公开(公告)号：US20180096943A1

公开(公告)日：2018-04-05

申请号：US15794012

申请日：2017-10-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/538 ,  H01L21/48 ,  H01L25/00 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/18 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: An integrated fan-out package including a die attach film, an integrated circuit component, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit component is disposed on the die attach film and includes a plurality of conductive terminals. The die attach film includes an uplifted edge which raises toward sidewalls of the integrated circuit component. The insulating encapsulation encapsulates the uplifted edge and the integrated circuit component. The redistribution circuit structure is disposed on the integrated circuit component and the insulating encapsulation, and the redistribution circuit structure is electrically connected to the conductive terminals of the integrated circuit component. A method of fabricating the integrated fan-out package are also provided.

公开(公告)号：US20180025986A1

公开(公告)日：2018-01-25

申请号：US15215594

申请日：2016-07-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/538 ,  H01L23/66 ,  H01L23/31 ,  H01L49/02

CPC classification number: H01L23/5389 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L28/10 ,  H01L2221/68359 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/97

Abstract: A semiconductor device including an integrated circuit, a protection layer, and a conductive via is provided. The integrated circuit includes at least one conductive pad. The protection layer covers the integrated circuit. The protection layer includes a contact opening, and the conductive pad is exposed by the contact opening of the protection layer. The conductive via is embedded in the contact opening of the protection layer, and the conductive via is electrically connected to the conductive pad through the contact opening. A method of fabricating the above-mentioned semiconductor device and an integrated fan-out package including the above-mentioned semiconductor device are also provided.

公开(公告)号：US10515899B2

公开(公告)日：2019-12-24

申请号：US15284425

申请日：2016-10-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Hsin-Chieh Huang ,  Ching-Fu Chang

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

Abstract: A package structure is provided. The package structure includes a molding compound. The package structure also includes an integrated circuit chip having a chip edge in the molding compound. The package structure further includes a passivation layer below the integrated circuit chip and the molding compound. In addition, the package structure includes a redistribution layer in the passivation layer. The package structure also includes first bumps electrically connected to the integrated circuit chip through the redistribution layer. The first bumps are inside the chip edge and arranged along the chip edge. The package structure further includes second bumps electrically connected to the integrated circuit chip through the redistribution layer. The second bumps are outside the chip edge and arranged along the chip edge. The first bumps are next to the second bumps. The first and second bumps are spaced apart from the chip edge.

公开(公告)号：US20190131243A1

公开(公告)日：2019-05-02

申请号：US16234620

申请日：2018-12-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56 ,  H01L25/10 ,  H01L25/00

Abstract: An integrated fan-out package including a die attach film, an integrated circuit component, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit component is disposed on the die attach film and includes a plurality of conductive terminals. The die attach film includes an uplifted edge which raises toward sidewalls of the integrated circuit component. The insulating encapsulation encapsulates the uplifted edge and the integrated circuit component. The redistribution circuit structure is disposed on the integrated circuit component and the insulating encapsulation, and the redistribution circuit structure is electrically connected to the conductive terminals of the integrated circuit component. A method of fabricating the integrated fan-out package are also provided.

公开(公告)号：US10170430B2

公开(公告)日：2019-01-01

申请号：US15794012

申请日：2017-10-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L21/48 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L25/10 ,  H01L25/00 ,  H01L23/498

Abstract: An integrated fan-out package including a die attach film, an integrated circuit component, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit component is disposed on the die attach film and includes a plurality of conductive terminals. The die attach film includes an uplifted edge which raises toward sidewalls of the integrated circuit component. The insulating encapsulation encapsulates the uplifted edge and the integrated circuit component. The redistribution circuit structure is disposed on the integrated circuit component and the insulating encapsulation, and the redistribution circuit structure is electrically connected to the conductive terminals of the integrated circuit component. A method of fabricating the integrated fan-out package are also provided.

公开(公告)号：US10109589B2

公开(公告)日：2018-10-23

申请号：US15794006

申请日：2017-10-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L25/10 ,  H01L25/00

Abstract: An integrated fan-out package including a die attach film, an integrated circuit component, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit component is disposed on the die attach film and includes a plurality of conductive terminals. The die attach film includes an uplifted edge which raises toward sidewalls of the integrated circuit component. The insulating encapsulation encapsulates the uplifted edge and the integrated circuit component. The redistribution circuit structure is disposed on the integrated circuit component and the insulating encapsulation, and the redistribution circuit structure is electrically connected to the conductive terminals of the integrated circuit component. A method of fabricating the integrated fan-out package are also provided.

公开(公告)号：US20170345762A1

公开(公告)日：2017-11-30

申请号：US15281043

申请日：2016-09-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Chien-Chia Chiu ,  Hsin-Chieh Huang ,  Tsung-Shu Lin ,  Pei-Ti Yu

IPC: H01L23/538 ,  H01L25/10

CPC classification number: H01L23/5386 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/568 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311

Abstract: A conductive pattern including a teardrop shaped portion, a routing line, and a connection portion is provided. The routing line links to the teardrop shaped portion through the connection portion, and a width of the connection portion decreases along an extending direction from the teardrop shaped portion to the routing line. Furthermore, an integrated fan-out package including the above-mentioned conductive pattern is also provided.

公开(公告)号：US20170338196A1

公开(公告)日：2017-11-23

申请号：US15156339

申请日：2016-05-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/768 ,  H01L23/31 ,  H01L21/3105 ,  H01L23/48 ,  H01L23/544 ,  H01L25/065 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L24/14 ,  H01L21/31053 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76885 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3192 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/06 ,  H01L24/20 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/059 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2924/14 ,  H01L2224/03 ,  H01L2924/014

Abstract: An integrated fan-out package including an integrated circuit, an insulating encapsulation, a plurality of conductive through vias, and a redistribution circuit structure is provided. The integrated circuit includes a plurality of conductive terminals. The insulating encapsulation encapsulates sidewalls of the integrated circuit. The conductive through vias penetrate in the insulating encapsulation. The redistribution circuit structure is disposed on the integrated circuit, the conductive through vias and the insulating encapsulation. The redistribution conductive layer is electrically connected to the conductive terminals and the conductive through vias. A plurality of first contact surfaces of the conductive terminals and a plurality of second contact surfaces of the conductive through vias are in contact with the redistribution circuit structure, and a roughness of the first contact surfaces and the second contact surfaces ranges from 100 angstroms to 500 angstroms. Methods of fabricating the integrated fan-out package are also provided.