摘要:
A refresh method for a semiconductor memory device having more than one bank group is provided. The refresh method may include applying an all-refresh command to one the bank groups, determining if one of the bank groups includes a bank undergoing a refresh operation when the all-refresh command is received, and performing an all-refresh operation based on the determination.
摘要:
For refreshing a memory device, a refresh selection unit is enabled within a selected group of memory cells for refreshing at least one memory cell within the selected group in response to a refresh control signal and a refresh address signal from an external source. In addition, a normal operation circuit performs a normal operation on at least one memory cell of another group of memory cells while the at least one memory cell within the selected group is being refreshed to reduce refresh overhead.
摘要:
An integrated circuit device for testing is disclosed. The device includes a plurality of internal circuits for generating a plurality of internal signals, the internal signals used for addressing storage locations and for controlling internal operations, a first selection circuit for receiving the internal circuits in response to selection signals corresponding to test information signals, a second selection circuit for receiving output signals from the first selection circuit and output signals from a sense amplifier, and for opening an alternative one of transfer paths of the internal signals and the output signals in response to the selection signals, and a data output buffer for transferring output signals from the second selection signals to an outside of the device through data input/output pads.
摘要:
A semiconductor memory device comprises a write column select line or read column select line for shielding a signal line. The semiconductor memory device may include a signal line, a read column select line, and a write column select line. The signal line may transmit an operation signal related to the operation of the semiconductor memory device. The read column select line may transmit a read column select signal, which may control transfer of a data signal of a bit line to a data line. The write column select line may transmit a write column select signal, which may control transfer of the data signal of the data line to the bit line. One of the read column select line and the write column select line to transmit a deactivated column select signal among the read column select signal and the write column select signal, may be maintained at a predetermined logic level and may shield the signal line.
摘要:
A semiconductor memory device may include a memory cell array, a redundancy address decoder, a defective address detection unit, and a defective address program unit. The memory cell array includes a plurality of memory cell groups and a predetermined number of redundancy memory cell groups. The redundancy address decoder includes a predetermined number of redundancy decoders for accessing at least one group of the redundancy memory cell groups when a first defective address is identical to an externally applied address. The defective address detection unit performs a write operation and a read operation on the memory cell array during a test operation to detect a defective address, and outputs the detected defective address as the first defective address when the same defective address is detected a predetermined number of times or more. The defective address program unit receives and programs the first defective address output from the defective address detection unit during a program operation.
摘要:
In a method for supplying power supply voltages in a semiconductor memory device a first source voltage is applied to a memory cell of a memory cell array as a cell array internal voltage for operating a sense amplifier coupled to the memory cell. A second source voltage is applied as a word line drive voltage of the memory cell array. The second source voltage has a voltage level higher than a voltage level of the first source voltage. The second source voltage is also applied as a drive voltage of an input/output line driver to drive write data into an input/output line in a write operating mode.
摘要:
A semiconductor memory device includes first and second isolation transistors for electrically connecting/isolating a pair of bitlines to/from a sense amplifier circuit, and a MOS transistor having a source region that is shared with one of sources of the first and second isolation transistors. The MOS transistor may be used as a bitline boosting capacitor.
摘要:
A stacked semiconductor apparatus and method of fabricating same are disclosed. The apparatus includes upper and lower semiconductor devices having a similar pattern of connection elements. When stacked connected the resulting plurality of semiconductor devices includes a serial connection path traversing the stack, and may also include parallel connection paths, back-side mounted large components, and vertical thermal conduits.
摘要:
Provided is a memory device having a first switch configured to receive a first CSL signal to input or output data. A second switch is configured to receive a second CSL signal. A sensing and latch circuit (SLC) is coupled between the first and second switches. And at least one memory cell is coupled to the second switch. The second switch is configured to control timing of read or write operations of the at least one memory cell in response to the second CSL signal, e.g., where a read operation can be performed in not more than about 5 ns. The SLC operates as a latch in a write mode and as an amplifier in a read mode. The memory device may comprise part of a memory system or other apparatus including such memory device or system. Methods of performing read and write operations using such memory device are also provided.
摘要:
A stacked semiconductor apparatus and method of fabricating same are disclosed. The apparatus includes upper and lower semiconductor devices having a similar pattern of connection elements. When stacked connected the resulting plurality of semiconductor devices includes a serial connection path traversing the stack, and may also include parallel connection paths, back-side mounted large components, and vertical thermal conduits.