公开(公告)号：US08558208B2

公开(公告)日：2013-10-15

申请号：US13097375

申请日：2011-04-29

申请人： Ryota Fujitsuka ,  Masahiro Kiyotoshi ,  Katsuyuki Sekine ,  Mitsuru Sato

发明人： Ryota Fujitsuka ,  Masahiro Kiyotoshi ,  Katsuyuki Sekine ,  Mitsuru Sato

IPC分类号： H01L29/02

CPC分类号： H01L45/146 ,  G11C11/5685 ,  G11C13/0007 ,  G11C2213/72 ,  H01L45/1233

摘要： According to one embodiment, there are provided a first electrode, a second electrode, first and second variable-resistance layers that are arranged between the first electrode and the second electrode, and at least one non variable-resistance layer that is arranged so that positions of the first and second variable-resistance layers between the first electrode and the second electrode are symmetrical to each other.

摘要翻译： 根据一个实施例，提供了布置在第一电极和第二电极之间的第一电极，第二电极，第一和第二可变电阻层，以及至少一个非可变电阻层，其被布置成使得位置 在第一电极和第二电极之间的第一和第二可变电阻层彼此对称。

公开(公告)号：US08517519B2

公开(公告)日：2013-08-27

申请号：US13104268

申请日：2011-05-10

申请人： Mitsuru Sato ,  Takatoshi Yamamoto

发明人： Mitsuru Sato ,  Takatoshi Yamamoto

IPC分类号： B41J2/045

CPC分类号： B41J2/1433 ,  B41J2/14274 ,  B41J2/1612 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1645 ,  B41J2/1646

摘要： An ink jet type recording head includes a substrate, a nozzle plate having nozzles, and a sealing sheet, and the substrate and the nozzle plate are bonded to each other through a bonding film, and the substrate and the sealing sheet are bonded to each other through a bonding film. These bonding films are each obtained by drying and/or curing a liquid material containing an epoxy-modified silicone material. Further, by applying energy to each bonding film, the surface thereof is activated, and therefore, each bonding film exhibits a bonding property. By this bonding property, the substrate is bonded to the nozzle plate and to the sealing sheet.

摘要翻译： 喷墨型记录头包括基板，具有喷嘴的喷嘴板和密封片，并且基板和喷嘴板通过接合膜彼此接合，并且基板和密封片彼此接合 通过粘合膜。 这些接合膜各自通过干燥和/或固化含有环氧改性的有机硅材料的液体材料而获得。 此外，通过向每个接合膜施加能量，其表面被激活，因此每个接合膜都具有接合性。 通过这种粘合特性，将基板粘合到喷嘴板和密封片上。

公开(公告)号：US08490265B2

公开(公告)日：2013-07-23

申请号：US12484448

申请日：2009-06-15

申请人： Yukio Hashimoto ,  Masayoshi Kojima ,  Katsunori Kinno ,  Mitsuru Sato

发明人： Yukio Hashimoto ,  Masayoshi Kojima ,  Katsunori Kinno ,  Mitsuru Sato

IPC分类号： B23Q17/00

CPC分类号： B23P19/084 ,  F16D65/0043 ,  F16D65/18 ,  F16D2121/02 ,  Y10T29/49771 ,  Y10T29/49776 ,  Y10T29/49863 ,  Y10T29/4987 ,  Y10T29/53657

摘要： A brake includes an annular boot which can be expanded and contracted according to movements of a piston and is assembled to an opening part of a cylinder and to an annular groove on an outer peripheral face of the piston. The boot is assembled by: engaging one end of the boot with the opening part of the cylinder in a state where the piston is contained in the cylinder; moving the piston so that at least a part of the piston is withdrawn from the cylinder and that the other end of the boot is pressed by a pressing face of the piston; and fitting the other end of the boot into the annular groove of the piston, while a movable range of the other end of the boot is restricted by an expanding allowance of the boot whose one end is engaged with the opening part of the cylinder.

摘要翻译： 制动器包括可根据活塞的运动而膨胀和收缩的环形护罩，并组装到气缸的开口部分和活塞的外周面上的环形槽。 靴子通过以下方式组装：在活塞被容纳在气缸中的状态下，将靴子的一端与气缸的开口部分接合; 移动所述活塞使得所述活塞的至少一部分从所述气缸中退出，并且所述护罩的另一端被所述活塞的按压面按压; 并且将靴子的另一端装配到活塞的环形槽中，同时，靴的另一端的可移动范围通过一端与缸的开口部接合的靴的扩张容限来限制。

公开(公告)号：US08321827B2

公开(公告)日：2012-11-27

申请号：US12693439

申请日：2010-01-25

申请人： Mitsuru Sato

发明人： Mitsuru Sato

IPC分类号： G06F17/50

CPC分类号： G06F17/50 ,  G06F2217/78

摘要： In one embodiment, there is provided a method for a computer aiding a design of a power supply that includes extracting data of one of a plurality of power supplies of an apparatus from product data about the apparatus, extracting data of a power supply system from power supply system data, the one of the plurality power supplies system is not allocated to any of the plurality of power supplies of the apparatus and associating the extracted data of the power supply with the extracted data of the power supply system in power supply allocation result data.

摘要翻译： 在一个实施例中，提供了一种用于计算机辅助电源设计的方法，该方法包括从关于该设备的产品数据提取设备的多个电源中的一个电源的数据，从电力提取电源系统的数据 供电系统数据，多个电力供应系统中的一个不分配给设备的多个电源中的任一个，并且将提取的电源数据与电源系统的提取数据在电源分配结果数据中相关联 。

公开(公告)号：US08171439B2

公开(公告)日：2012-05-01

申请号：US12396722

申请日：2009-03-03

申请人： Mitsuru Sato

发明人： Mitsuru Sato

IPC分类号： G06F9/455 ,  G06F17/50

CPC分类号： G06F17/5081

摘要： A warning device checks for errors in design object data and issues a warning for detected errors by storing allowance information, which allows issuance of warning prevention, cancel information, which cancels relevant allowance information to permit issuance of warning for each error identification, and instruction identification, which identifies an edit command for editing generated design object data for error identification. When said edit command is accepted, the error identification for the instruction identification of edit command is acquired. Cancel information can be registered for error identification. Respective errors corresponding to error identifications are checked, when an operation for checking the design object data is accepted, and when a type of an error is identified, whether to issue a warning based on the allowance information and cancel information for relevant error identification is determined.

摘要翻译： 警告装置检查设计对象数据中的错误，并通过存储允许信息发出警告，发出警告预防，取消信息，取消相关津贴信息，以便发出每个错误标识的警告，并指示识别 ，其标识用于编辑用于错误识别的生成的设计对象数据的编辑命令。 当接受编辑命令时，获取编辑命令的指令识别的错误识别。 可以注册取消信息进行错误识别。 检查对应于错误识别的各个错误，当接受用于检查设计对象数据的操作时，并且当识别出类型的错误时，确定是否基于允许信息发出警告和相关错误识别的取消信息 。

公开(公告)号：US08034175B2

公开(公告)日：2011-10-11

申请号：US11389079

申请日：2006-03-27

申请人： Sumio Utsunomiya ,  Mitsuru Sato

发明人： Sumio Utsunomiya ,  Mitsuru Sato

IPC分类号： C23C16/00

CPC分类号： H01L21/02667 ,  F27B17/0025 ,  H01L21/2022 ,  H01L21/67103 ,  H01L27/1214 ,  H01L29/66757

摘要： A method for manufacturing a semiconductor device, comprises providing a semiconductor layer deposited on a substrate with heat treatment by using a flame of a gas burner fueled by a hydrogen-and-oxygen mixed gas as a heat source.

摘要翻译： 一种制造半导体器件的方法，包括通过使用由氢氧混合气体燃烧的气体燃烧器的火焰作为热源，将沉积在基板上的半导体层提供热处理。

公开(公告)号：US07995374B2

公开(公告)日：2011-08-09

申请号：US12618122

申请日：2009-11-13

申请人： Masanori Komura ,  Mitsuru Sato ,  Kenichi Murooka ,  Motoya Kishida

发明人： Masanori Komura ,  Mitsuru Sato ,  Kenichi Murooka ,  Motoya Kishida

IPC分类号： G11C11/00 ,  G11C11/36 ,  G11C17/00 ,  G11C29/00

CPC分类号： G11C13/0007 ,  G11C13/0004 ,  G11C13/004 ,  G11C2213/31 ,  G11C2213/71 ,  G11C2213/72 ,  H01L27/2409 ,  H01L27/2463 ,  H01L27/2481 ,  H01L45/085 ,  H01L45/1233 ,  H01L45/146 ,  H01L45/147 ,  H01L45/1616 ,  H01L45/1625 ,  H01L45/1675

摘要： A memory cell comprises a variable resistance film; a first conductive film having one surface contacted with one surface of the variable resistance film; and a second conductive film having one surface contacted with another surface of the variable resistance film. A width of the first conductive film or the second conductive film in a direction orthogonal to a direction that a current flows in the first conductive film or the second conductive film is smaller than a width of the variable resistance film in a direction orthogonal to a direction that a current flows in the variable resistance film. The width of the first conductive film and the second conductive film is smaller than a width of the first line and the second line in a direction orthogonal to a direction that a current flows in the first line and the second line.

摘要翻译： 存储单元包括可变电阻膜; 具有与所述可变电阻膜的一个表面接触的一个表面的第一导电膜; 以及具有与可变电阻膜的另一表面接触的一个表面的第二导电膜。 第一导电膜或第二导电膜在与第一导电膜或第二导电膜中的电流方向正交的方向上的宽度小于在与方向正交的方向上的可变电阻膜的宽度 电流在可变电阻膜中流动。 第一导电膜和第二导电膜的宽度小于与第一线和第二线中的电流方向正交的方向上的第一线和第二线的宽度。

公开(公告)号：US07963435B2

公开(公告)日：2011-06-21

申请号：US12358689

申请日：2009-01-23

申请人： Mitsuru Sato ,  Takatoshi Yamamoto

发明人： Mitsuru Sato ,  Takatoshi Yamamoto

IPC分类号： B23K31/02

CPC分类号： B32B37/00 ,  B23K20/02 ,  B23K2101/40 ,  B32B7/04 ,  B32B7/12 ,  B32B15/043 ,  B32B15/08 ,  B32B27/08 ,  B32B27/283 ,  B32B38/0008 ,  B32B2038/0092 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/28 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/308 ,  B32B2307/54 ,  B32B2310/14 ,  B32B2457/00 ,  B32B2457/18 ,  B32B2457/202 ,  B32B2457/206 ,  C23C16/18 ,  C23C16/30 ,  Y10T428/265

摘要： A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted of copper and an organic component, and an amount of copper contained in each of the first bonding film and the second bonding film is 90 atom % or higher but lower than 99 atom % at an atomic ratio. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body. Two base members can be firmly and efficiently bonded together with high dimensional accuracy at a low temperature, and the two base members can be efficiently separated (peeled off) to each other after use of the bonded body. Further, a bonded body is also provided.

摘要翻译： 提供一种形成由第一基底构件，第二基底构件和第一接合膜构成的接合体的方法和设置在第一基底构件和第二基底构件之间的第二接合薄膜。 第一接合膜和第二接合膜由铜和有机成分构成，并且在第一接合膜和第二接合膜中的每一个中的铜量为90原子％以上且低于99原子％ 原子比。 该方法包括：通过使用化学气相成膜法在第一基底构件上形成第一接合膜; 通过使用化学气相成膜法在第二基底构件上形成第二接合膜; 使形成在第一基底构件上的第一接合膜与形成在第二基底构件上的第二接合膜接触，使得第一接合膜面向第二接合膜; 并且向第一基底构件和第二基底构件施加压缩力，使得第一接合膜和第二接合膜接合在一起，从而获得接合体。 两个基底构件可以在低温下以高尺寸精度牢固有效地粘合在一起，并且在使用粘合体之后可以将两个基底构件彼此有效地分离（剥离）。 此外，还提供了粘合体。

公开(公告)号：US20100201735A1

公开(公告)日：2010-08-12

申请号：US12665284

申请日：2008-06-16

申请人： Mitsuru Sato ,  Yoshiaki Mori

发明人： Mitsuru Sato ,  Yoshiaki Mori

IPC分类号： B41J2/015 ,  H01L21/30

CPC分类号： B41J2/1634 ,  B41J2/161 ,  B41J2/1623 ,  B81C3/001 ,  B81C2203/036 ,  H01L21/187 ,  H01L21/2007 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A bonding method of silicon base members is provided. The bonding method of silicon base members comprises: applying an energy to a surface of a first silicon base member having Si—H bonds on the surface to selectively cut the Si—H bonds so that dangling bonds of the silicon (Si) is exposed on the surface of the first silicon base member; and bonding the surface of the first silicon base member, on which the dangling bonds of the silicon has been exposed, and a surface of a second silicon base member on which dangling bonds of silicon are exposed so that the surface of the first silicon base member and the surface of the second silicon base member are bonded together through their dangling bonds.

摘要翻译： 提供硅基部件的接合方法。 硅基部件的接合方法包括：向表面上具有Si-H键的第一硅基部件的表面施加能量以选择性地切割Si-H键，使得硅（Si）的悬挂键暴露在 第一硅基部件的表面; 并且将暴露了硅的悬挂键的第一硅基部件的表面与硅的悬垂键露出的第二硅基部件的表面接合，使得第一硅基部件的表面 并且第二硅基材的表面通过它们的悬挂键结合在一起。

公开(公告)号：US20100183885A1

公开(公告)日：2010-07-22

申请号：US12665028

申请日：2008-06-16

申请人： Mitsuru Sato ,  Yoshiaki Mori

发明人： Mitsuru Sato ,  Yoshiaki Mori

IPC分类号： B32B37/02 ,  B32B38/00 ,  B05B1/00 ,  B32B9/04

CPC分类号： C09J5/02 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/26 ,  B23K2101/42 ,  B23K2103/56 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1634 ,  B81B2201/052 ,  B81C3/001 ,  B81C2203/036 ,  C09J2400/146 ,  H01L21/187 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T156/10 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A bonding method of silicon base members is provided. The bonding method of silicon base members comprises: applying an energy to a first silicon base member including Si—H bonds to selectively cut the Si—H bonds so that the first silicon base member is cleaved and divided to one silicon base member and the other silicon base member, and the one silicon base member having a cleavage surface and dangling bonds of silicon obtained by cutting the Si—H bonds; and bonding the cleavage surface of the one silicon base member and a surface of a second silicon base member on which dangling bonds of silicon are exposed to thereby bond the cleavage surface and the surface together through their dangling bonds.

摘要翻译： 提供硅基部件的接合方法。 硅基部件的接合方法包括：向包括Si-H键的第一硅基部件施加能量以选择性地切割Si-H键，使得第一硅基部件被切割并分成一个硅基部件，而另一个硅基部件 硅基部件和具有通过切割Si-H键获得的硅的断裂面和悬挂键的一个硅基部件; 并且将一个硅基部件的解理面和硅的悬挂键露出的第二硅基部件的表面接合，从而通过其悬挂键将解理面和表面结合在一起。