公开(公告)号：US20160027740A1

公开(公告)日：2016-01-28

申请号：US14463999

申请日：2014-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L23/552 ,  H01L21/78 ,  H01L21/50 ,  H01L23/28

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

Abstract translation: 封装结构包括载体，布置在载体上的电子部件，形成在载体上用于封装电子部件的密封剂，形成在密封剂上的第一屏蔽层和形成在第一屏蔽层上的第二屏蔽层。 第一和第二屏蔽层由不同的材料制成。 通过形成在封装层上的多个屏蔽层，电子部件被保护免受电磁干扰。 本发明还提供一种制造封装结构的方法。

公开(公告)号：US20140353850A1

公开(公告)日：2014-12-04

申请号：US13971189

申请日：2013-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen ,  Chih-Ming Cheng ,  Yude Chu

IPC: H01L23/52 ,  H01L21/56 ,  H01L23/28 ,  H01L23/12 ,  H01L23/00

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/552 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.

Abstract translation: 公开了一种半导体封装，其包括：电路板; 布置在电路板上的载体; 布置在载体上的RF芯片; 电连接RF芯片的电极焊盘和电路板的多个高级焊接线; 以及形成在电路板上用于封装载体，高电平接合线和RF芯片的密封剂。 本发明将RF芯片定位在高水平，以便于电路板上的元件布置和高频布线，从而实现高度集成的无线SiP（系统级封装）模块。

公开(公告)号：US20140210672A1

公开(公告)日：2014-07-31

申请号：US14107446

申请日：2013-12-16

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Chih-Hsien Chiu ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Yude Chu

IPC: H01Q1/38

Abstract: An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.

Abstract translation: 提供一种电子封装结构，包括基板，设置在基板上的封装密封剂，以及对应于封装密封剂的布置区域的天线结构，并具有第一延伸层，设置在基板上的第二延伸层和 连接部分设置在第一延伸层和第二延伸层之间并且电连接到第一延伸层和第二延伸层。 通过在封装密封剂的配置区域上形成天线结构，不需要扩大基板，因此电子封装结构满足小型化要求。

公开(公告)号：US11764162B2

公开(公告)日：2023-09-19

申请号：US16997173

申请日：2020-08-19

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2924/3025

Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.

公开(公告)号：US20210210435A1

公开(公告)日：2021-07-08

申请号：US16997173

申请日：2020-08-19

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.

公开(公告)号：US09899335B2

公开(公告)日：2018-02-20

申请号：US15298480

申请日：2016-10-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L21/00 ,  H01L23/52 ,  H01L23/58 ,  H01L23/552 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

公开(公告)号：US09508656B2

公开(公告)日：2016-11-29

申请号：US14463999

申请日：2014-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L23/552 ,  H05K3/30 ,  H01L21/78 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

Abstract translation: 封装结构包括载体，布置在载体上的电子部件，形成在载体上用于封装电子部件的密封剂，形成在密封剂上的第一屏蔽层和形成在第一屏蔽层上的第二屏蔽层。 第一和第二屏蔽层由不同的材料制成。 通过形成在封装层上的多个屏蔽层，电子部件被保护免受电磁干扰。 本发明还提供一种制造封装结构的方法。

公开(公告)号：US09502377B2

公开(公告)日：2016-11-22

申请号：US13971189

申请日：2013-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen ,  Chih-Ming Cheng ,  Yude Chu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/433 ,  H01L25/065 ,  H01L23/31 ,  H01L23/552 ,  H01L23/66

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/552 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.

Abstract translation: 公开了一种半导体封装，其包括：电路板; 布置在电路板上的载体; 布置在载体上的RF芯片; 电连接RF芯片的电极焊盘和电路板的多个高级焊接线; 以及形成在电路板上用于封装载体，高电平接合线和RF芯片的密封剂。 本发明将RF芯片定位在高水平，以便于电路板上的元件布置和高频布线，从而实现高度集成的无线SiP（系统级封装）模块。

公开(公告)号：US20160155559A1

公开(公告)日：2016-06-02

申请号：US14695076

申请日：2015-04-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Ming-Fan Tsai ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01F27/28 ,  H01L23/522 ,  H01F27/02 ,  H01L23/498 ,  H01F27/24 ,  H01L23/31 ,  H01L23/528

CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H01F27/022 ,  H01F27/24 ,  H01F2027/2809 ,  H01L23/49822 ,  H01L23/645 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic package is provided, including a substrate body, a ferromagnetic material embedded in the substrate body, and a conductor structure disposed around the conductor structure. Therefore, the conductor structure generates high magnetic flux and thus increases inductance.

Abstract translation: 提供了一种电子封装，包括基板主体，嵌入在基板主体中的铁磁材料，以及设置在导体结构周围的导体结构。 因此，导体结构产生高磁通量，从而增加电感。