公开(公告)号：US20130270326A1

公开(公告)日：2013-10-17

申请号：US13448632

申请日：2012-04-17

申请人： Sang Won Yoon ,  Koji Shiozaki

发明人： Sang Won Yoon ,  Koji Shiozaki

IPC分类号： B23K31/02 ,  B23K37/04 ,  B23K20/00

CPC分类号： B23K20/02 ,  B23K20/16 ,  B23K2101/36 ,  H01L24/83 ,  H01L2224/83 ,  H01L2224/83825 ,  H01L2224/8383

摘要： A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

摘要翻译： 公开了一种能够快速且可靠地制造基本上均匀的粘合线的接合结构，其具有减小的厚度限制的依赖性。 此外，该系统还创建了一个针对电力电子产品性能的粘合线。 该系统是高度适应性的，因为可以实现各种结构和制造选项。 这使得能够进行多样化的制造选择并且对外部条件产生较少的依赖性。 所公开的系统至少适用于晶片到晶片，晶片到晶片，管芯到衬底或管芯到管芯的接合。

公开(公告)号：US08317784B2

公开(公告)日：2012-11-27

申请号：US12840747

申请日：2010-07-21

申请人： William Choe ,  Sang Won Yoon

发明人： William Choe ,  Sang Won Yoon

IPC分类号： A61B18/12

CPC分类号： A61N1/3968 ,  A61B18/12 ,  A61B2018/00791 ,  A61N1/362 ,  A61N1/37223

摘要： A magnetic switching device includes an electromagnetic component adapted to be arranged proximate to an exterior surface of an object having a magnetically-switchable device therein and a control circuit electrically connected to the electromagnetic component. The electromagnetic component is constructed to generate a magnetic field of sufficient strength and orientation to engage a switch in the magnetically-switchable device. The invention further includes an electrocautery system, including an electrocautery device, a control circuit electrically connected to the electrocautery device, and an electromagnetic component electrically connected to the control circuit. The electromagnetic component is adapted to be arranged proximate to an exterior surface of an object having a magnetically-switchable device therein. Operation of the electrocautery device causes the electromagnetic component to generate a magnetic field of sufficient strength to engage a switch in the magnetically-switchable device.

摘要翻译： 一种磁性开关装置包括：适于布置成靠近其中具有可磁化装置的物体的外表面的电磁部件和与电磁部件电连接的控制电路。 电磁部件被构造成产生具有足够强度和取向的磁场，以接合可开关的装置中的开关。 本发明还包括一种电烙术系统，包括电烙术装置，电连接到电灼装置的控制电路以及与控制电路电连接的电磁部件。 电磁部件适于布置成靠近其中具有可磁性切换装置的物体的外表面。 电灼装置的操作使得电磁部件产生足够强度的磁场，以接合可开关的装置中的开关。

公开(公告)号：US08138019B2

公开(公告)日：2012-03-20

申请号：US12611285

申请日：2009-11-03

申请人： Sang Won Yoon ,  Alexandros Margomenos

发明人： Sang Won Yoon ,  Alexandros Margomenos

IPC分类号： H01L21/00 ,  H01L21/30

CPC分类号： H01L25/0657 ,  B81C1/00238 ,  B81C2203/0771 ,  B81C2203/0792 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/1148 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/13299 ,  H01L2224/133 ,  H01L2224/276 ,  H01L2224/2784 ,  H01L2224/27845 ,  H01L2224/29011 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/30181 ,  H01L2224/73104 ,  H01L2224/811 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/9221 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1579 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01027 ,  H01L2924/3512

摘要： A process of forming a semiconductor integrated circuit that includes the steps of: forming at least a first element having a first pattern of conductive material and including a polymer layer surrounding the conductive material, forming at least a second element having a second pattern of conductive material and including a polymer layer surrounding the conductive material, positioning the first element relative to the second element, and bonding the polymer layer of the first and second elements at a temperature below a melting temperature of the conductive materials of the first and second elements wherein the conductive material of the first element contacts the conductive material of the second element and is maintained in position by the bonded polymer layers.

摘要翻译： 一种形成半导体集成电路的方法，包括以下步骤：至少形成具有导电材料的第一图案的第一元件，并且包括围绕导电材料的聚合物层，至少形成具有第二导电材料图案的第二元件 并且包括围绕所述导电材料的聚合物层，相对于所述第二元件定位所述第一元件，以及在低于所述第一和第二元件的导电材料的熔融温度的温度下将所述第一和第二元件的聚合物层粘合，其中 第一元件的导电材料接触第二元件的导电材料，并通过结合的聚合物层保持在适当的位置。

公开(公告)号：US10058951B2

公开(公告)日：2018-08-28

申请号：US13448632

申请日：2012-04-17

申请人： Sang Won Yoon ,  Koji Shiozaki

发明人： Sang Won Yoon ,  Koji Shiozaki

IPC分类号： B23K20/02 ,  B23K20/16 ,  H01L23/00 ,  B23K101/36

CPC分类号： B23K20/02 ,  B23K20/16 ,  B23K2101/36 ,  H01L24/83 ,  H01L2224/83 ,  H01L2224/83825 ,  H01L2224/8383

摘要： A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

公开(公告)号：US07986076B2

公开(公告)日：2011-07-26

申请号：US12610771

申请日：2009-11-02

申请人： Sang Won Yoon ,  Alexandros Margomenos

发明人： Sang Won Yoon ,  Alexandros Margomenos

IPC分类号： H01L41/08

CPC分类号： H02N2/186 ,  H01L41/1134 ,  H01L41/1136

摘要： The present invention discloses an energy harvesting device that converts small magnitude and low frequency vibrations into electrical energy. The device can include a base, a low frequency element, and a piezoelectric element. The low frequency element can be movably attached to the base and the piezoelectric element can also be attached to the base and be spaced apart from the low frequency element with a vacant space therebetween. Upon vibration of the low frequency element resulting from environmental vibrations, the low frequency element can impact the piezoelectric element and cause elastic deformation thereto.

摘要翻译： 本发明公开了一种将小振幅和低频振动转换为电能的能量收集装置。 该器件可以包括基极，低频元件和压电元件。 低频元件可以可移动地附接到基座，并且压电元件也可以附接到基座并且与低频元件间隔开，其间具有空隙。 由于环境振动引起的低频元件的振动，低频元件可能会冲击压电元件并引起弹性变形。

公开(公告)号：US20110060330A1

公开(公告)日：2011-03-10

申请号：US12840747

申请日：2010-07-21

申请人： William CHOE ,  Sang Won Yoon

发明人： William CHOE ,  Sang Won Yoon

IPC分类号： A61B18/12 ,  H01H50/00

CPC分类号： A61N1/3968 ,  A61B18/12 ,  A61B2018/00791 ,  A61N1/362 ,  A61N1/37223

摘要： A magnetic switching device includes an electromagnetic component adapted to be arranged proximate to an exterior surface of an object having a magnetically-switchable device therein and a control circuit electrically connected to the electromagnetic component. The electromagnetic component is constructed to generate a magnetic field of sufficient strength and orientation to engage a switch in the magnetically-switchable device. The invention further includes an electrocautery system, including an electrocautery device, a control circuit electrically connected to the electrocautery device, and an electromagnetic component electrically connected to the control circuit. The electromagnetic component is adapted to be arranged proximate to an exterior surface of an object having a magnetically-switchable device therein. Operation of the electrocautery device causes the electromagnetic component to generate a magnetic field of sufficient strength to engage a switch in the magnetically-switchable device.

摘要翻译： 一种磁性开关装置包括：适于布置成靠近其中具有可磁化装置的物体的外表面的电磁部件和与电磁部件电连接的控制电路。 电磁部件被构造成产生具有足够强度和取向的磁场，以接合可开关的装置中的开关。 本发明还包括一种电烙术系统，包括电烙术装置，电连接到电灼装置的控制电路以及与控制电路电连接的电磁部件。 电磁部件适于布置成靠近其中具有可磁性切换装置的物体的外表面。 电灼装置的操作使得电磁部件产生足够强度的磁场，以接合可开关的装置中的开关。

公开(公告)号：USD566151S1

公开(公告)日：2008-04-08

申请号：US29274018

申请日：2007-03-21

申请人： Hyo Jin Won ,  Sang Won Yoon

设计人： Hyo Jin Won ,  Sang Won Yoon

公开(公告)号：US20120193776A1

公开(公告)日：2012-08-02

申请号：US13442546

申请日：2012-04-09

申请人： Sang Won Yoon ,  Koji Shiozaki

发明人： Sang Won Yoon ,  Koji Shiozaki

IPC分类号： H01L23/04

CPC分类号： H01L23/49827 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0655 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/819 ,  H01L2924/01029 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.

摘要翻译： 本发明是用于集成多个装置的装置。 该装置包括具有第一通孔和第二通孔的基板，位于基板的顶部并且位于第一通孔和第二通孔之间的半导体芯片，位于半导体芯片上的第一和第二凸块以及插入件晶片 具有第一插入件弹簧组件和第二插入件弹簧组件，所述第一插入件弹簧组件具有第一插入件弹簧和连接到第一插入件弹簧的第一电连接件，第二插入件弹簧组件具有第二插入件弹簧和第二插入件弹簧 连接到第二插入件弹簧。

公开(公告)号：US06678511B2

公开(公告)日：2004-01-13

申请号：US09781434

申请日：2001-02-13

申请人： Hee Yong Hwang ,  Sang Won Yoon

发明人： Hee Yong Hwang ,  Sang Won Yoon

IPC分类号： H04B126

CPC分类号： H03H7/0115 ,  H03H7/1775

摘要： A pass band flatness correction circuit for improving flatness of a ripple occurring within a pass band in a band pass filter and a mobile telecommunication repeater system is provided. The pass band flatness correction circuit includes a complementary band pass filter having a pass band transfer characteristic producing a counter-ripple of a reverse shape to a ripple in a pass band of a main band pass filter, for flattening a total of pass band transfer characteristics of a filtering system, an amplifier circuit for enhancing an increase in a filter insertion loss, and an attenuator circuit for enhancing a reflection loss characteristic of the whole circuit. The flatness and a stop band attenuation characteristic of the band pass filter whose pass band flatness is distorted and a repeater system employing the band pass filter is enhanced, to thereby improve performance and speech quality of a mobile telecommunication service.

摘要翻译： 提供了一种用于提高带通滤波器和移动通信中继器系统中的通带内产生纹波的平坦度的通带平坦度校正电路。 通带平坦度校正电路包括具有通带传输特性的互补带通滤波器，其产生与主带通滤波器的通带中的纹波相反的反向纹波，用于使总带宽传输特性平坦化 滤波器系统，用于增强滤波器插入损耗增加的放大器电路，以及用于增强整个电路的反射损耗特性的衰减器电路。 通带失真的带通滤波器的平坦度和阻带衰减特性得到增强，并且提高了使用带通滤波器的中继器系统，从而提高了移动电信业务的性能和语音质量。

公开(公告)号：US08803001B2

公开(公告)日：2014-08-12

申请号：US13165660

申请日：2011-06-21

申请人： Sang Won Yoon ,  Satoshi Yasuda ,  Koji Shiozaki

发明人： Sang Won Yoon ,  Satoshi Yasuda ,  Koji Shiozaki

IPC分类号： H05K1/18 ,  B05D1/36 ,  B23K35/02 ,  B05D5/00

CPC分类号： B23K35/262 ,  H01L21/4846 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83193 ,  H01L2224/83825 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/1579 ,  Y10T428/12222 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2224/83

摘要： Devices, methods and systems are disclosed herein to describe the wettability characteristics of the material forming a bonding area, a non-bonding area, and a melted bonding material. The melted bonding material may have a high degree of cohesion and may result in a very high contact angle (e.g., between 90°- 180°) in the non-bonding area thereby preventing or limiting the flow of a melted material into the non-bonding area, which often results when the melted bonding material forms a low contact angle (e.g., between 0°-90°) in the bonding area. In other words, by choosing a material for the non-bonding area to have low wettability characteristics when compared to the melted materials of the bonding area or by treating the material forming the non-bonding area to have much lower wettability characteristics, the melted materials of the bonding area may be prevented from flowing into the non-bonding area.

摘要翻译： 本文公开的装置，方法和系统用于描述形成接合区域，非结合区域和熔融粘合材料的材料的润湿性能。 熔融的粘合材料可能具有高度的内聚力，并且可能导致非接合区域中的非常高的接触角（例如，在90°至180°之间），从而防止或限制熔融材料流入非接触区域， 粘结区域，这通常在熔融粘合材料在粘合区域中形成低接触角（例如0°-90°）时产生。 换句话说，通过选择与接合区域的熔融材料相比具有低润湿性特性的非粘结区域的材料或通过处理形成非粘合区域的材料具有低得多的润湿性，熔融材料 可以防止粘合区域流入非接合区域。