller having function of switching light source 审中-公开
    具有切换光源功能的极性可逆调光控制器

    公开(公告)号:US20120019158A1

    公开(公告)日:2012-01-26

    申请号:US12804493

    申请日:2010-07-22

    IPC分类号: H05B37/02

    CPC分类号: H05B33/0884 H05B33/0851

    摘要: A polarity-reversible dimming controller having function of switching light source has a power supply module and a dimming control module. The dimming control module receives an external PWM dimming signal to control a feedback signal of the power supply module so as to dim or power on/off an LED lamp. The dimming control module has an output current switching circuit, a switch control circuit and a dimming control circuit. The output current switching circuit performs a PWM control over a current outputted from the power supply module by using the external PWM dimming signal to maintain chromacity of the LED lamp as a constant. The switch control circuit turns off the PWM controller to enter a standby mode for saving power once the PWM dimming signal exceeds a threshold value. As a full-wave rectification is performed on the PWM dimming signal, the polarity match issue upon assembling can be disregarded.

    摘要翻译: 具有切换光源功能的极性可逆调光控制器具有电源模块和调光控制模块。 调光控制模块接收外部PWM调光信号,以控制电源模块的反馈信号,以使LED灯变暗或加电。 调光控制模块具有输出电流切换电路,开关控制电路和调光控制电路。 输出电流切换电路通过使用外部PWM调光信号对从电源模块输出的电流进行PWM控制,以将LED灯的色度维持为常数。 一旦PWM调光信号超过阈值,开关控制电路关闭PWM控制器进入待机模式,以节省电力。 由于对PWM调光信号进行全波整流,因此可以忽略组装时的极性匹配问题。

    Multi-Junction Solar Cell
    17.
    发明申请
    Multi-Junction Solar Cell 审中-公开
    多功能太阳能电池

    公开(公告)号:US20110083729A1

    公开(公告)日:2011-04-14

    申请号:US12896824

    申请日:2010-10-01

    IPC分类号: H01L31/06

    CPC分类号: H01L31/0687 Y02E10/544

    摘要: A solar cell includes a substrate; a buffer layer located on the substrate; a SixGe(1-x) bottom cell located on the buffer layer; a first tunneling layer located on the SixGe(1-x) bottom cell; a GaNyAs(1-y) middle cell located on the first tunneling layer; a second tunneling cell located on the GaNyAs(1-y) middle cell; a GazIn(1-z)P top cell located on the second tunneling layer; and a contact layer located on the GazIn(1-z)P top cell.

    摘要翻译: 太阳能电池包括基板; 位于所述基板上的缓冲层; 位于缓冲层上的SixGe(1-x)底单元; 位于SixGe(1-x)底部单元上的第一隧道层; 位于第一隧穿层上的GaNyAs(1-y)中间电池; 位于GaN yAs(1-y)中间单元上的第二隧道单元; 位于第二隧道层上的GazIn(1-z)P顶部单元; 以及位于GazIn(1-z)P顶部电池上的接触层。

    CURRENT-SHARING POWER SUPPLY APPARATUS
    18.
    发明申请
    CURRENT-SHARING POWER SUPPLY APPARATUS 审中-公开
    电流共享电源设备

    公开(公告)号:US20110058392A1

    公开(公告)日:2011-03-10

    申请号:US12554856

    申请日:2009-09-04

    IPC分类号: H02M3/335

    CPC分类号: H02M3/33569 Y02B70/1433

    摘要: A current-sharing power supply apparatus includes a conversion circuit, a square-wave generating circuit, a resonant circuit, a rectifier circuit, and a filter circuit. The conversion circuit has two transformers, and each of the transformers has a primary winding and at least one secondary winding. More particularly, two secondary windings of the two transformers are electrically connected in series. The square-wave generating circuit is electrically connected to a DC voltage to switch the DC voltage into a pulsating voltage. The resonant circuit is electrically connected to the square-wave generating circuit, and having a first capacitor and the primary windings of the transformers. The rectifier circuit has at least two switch components, and electrically connected to the secondary windings of the transformers to rectify an AC output voltage into a rectified voltage, and the rectified voltage is outputted to at least one voltage output terminal.

    摘要翻译: 分流电源装置包括转换电路,方波发生电路,谐振电路,整流电路和滤波电路。 转换电路具有两个变压器,并且每个变压器具有初级绕组和至少一个次级绕组。 更具体地,两个变压器的两个次级绕组串联电连接。 方波发生电路与直流电压电连接,将直流电压切换成脉动电压。 谐振电路电连接到方波发生电路,并且具有第一电容器和变压器的初级绕组。 整流电路具有至少两个开关部件,与变压器的次级绕组电连接,将交流输出电压整流为整流电压,整流电压输出至少一个电压输出端子。

    Stacked package module
    20.
    发明申请
    Stacked package module 有权
    堆叠封装模块

    公开(公告)号:US20050082656A1

    公开(公告)日:2005-04-21

    申请号:US10934409

    申请日:2004-09-07

    IPC分类号: H01L25/065 H01L23/02

    摘要: A Stackable package module comprises a plurality of semiconductor devices in stack. One of the semiconductor devices includes a chip with an active surface and a corresponding back surface, a plurality of solder bumps and a plurality of stud bumps. The solder bumps are formed on the active surface. The stud bumps are formed on the back surface. Each stud bump has a bump body and a protruding trail by wire-bonding and cutting. Bumps of another package are bonded on the stub bumps for replacing known intermediate substrate in conventional stacked package module.

    摘要翻译: 可堆叠封装模块包括堆叠中的多个半导体器件。 半导体器件中的一个包括具有活性表面和对应的背面的芯片,多个焊料凸块和多个凸块凸块。 焊料凸块形成在有源表面上。 柱形凸块形成在背面。 每个柱形凸起具有凸起体和通过引线接合和切割的突出轨迹。 另一个封装的凸块被结合在短截线凸起上,用于替代传统堆叠封装模块中的已知中间衬底。