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32 条记录 (耗时 0.025 秒)

    SOLDER ALLOY
    11.
    发明申请
    SOLDER ALLOY 有权
    焊接合金

    公开(公告)号：US20130343809A1

    公开(公告)日：2013-12-26

    申请号：US13261681

    申请日：2012-04-09

    申请人： Seiko Ishibashi ,  Shunsaku Yoshikawa ,  Tsukasa Ohnishi

    发明人： Seiko Ishibashi ,  Shunsaku Yoshikawa ,  Tsukasa Ohnishi

    IPC分类号： B23K35/26

    CPC分类号： B23K35/262 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K35/02 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K2101/36 ,  C22C13/00 ,  H05K3/3463 ,  Y10T403/479

    摘要： A Sn—Ag—Cu based solder alloy capable of increasing the connection reliability of a solder joint when evaluated in a high temperature environment is provided. The alloy has an alloy composition consisting essentially of, in mass percent, Ag: 1.0-5.0%, Cu: 0.1-1.0%, Sb: 0.005-0.025%, Fe: 0.005-0.015%, and a remainder of Sn. The Fe content in mass percent is 0.006-0.014%. The Sb content in mass percent is 0.007-0.023%. Preferably Fe:Sb as a mass ratio is 20:80-60:40. The total content of Fe and Sb is preferably 0.012-0.032%.

    摘要翻译： 提供了一种在高温环境下进行评估时能够提高焊点的连接可靠性的Sn-Ag-Cu系焊锡合金。 合金的合金组成主要由Ag：1.0-5.0％，Cu：0.1-1.0％，Sb：0.005-0.025％，Fe：0.005-0.015％，余量的Sn组成。 Fe含量以质量百分比计为0.006-0.014％。 Sb含量以质量百分比计为0.007-0.023％。 优选Fe：Sb的质量比为20:80-60:40。 Fe和Sb的总含量优选为0.012〜0.032％。

    Lead-Free Solder
    14.
    发明申请
    Lead-Free Solder 审中-公开
    无铅焊锡

    公开(公告)号：US20070243098A1

    公开(公告)日：2007-10-18

    申请号：US11578827

    申请日：2004-07-29

    申请人： Tsukasa Ohnishi ,  Tokuro Yamaki ,  Masazumi Amagai ,  Masako Watanabe

    发明人： Tsukasa Ohnishi ,  Tokuro Yamaki ,  Masazumi Amagai ,  Masako Watanabe

    IPC分类号： C22C13/00

    CPC分类号： B23K35/262 ,  B23K2101/36 ,  C22C13/00

    摘要： [Problem]Mobile electronic equipment is often dropped during use or transport, and the soldered joints of electronic parts sometimes peel off due to the impact when dropped. In addition, they undergo heat cycles in which internal coils, resistors, and the like generate heat and soldered joints increase in temperature during operation of electronic equipment and cool off during periods of non-use. With a conventional Sn—Ag base lead-free solder, the impact resistance and resistance to heat cycles of minute portions such as solder bumps were not adequate. The present invention provides a lead-free solder alloy, bumps of which have excellent impact resistance and resistance to heat cycles. Means for Solving the Problem The present invention is a lead-free solder alloy comprising 0.1—less than 2.0 mass % of Ag, 0.01-0.1 mass % of Cu, 0.005-0.1 mass % of Zn, and a remainder of Sn, to which Ga, Ge, or P may be added, and to which Ni or Co may be further added.

    摘要翻译： [问题]移动电子设备在使用或运输过程中经常掉落，电子部件的焊接接头在掉线时有时会因为冲击而脱落。 此外，它们经历热循环，其中内部线圈，电阻器等产生热量和焊接接头在电子设备操作期间温度升高，并在不使用期间冷却。 使用常规的Sn-Ag基底无铅焊料，耐冲击性和耐冲击等微小部分的热循环不足。 本发明提供一种无铅焊料合金，其具有优异的耐冲击性和耐热循环性。 解决问题的手段本发明是一种无铅焊料合金，其包含0.1质量％以下的Ag，0.01质量％以下的Cu，0.01〜0.1质量％的Cu，0.005〜0.1质量％的Zn和余量的Sn， 可以添加Ga，Ge或P，并且可以进一步添加Ni或Co。

    Lead-free solder and soldered article
    15.
    发明授权
    Lead-free solder and soldered article 有权
    无铅焊料和焊接制品

    公开(公告)号：US07282174B2

    公开(公告)日：2007-10-16

    申请号：US10533288

    申请日：2003-10-31

    申请人： Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima ,  Toshihiko Taguchi ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi

    发明人： Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima ,  Toshihiko Taguchi ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi

    IPC分类号： B23K35/26

    CPC分类号： B23K35/262 ,  H05K3/3463

    摘要： The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn—Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.

    摘要翻译： 本发明提供一种Sn-Zn基无铅焊料，即使在焊接了由Cu制成的部分焊接之后的长时间内，也可以防止焊料从焊接部分剥离。 根据本发明的Sn-Zn基无铅焊料包含5-10质量％的Zn，总共0.005-1.0质量％的至少一种选自Au，Pt，Pd，Fe， 和Sb，任选地总共至多15质量％的选自Bi和In的至少一种物质和余量的Sn。 可以使用含有卤化物如胺盐酸盐作为活化剂的松香助熔剂将该Sn-Zn基无铅焊料制成焊膏。

    Lead-free solder
    16.
    发明授权
    Lead-free solder 有权
    无铅焊料

    公开(公告)号：US07172726B2

    公开(公告)日：2007-02-06

    申请号：US10682305

    申请日：2003-10-10

    申请人： Tsukasa Ohnishi

    发明人： Tsukasa Ohnishi

    IPC分类号： C22C13/00 ,  B23K35/26

    CPC分类号： C23C2/04 ,  B23K35/262 ,  C22C13/00

    摘要： A lead-free solder which is significantly less susceptible to copper leaching when used in a molten state in which coil ends of copper wire are dipped comprises 1.5–8 mass % of Cu, 0.01–2 mass % of Co, optionally 0.01–1 mass % of Ni, and a remainder of Sn and has a liquidus temperature of 420° C. or below. The solder may further comprise at least one oxidation-inhibiting element selected from the group consisting of P, Ge, and Ga in a total amount of 0.001–0.5 mass %, and/or Ag in an amount of 0.05–2 mass % as a wettability-improving element.

    摘要翻译： 浸渍铜线圈端的熔融状态下使用时，对铜浸出的影响明显较小的无铅焊料含有1.5〜8质量％的Cu，0.01〜2质量％的Co，0.01〜1质量％ 的Ni，余量为Sn，液相线温度为420℃以下。 该焊料可以进一步包含总量为0.001-0.5质量％的选自P，Ge和Ga的至少一种氧化抑制元素，和/或0.05-2质量％的Ag作为 润湿性改善元件。

    Lead-free solder and soldered article
    17.
    发明申请
    Lead-free solder and soldered article 有权
    无铅焊料和焊接制品

    公开(公告)号：US20060102690A1

    公开(公告)日：2006-05-18

    申请号：US10533288

    申请日：2003-10-31

    申请人： Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima ,  Toshihiko Taguchi ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi

    发明人： Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima ,  Toshihiko Taguchi ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi

    IPC分类号： B23K35/14

    CPC分类号： B23K35/262 ,  H05K3/3463

    摘要： The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn—Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.

    摘要翻译： 本发明提供一种Sn-Zn基无铅焊料，即使在焊接了由Cu制成的部分焊接之后的长时间内，也可以防止焊料从焊接部分剥离。 根据本发明的Sn-Zn基无铅焊料包含5-10质量％的Zn，总共0.005-1.0质量％的至少一种选自Au，Pt，Pd，Fe， 和Sb，任选地总共至多15质量％的选自Bi和In的至少一种物质和余量的Sn。 可以使用含有卤化物如胺盐酸盐作为活化剂的松香助熔剂将该Sn-Zn基无铅焊料制成焊膏。

    Lead-free solder
    19.
    发明授权
    Lead-free solder 有权
    无铅焊料

    公开(公告)号：US08220692B2

    公开(公告)日：2012-07-17

    申请号：US12736624

    申请日：2009-04-21

    申请人： Tsukasa Ohnishi ,  Toshihiko Taguchi

    发明人： Tsukasa Ohnishi ,  Toshihiko Taguchi

    IPC分类号： B23K35/00 ,  B23K35/22

    CPC分类号： C22C13/00 ,  B23K35/262 ,  C22C13/02 ,  H05K3/3463

    摘要： An inexpensive lead-free solder which prevents the occurrence of tin pest at extremely low temperatures and which has good wettability and impact resistance has a composition consisting essentially of, in mass %, Cu: 0.5-0.8%, Bi: at least 0.1% and less than 1%, Ni: 0.02-0.04%, and a remainder of Sn.

    摘要翻译： 防止在极低温下发生锡害虫并且具有良好的润湿性和耐冲击性的廉价的无铅焊料具有以质量％计以Cu：0.5-0.8％，Bi：至少0.1％和 小于1％，Ni：0.02-0.04％，余量为Sn。

    Lead-free solder alloy
    20.
    发明授权
    Lead-free solder alloy 有权
    无铅焊料合金

    公开(公告)号：US08216395B2

    公开(公告)日：2012-07-10

    申请号：US12659815

    申请日：2010-03-22

    申请人： Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

    发明人： Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

    IPC分类号： C22C13/00

    CPC分类号： B23K1/0016 ,  B23K1/085 ,  B23K1/203 ,  B23K35/22 ,  B23K35/262 ,  B23K2101/42 ,  C22C13/00 ,  Y10T428/12708

    摘要： A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.

    摘要翻译： 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金可以进一步包含总量最多为4重量％的Ag和Sb中的至少一种，和/或至少一种Ni，Co，Fe，Mn，Cr和Mo中的至少一种 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn中的至少一种，总量为5重量％以下。