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    MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND RELATED ACTUATOR BUMPS, METHODS OF MANUFACTURE AND DESIGN STRUCTURES
    11.
    发明申请
    MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND RELATED ACTUATOR BUMPS, METHODS OF MANUFACTURE AND DESIGN STRUCTURES 有权
    微电子机械系统（MEMS）及相关执行机构的制造，制造和设计结构的方法

    公开(公告)号：US20140231936A1

    公开(公告)日：2014-08-21

    申请号：US14184969

    申请日：2014-02-20

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Christopher V. JAHNES ,  Anthony K. STAMPER

    IPC: B81B7/00 ,  G06F17/50

    CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B7/0006 ,  B81B2201/016 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00293 ,  B81C2203/0145 ,  G06F17/5045 ,  G06F17/5068 ,  H01H1/0036 ,  H01H2001/0057 ,  Y10T29/49121

    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

    Abstract translation: 提供微机电系统（MEMS）结构，制造方法和设计结构。 形成MEMS结构的方法包括在基板上形成固定的致动器电极和接触点。 该方法还包括在固定的致动器电极和接触点上形成MEMS光束。 该方法还包括形成与固定致动器电极的部分对准的致动器电极阵列，其尺寸和尺寸被设计成防止MEMS光束在重复循环之后塌陷在固定的致动器电极上。 致动器电极阵列形成为与MEMS光束的下侧和固定的致动器电极的表面中的至少一个直接接触。

    MEMS ELECTROSTATIC ACTUATOR
    12.
    发明申请
    MEMS ELECTROSTATIC ACTUATOR 有权
    MEMS静电执行器

    公开(公告)号：US20140076697A1

    公开(公告)日：2014-03-20

    申请号：US13614936

    申请日：2012-09-13

    Applicant: Arun K. Gupta ,  William C. McDonald

    Inventor： Arun K. Gupta ,  William C. McDonald

    IPC: B81B3/00

    CPC classification number: H02N2/12 ,  B81B3/0008 ,  B81B3/001 ,  B81B3/0013 ,  B81B7/02 ,  B81B2201/016 ,  B81B2201/0221 ,  B81B2203/0109 ,  B81B2203/0181 ,  B81B2203/053 ,  B81B2203/058 ,  B81B2203/06

    Abstract: A MEMS electrostatic actuator includes a bottom plate affixed to a substrate and a top plate suspended above the bottom plate. The top plate has a parallel plate center section and two rotating members electrically connected to the center section. Each rotating member is attached centrally of the rotating member for rotation about an axis of rotation to a set of anchor posts. The attachment includes at least one pair of torsional springs attached along each axis, each spring comprising a rectangular metal square that twists as the rotational members rotate. Electrostatic pull-down electrodes are underneath each rotational member.

    Abstract translation: MEMS静电致动器包括固定到基板的底板和悬挂在底板上方的顶板。 顶板具有平行板中心部分和两个电连接到中心部分的旋转部件。 每个旋转构件安装在旋转构件的中心，用于围绕旋转轴线旋转到一组锚柱。 附件包括沿着每个轴线附接的至少一对扭转弹簧，每个弹簧包括矩形金属正方形，随着旋转构件的旋转，该正方形扭曲。 静电下拉电极位于每个旋转构件的下方。

    METHOD FOR REDUCING SUBSTRATE CHARGING
    13.
    发明申请
    METHOD FOR REDUCING SUBSTRATE CHARGING 有权
    减少基板充电的方法

    公开(公告)号：US20120279837A1

    公开(公告)日：2012-11-08

    申请号：US12415937

    申请日：2009-03-31

    Applicant: Ingrid De Wolf ,  Xavier Rottenberg ,  Piotr Czarnecki ,  Philippe Soussan

    Inventor： Ingrid De Wolf ,  Xavier Rottenberg ,  Piotr Czarnecki ,  Philippe Soussan

    IPC: H01H57/00 ,  H01H49/00

    CPC classification number: B81B3/0008 ,  B81B2201/016 ,  H01G5/16 ,  H01H59/0009 ,  H01H2059/0018

    Abstract: An electrostatically actuatable micro electromechanical device is provided with enhanced reliability and lifetime. The electrostatically actuatable micro electromechanical device comprises: a substrate, a first conductor fixed to the top layer of the substrate, forming a fixed electrode, a second conductor fixed to the top layer of the substrate, and a substrate area. The second conductor is electrically isolated from the first conductor and comprises a moveable portion, suspended at a predetermined distance above the first conductor, the moveable portion forming a moveable electrode which approaches the fixed electrode upon applying an actuation voltage between the first and second conductors. The selected substrate surface area is defined as the orthogonal projection of the moveable portion on the substrate between the first and second conductors. In the substrate surface area at least one recess is provided in at least the top layer of the substrate.

    Abstract translation: 提供了一种可静电驱动的微机电装置，具有更高的可靠性和寿命。 静电致动微机电装置包括：基板，固定到基板的顶层的第一导体，形成固定电极，固定到基板的顶层的第二导体和基板区域。 所述第二导体与所述第一导体电隔离并且包括悬挂在所述第一导体上方预定距离处的可移动部分，所述可移动部分形成在所述第一和第二导体之间施加致动电压时接近所述固定电极的可移动电极。 所选择的基板表面积被定义为在第一和第二导体之间的基板上的可移动部分的正交投影。 在基板表面区域中，至少一个凹部设置在基板的至少顶层中。

    Micromechanical actuators comprising semiconductors on a group III nitride basis
    14.
    发明授权
    Micromechanical actuators comprising semiconductors on a group III nitride basis 有权
    微机械致动器包括基于III族氮化物的半导体

    公开(公告)号：US07939994B2

    公开(公告)日：2011-05-10

    申请号：US12300831

    申请日：2007-05-16

    Applicant: Mike Kunze ,  Ingo Daumiller

    Inventor： Mike Kunze ,  Ingo Daumiller

    IPC: H01L41/053 ,  H01L41/047

    CPC classification number: F04B43/046 ,  B81B3/0024 ,  B81B2201/014 ,  B81B2201/016 ,  B81B2201/032 ,  H01F21/04 ,  H01F2007/068 ,  H01G5/18 ,  H01L41/047 ,  H01L41/0933 ,  H01L41/094 ,  H01L41/0973

    Abstract: A semiconductor actuator includes a substrate base, a bending structure which is connected to the substrate base and can be deflected at least partially relative to the substrate base. The bending structure has semiconductor compounds on the basis of nitrides of main group III elements and at least two electrical supply contacts which impress an electrical current in or for applying an electrical voltage to the bending structure. At least two of the supply contacts are disposed at a spacing from each other respectively on the bending structure and/or integrated in the latter.

    Abstract translation: 半导体致动器包括基板，弯曲结构，其连接到基板基底并且可相对于基板基底至少部分地偏转。 该弯曲结构基于主要III族元素的氮化物和至少两个给弯曲结构施加电压或施加电压的电流的电源触点而具有半导体化合物。 至少两个电源触点分别设置在弯曲结构上和/或与后者集成在一起的彼此间隔开。

    Micro-electro mechanical systems switch and method of fabricating the same
    16.
    发明授权
    Micro-electro mechanical systems switch and method of fabricating the same 有权
    微机电系统开关及其制造方法

    公开(公告)号：US07585113B2

    公开(公告)日：2009-09-08

    申请号：US11440863

    申请日：2006-05-24

    Applicant: Jae Woo Lee ,  Chang Han Je ,  Sung Weon Kang

    Inventor： Jae Woo Lee ,  Chang Han Je ,  Sung Weon Kang

    IPC: G02B6/00

    CPC classification number: H01H59/0009 ,  B81B3/0013 ,  B81B3/0072 ,  B81B2201/016

    Abstract: A MEMS switch and a method of manufacturing the same are disclosed. The MEMS switch includes: a substrate including a trench, a ground line and a signal line having an opened portion; a moving plate separated from the substrate at a predetermined space and including a contact member for connecting an electrode plate and the opened portion and having a deep corrugate to insert the trench; and a supporting member for supporting the moving plate. Such a MEMS switch prevents the thermal expansion and the stiction problem.

    Abstract translation: 公开了一种MEMS开关及其制造方法。 MEMS开关包括：包括沟槽，接地线和具有开口部分的信号线的衬底; 移动板在预定的空间处与基板分离，并且包括用于连接电极板和开口部分并具有深波纹以便插入沟槽的接触部件; 以及用于支撑移动板的支撑构件。 这样的MEMS开关可防止热膨胀和静电问题。

    Micromechanical device and method of manufacture thereof
    17.
    发明授权
    Micromechanical device and method of manufacture thereof 失效
    微机械装置及其制造方法

    公开(公告)号：US07241638B2

    公开(公告)日：2007-07-10

    申请号：US11155771

    申请日：2005-06-20

    Applicant: Hideyuki Funaki

    Inventor： Hideyuki Funaki

    IPC: H01L21/00 ,  H01L21/311

    CPC classification number: H03H9/462 ,  B81B3/0021 ,  B81B2201/016 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/051 ,  H01H13/80 ,  H01H59/0009 ,  H01H2001/0078 ,  H01H2201/008 ,  H03H3/0072

    Abstract: A micromechanical switch comprises a substrate, at least one pair of support members fixed to the substrate, at least one pair of beam members placed in proximity and parallel to each other above the substrate, and connected to one of the support members, respectively, each of the beam members having a moving portion which is movable with a gap with respect to the substrate, and a contact portion provided on the moving portion, and a driving electrode placed on the substrate between the pair of beam members to attract the moving portions of the beam members in a direction parallel to the substrate with electrostatic force so that the contact portions of the beam members which are opposed to each other are short-circuited.

    Abstract translation: 微机械开关包括基板，固定到基板的至少一对支撑构件，至少一对梁构件，其彼此靠近并平行放置在基板上方并分别连接到支撑构件之一 所述梁构件具有可相对于所述基板间隙移动的移动部分和设置在所述移动部分上的接触部分，以及设置在所述一对梁构件之间的所述基板上的驱动电极，以吸引所述移动部分的移动部分 梁构件在与静电力平行的方向上使得梁构件彼此相对的接触部分短路。

    Micromechanical device and method of manufacture thereof
    20.
    发明授权
    Micromechanical device and method of manufacture thereof 失效
    微机械装置及其制造方法

    公开(公告)号：US06940139B2

    公开(公告)日：2005-09-06

    申请号：US10806405

    申请日：2004-03-23

    Applicant: Hideyuki Funaki

    Inventor： Hideyuki Funaki

    IPC: B81B3/00 ,  B81C1/00 ,  G02B26/00 ,  H01H13/80 ,  H01H59/00 ,  H03H3/007 ,  H03H9/24 ,  H03H9/46 ,  H01L29/82

    CPC classification number: H03H9/462 ,  B81B3/0021 ,  B81B2201/016 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/051 ,  H01H13/80 ,  H01H59/0009 ,  H01H2001/0078 ,  H01H2201/008 ,  H03H3/0072

    Abstract: A micromechanical switch comprises a substrate, at least one pair of support members fixed to the substrate, at least one pair of beam members placed in proximity and parallel to each other above the substrate, and connected to one of the support members, respectively, each of the beam members having a moving portion which is movable with a gap with respect to the substrate, and a contact portion provided on the moving portion, and a driving electrode placed on the substrate between the pair of beam members to attract the moving portions of the beam members in a direction parallel to the substrate with electrostatic force so that the contact portions of the beam members which are opposed to each other are short-circuited.

    Abstract translation: 微机械开关包括基板，固定到基板的至少一对支撑构件，至少一对梁构件，其彼此靠近并平行放置在基板上方并分别连接到支撑构件之一 所述梁构件具有可相对于所述基板间隙移动的移动部分和设置在所述移动部分上的接触部分，以及设置在所述一对梁构件之间的所述基板上的驱动电极，以吸引所述移动部分的移动部分 梁构件在与静电力平行的方向上使得梁构件彼此相对的接触部分短路。

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