公开(公告)号：US11664300B2

公开(公告)日：2023-05-30

申请号：US16727159

申请日：2019-12-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chiang Tsao ,  Chao-Wei Chiu ,  Hsuan-Ting Kuo ,  Chia-Lun Chang ,  Cheng-Shiuan Wong ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/16 ,  H01L21/48 ,  H01L43/04 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/49822 ,  H01L24/16 ,  H01L21/4803 ,  H01L21/4807 ,  H01L2224/16227

Abstract: A device may include a first package and a second package where the first package has a warped shape. First connectors attached to a redistribution structure of the first package include a spacer embedded therein. Second connectors attached to the redistribution structure are fee from the spacer, the spacer of the first connectors keeping a minimum distance between the first package and the second package during attaching the first package to the second package.

公开(公告)号：US20230154896A1

公开(公告)日：2023-05-18

申请号：US18149509

申请日：2023-01-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Meng-Tse Chen ,  Chung-Shi Liu ,  Chih-Wei Lin ,  Hui-Min Huang ,  Hsuan-Ting Kuo ,  Ming-Da Cheng

IPC: H01L25/065 ,  H01L21/56 ,  H01L25/00 ,  H01L21/768 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/568 ,  H01L25/50 ,  H01L21/565 ,  H01L21/76804 ,  H01L21/7684 ,  H01L21/76883 ,  H01L25/0652 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06524 ,  H01L2224/18 ,  H01L2224/04105 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/12105

Abstract: An embodiment is method including forming a first die package over a carrier substrate, the first die package comprising a first die, forming a first redistribution layer over and coupled to the first die, the first redistribution layer including one or more metal layers disposed in one or more dielectric layers, adhering a second die over the redistribution layer, laminating a first dielectric material over the second die and the first redistribution layer, forming first vias through the first dielectric material to the second die and forming second vias through the first dielectric material to the first redistribution layer, and forming a second redistribution layer over the first dielectric material and over and coupled to the first vias and the second vias.

公开(公告)号：US20210091047A1

公开(公告)日：2021-03-25

申请号：US17113676

申请日：2020-12-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Meng-Tse Chen ,  Chung-Shi Liu ,  Chih-Wei Lin ,  Hui-Min Huang ,  Hsuan-Ting Kuo ,  Ming-Da Cheng

IPC: H01L25/065 ,  H01L21/56 ,  H01L25/00 ,  H01L21/768 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00

Abstract: An embodiment is method including forming a first die package over a carrier substrate, the first die package comprising a first die, forming a first redistribution layer over and coupled to the first die, the first redistribution layer including one or more metal layers disposed in one or more dielectric layers, adhering a second die over the redistribution layer, laminating a first dielectric material over the second die and the first redistribution layer, forming first vias through the first dielectric material to the second die and forming second vias through the first dielectric material to the first redistribution layer, and forming a second redistribution layer over the first dielectric material and over and coupled to the first vias and the second vias.

公开(公告)号：US10535644B1

公开(公告)日：2020-01-14

申请号：US16059052

申请日：2018-08-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsuan-Ting Kuo ,  Ching-Hua Hsieh ,  Cheng-Ting Chen ,  Hsiu-Jen Lin ,  Hao-Jan Pei ,  Yu-Peng Tsai ,  Chia-Lun Chang ,  Chih-Chiang Tsao ,  Philip Yu-shuan Chung

IPC: H01L23/00 ,  H01L25/00 ,  H01L23/31 ,  H01L27/06 ,  H01L21/56 ,  H01L21/768 ,  H01L23/522 ,  H01L21/683

Abstract: A manufacturing method of a package on package structure includes the following steps. A first package is provided on a tape carrier, wherein the first package includes an encapsulated semiconductor device, a first redistribution structure disposed on a first side of the encapsulated semiconductor device, and a plurality of conductive bumps disposed on the first redistribution structure and attached to the tape carrier. A second package is mounted on the first package through a plurality of electrical terminals by a thermo-compression bonding process, which deforms the conductive bumps into a plurality of deformed conductive bumps. Each of the deformed conductive bumps comprises a base portion connecting the first redistribution structure and a tip portion connecting the base portion, and a curvature of the base portion is substantially smaller than a curvature of the tip portion.

公开(公告)号：US20200006308A1

公开(公告)日：2020-01-02

申请号：US16059052

申请日：2018-08-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsuan-Ting Kuo ,  Ching-Hua Hsieh ,  Cheng-Ting Chen ,  Hsiu-Jen Lin ,  Hao-Jan Pei ,  Yu-Peng Tsai ,  Chia-Lun Chang ,  Chih-Chiang Tsao ,  Philip Yu-shuan Chung

IPC: H01L25/00 ,  H01L23/31 ,  H01L27/06 ,  H01L23/00 ,  H01L21/683 ,  H01L21/56 ,  H01L21/768 ,  H01L23/522

Abstract: A manufacturing method of a package on package structure includes the following steps. A first package is provided on a tape carrier, wherein the first package includes an encapsulated semiconductor device, a first redistribution structure disposed on a first side of the encapsulated semiconductor device, and a plurality of conductive bumps disposed on the first redistribution structure and attached to the tape carrier. A second package is mounted on the first package through a plurality of electrical terminals by a thermo-compression bonding process, which deforms the conductive bumps into a plurality of deformed conductive bumps. Each of the deformed conductive bumps comprises a base portion connecting the first redistribution structure and a tip portion connecting the base portion, and a curvature of the base portion is substantially smaller than a curvature of the tip portion.

公开(公告)号：US20250149495A1

公开(公告)日：2025-05-08

申请号：US18442758

申请日：2024-02-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chao-Wei Chiu ,  Hsiu-Jen Lin ,  Hsuan-Ting Kuo ,  Ching-Hua Hsieh

IPC: H01L23/00 ,  H01L21/52 ,  H01L23/053 ,  H01L23/28

Abstract: A semiconductor package and the method of forming the same are provided. The semiconductor package may include a substrate, a semiconductor package component having a semiconductor die bonded to the substrate, a lid attached to the substrate, and a first composite metal feature between the semiconductor package component and the lid. The first composite metal feature may include a first metal feature having a first material and a second metal feature having a second material. The first material may be an intermetallic compound. The second material may be different from the first material.

公开(公告)号：US20240071952A1

公开(公告)日：2024-02-29

申请号：US18152502

申请日：2023-01-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chiang Tsao ,  Hsuan-Ting Kuo ,  Chao-Wei Chiu ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/538 ,  H01L25/00 ,  H01L25/10

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/08 ,  H01L24/19 ,  H01L24/20 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/90 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/16227 ,  H01L2224/214 ,  H01L2224/81011 ,  H01L2224/81815 ,  H01L2224/92122 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/1427 ,  H01L2924/3511

Abstract: A method includes depositing solder paste over first contact pads of a first package component. Spring connectors of a second package component are aligned to the solder paste. The solder paste is reflowed to electrically and physically couple the spring connectors of the second package component to the first contact pads of the first package component. A device includes a first package component and a second package component electrically and physically coupled to the first package component by way of a plurality of spring coils. Each of the plurality of spring coils extends from the first package component to the second package component.

公开(公告)号：US11830746B2

公开(公告)日：2023-11-28

申请号：US17141835

申请日：2021-01-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Hao-Jan Pei ,  Hsuan-Ting Kuo ,  Chih-Chiang Tsao ,  Jen-Jui Yu ,  Philip Yu-Shuan Chung ,  Chia-Lun Chang ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh

IPC: B23K1/00 ,  H01L21/50 ,  H01L21/48 ,  H01L23/00 ,  H01L21/60

CPC classification number: H01L21/50 ,  B23K1/0016 ,  H01L21/4853 ,  H01L24/10 ,  H01L2021/60135 ,  H01L2021/60225

Abstract: A method includes forming regions of solder paste on a redistribution structure, wherein the solder paste has a first melting temperature; forming solder bumps on an interconnect structure, wherein the solder bumps have a second melting temperature that is greater than the first melting temperature; placing the solder bumps on the regions of solder paste; performing a first reflow process at a first reflow temperature for a first duration of time, wherein the first reflow temperature is less than the second melting temperature; and after performing the first reflow process, performing a second reflow process at a second reflow temperature for a second duration of time, wherein the second reflow temperature is greater than the second melting temperature.

公开(公告)号：US11342321B2

公开(公告)日：2022-05-24

申请号：US16740463

申请日：2020-01-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsuan-Ting Kuo ,  Ching-Hua Hsieh ,  Cheng-Ting Chen ,  Hsiu-Jen Lin ,  Hao-Jan Pei ,  Yu-Peng Tsai ,  Chia-Lun Chang ,  Chih-Chiang Tsao ,  Philip Yu-Shuan Chung

IPC: H01L23/00 ,  H01L25/00 ,  H01L21/56 ,  H01L21/683 ,  H01L21/768 ,  H01L23/31 ,  H01L27/06 ,  H01L23/522

Abstract: A manufacturing method of a package-on-package structure includes at least the following steps. A plurality of conductive bumps of a first package is attached to a tape carrier. A second package is coupled to the first package opposite to the plurality of conductive bumps. When coupling the second package, the plurality of conductive bumps are deformed to form a plurality of deformed conductive bumps, and a contact area between the tape carrier and the respective deformed conductive bump increases.

公开(公告)号：US20210202358A1

公开(公告)日：2021-07-01

申请号：US16727159

申请日：2019-12-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chiang Tsao ,  Chao-Wei Chiu ,  Hsuan-Ting Kuo ,  Chia-Lun Chang ,  Cheng-Shiuan Wong ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: A device may include a first package and a second package where the first package has a warped shape. First connectors attached to a redistribution structure of the first package include a spacer embedded therein. Second connectors attached to the redistribution structure are fee from the spacer, the spacer of the first connectors keeping a minimum distance between the first package and the second package during attaching the first package to the second package.