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    Die assembly having electrical interconnect
    13.
    发明授权
    Die assembly having electrical interconnect 有权
    具有电互连的模组件

    公开(公告)号：US07535109B2

    公开(公告)日：2009-05-19

    申请号：US11744153

    申请日：2007-05-03

    申请人： Marc E. Robinson ,  Alfons Vindasius ,  Donald Almen ,  Larry Jacobsen

    发明人： Marc E. Robinson ,  Alfons Vindasius ,  Donald Almen ,  Larry Jacobsen

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H01L23/49575 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2924/09701 ,  H01L2924/3011

    摘要： The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments. Metal rerouting interconnects which extend to one or more sides of the die or segment can be optionally added to the die or multi die segment to provide edge bonding pads upon the surface of the die for external electrical connection points. After the metal rerouting interconnect has been added to the die on the wafer, the wafer is optionally thinned and each die or multiple die segment is singulated from the wafer by cutting or other appropriate singulation method. After the die or multiple die segments are singulated or cut from the wafer, insulation is applied to all surfaces of the die or multiple die segments, openings are made in the insulation above the desired electrical connection pads, and the die or multiple die segments are placed on top of one another to form a stack. Vertically adjacent segments in the stack are electrically interconnected by attaching a short flexible bond wire or bond ribbon to the exposed electrical connection pad at the peripheral edges of the die which protrudes horizontally from the die and applying electrically conductive polymer, or epoxy, filaments or lines to one or more sides of the stack.

    摘要翻译： 本发明提供一种用于垂直互连半导体管芯，集成电路管芯或多个管芯段的装置。 延伸到模具或段的一个或多个侧面的金属重路由互连可以任选地添加到管芯或多管段中，以在管芯的表面上提供用于外部电连接点的边缘焊盘。 在金属重路由互连已经被添加到晶片上的管芯之后，晶片可选地变薄，并且通过切割或其他合适的分割方法将晶片从晶片上分离出来。 在从晶片上切割或切割管芯或多个管芯段之后，将绝缘施加到管芯或多个管芯段的所有表面上，在所需电连接焊盘上方的绝缘层中形成开口，并且管芯或多个管芯段 放置在彼此的顶部以形成堆叠。 在堆叠中的垂直相邻的段通过将短的柔性接合线或粘合带附接到裸露的电连接焊盘而在模具的周边边缘处水平地插入并且施加导电聚合物或环氧树脂，细丝或线 到堆叠的一侧或多侧。

    Electrical interconnect for die stacked in zig-zag configuration
    19.
    发明申请
    Electrical interconnect for die stacked in zig-zag configuration 有权
    用于以锯齿形配置堆叠的管芯的电互连

    公开(公告)号：US20100327461A1

    公开(公告)日：2010-12-30

    申请号：US12821454

    申请日：2010-06-23

    申请人： Reynaldo Co ,  Grant Villavicencio ,  Jeffrey S. Leal ,  Simon J.S. McElrea

    发明人： Reynaldo Co ,  Grant Villavicencio ,  Jeffrey S. Leal ,  Simon J.S. McElrea

    IPC分类号： H01L25/065 ,  H01L21/60 ,  H01L21/77 ,  H01L23/538

    CPC分类号： H01L25/0657 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14

    摘要： A die (or of a stack of die) is mounted over and elevated above a support, and is electrically connected to circuitry in the support. Pillars of electrically conductive material are formed on a set of bond pads at a mount side of the support, and the elevated die (or at least one die in the elevated stack of die) is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the support. Also, tiered offset stacked die assemblies in a zig-zag configuration, in which the interconnect edges of a first (lower) tier face in a first direction, and the interconnect edges of a second (upper) tier, stacked over the first tier, face in a second direction, different from the first direction, are electrically connected to a support. Die in the first tier are electrically interconnected die-to-die, and the tier is electrically connected to a support, by traces of an electrically conductive material contacting interconnect pads on the die and a first set of bond pads on the support. Pillars of a electrically conductive material are formed on a second set of bond pads, and die in the second tier are electrically interconnected die-to-die, and the tier is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the substrate.

    摘要翻译： 模具（或一堆模具）安装在支撑件上并在支撑件上方升高，并且电连接到支撑件中的电路。 导电材料的支柱形成在支撑件的安装侧的一组接合焊盘上，并且升高的模具（或模具的升高堆叠中的至少一个模具）通过电气迹线电连接到支撑件 导电材料将管芯上的互连焊盘接触到支柱，并且通过支柱到支撑件。 而且，以Z字形配置的分层偏移堆叠模组组件，其中第一（下）层的第一方向上的互连边缘和第二层（第二层）堆叠在第一层上的互连边缘， 在与第一方向不同的第二方向上面对电连接到支撑件。 在第一层中的管芯被电连接到芯片之间，并且该层通过导电材料的痕迹电连接到支撑件，导电材料接触管芯上的互连焊盘和支撑件上的第一组接合焊盘。 导电材料的支柱形成在第二组接合焊盘上，并且第二层中的管芯与管芯电连接，并且该层通过迹线导电材料接触互连 模具上的垫子到柱子上，并通过柱子到基底。