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175 条记录 (耗时 0.023 秒)

    Silicon on III-V semiconductor bonding for monolithic optoelectronic integration
    14.
    发明授权
    Silicon on III-V semiconductor bonding for monolithic optoelectronic integration 失效
    硅在III-V半导体接合单片光电集成

    公开(公告)号：US06455398B1

    公开(公告)日：2002-09-24

    申请号：US09616456

    申请日：2000-07-14

    申请人： Clifton G. Fonstad, Jr. ,  Joanna M. London ,  Joseph F. Ahadian

    发明人： Clifton G. Fonstad, Jr. ,  Joanna M. London ,  Joseph F. Ahadian

    IPC分类号： H01L2130

    CPC分类号： H01L21/8252 ,  G02B6/1245 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/76251 ,  H01L21/76254 ,  H01L21/76256 ,  H01L21/8258 ,  H01L27/0605 ,  H01L27/0688 ,  H01L2221/68363

    摘要： In a method for bonding a silicon substrate to a III-V material substrate, a silicon substrate is contacted together with a III-V material substrate and the contacted substrates are annealed at a first temperature that is above ambient temperature, e.g., at a temperature of between about 150° C. and about 350° C. The silicon substrate is then thinned. This bonding process enables the fabrication of thick, strain-sensitive and defect-sensitive optoelectronic devices on the optimum substrate for such, namely, a thick III-V material substrate, while enabling the fabrication of silicon electronic devices in a thin silicon layer, resulting from the thinned Si substrate, that is sufficient for such fabrication but which has been thinned to eliminate thermally-induced stress in both the Si and III-V materials. The III-V material substrate thickness thereby provides the physical strength of the composite substrate structure, while the thinned silicon substrate minimizes stress in the composite structure.

    摘要翻译： 在将硅衬底接合到III-V材料衬底的方法中，硅衬底与III-V材料衬底接触，并且接触衬底在高于环境温度的第一温度例如温度 在约150℃和约350℃之间。然后使硅衬底变薄。 这种接合工艺使得能够在最佳衬底上制造厚的，应变敏感的和缺陷敏感的光电子器件用于例如厚的III-V材料衬底，同时能够在薄的硅层中制造硅电子器件，从而产生 来自薄化的Si衬底，这对于这种制造是足够的，但已被稀释以消除Si和III-V材料中的热诱导应力。 因此，III-V材料衬底厚度提供了复合衬底结构的物理强度，而薄化硅衬底使复合结构中的应力最小化。

    Integrated transparent substrate and diffractive optical element
    15.
    发明申请
    Integrated transparent substrate and diffractive optical element 失效
    集成透明基板和衍射光学元件

    公开(公告)号：US20020047129A1

    公开(公告)日：2002-04-25

    申请号：US09905769

    申请日：2001-07-13

    发明人： Roger L. Frick ,  Charles R. Willcox

    IPC分类号： H01L033/00

    CPC分类号： G02B6/3536 ,  G02B5/32 ,  G02B6/124 ,  G02B6/1245 ,  G02B6/136 ,  G02B6/3534 ,  G02B6/3548 ,  G02B6/357 ,  G02B6/3584 ,  G02B6/4214 ,  G02B2006/12164

    摘要： A diffractive optical element (DOE) is shown formed on a substrate. The DOE is characterized, in one embodiment, by being formed from a plurality of members that are each individually created on a top surface of the substrate. The members may be formed by depositing a poly-silicon material on the substrate or by growing a silicon crystal on the substrate and performing an etch step. The substrate may be formed of a sapphire crystal. The DOE may be used to reflect incident light traveling within the substrate under total internal reflection. The widths, spacing between, and heights of the strips forming the DOE may be designed so as to reflect the incident light within the substrate in a direction of propagation acute to that of the incident light.

    摘要翻译： 示出了在基板上形成的衍射光学元件（DOE）。 在一个实施例中，DOE的特征在于由多个构件形成，每个构件各自单独地形成在衬底的顶表面上。 可以通过在衬底上沉积多晶硅材料或通过在衬底上生长硅晶体并执行蚀刻步骤来形成构件。 衬底可以由蓝宝石晶体形成。 DOE可以用于反射在全内反射下在衬底内行进的入射光。 形成DOE的条带的宽度，间隔和高度可以被设计成在与入射光的传播方向相似的方向上反射衬底内的入射光。

    Microlens for surface mount products
    16.
    发明授权
    Microlens for surface mount products 有权
    微型透镜用于表面贴装产品

    公开(公告)号：US06297540B1

    公开(公告)日：2001-10-02

    申请号：US09324880

    申请日：1999-06-03

    申请人： Azar Assadi ,  Parvin Mossahebi ,  Kabul Sengupta

    发明人： Azar Assadi ,  Parvin Mossahebi ,  Kabul Sengupta

    IPC分类号： H01L2978

    CPC分类号： G02B3/0018 ,  G02B3/0056 ,  G02B6/1221 ,  G02B6/1245 ,  G02B6/4204 ,  G03F7/0005 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A photosensitive device with a microlens array may be packaged for surface mount packaging and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.

    摘要翻译： 具有微透镜阵列的光敏器件可以被封装以用于表面贴装封装和随后的质量回流处理，而不会显着降低微透镜的光学性能。 可以使用一系列增加时间和温度的热步骤来形成微透镜。 此外，微透镜可以被漂白以防止在通常与表面贴装技术相关的温度下其光透射率的降低。

    Optical device and method of manufacturing the same
    17.
    发明授权
    Optical device and method of manufacturing the same 失效
    光学装置及其制造方法

    公开(公告)号：US06178035B1

    公开(公告)日：2001-01-23

    申请号：US08955725

    申请日：1997-10-22

    申请人： Akira Eda ,  Kiyofumi Muro

    发明人： Akira Eda ,  Kiyofumi Muro

    IPC分类号： G02F135

    CPC分类号： H01S3/2383 ,  G02B3/0012 ,  G02B3/0018 ,  G02B3/005 ,  G02B3/0056 ,  G02B3/0068 ,  G02B6/1245 ,  G02F1/37 ,  G03F7/0005 ,  H01S3/0606 ,  H01S3/0615 ,  H01S3/0621 ,  H01S3/0625 ,  H01S3/0627 ,  H01S3/08095 ,  H01S3/09415 ,  H01S3/2308 ,  H01S5/0267 ,  H01S5/18388

    摘要： An optical device includes a light transmitting non-linear optical material having a first face and a second face. The first and second faces oppose each other. The first face has a plurality of first reflecting portions provided thereon, and the second face has a plurality of second reflecting portions provided thereon. Each of the second reflecting portions corresponds to one of the first reflecting portions. Furthermore, the first and second faces are substantially flat except for at least one convex arcuate portion being formed on at least one of the first and second faces. Additionally, at least one of the first and second reflecting portions is obtained by coating a reflective material on the convex arcuate portion.

    摘要翻译： 光学装置包括具有第一面和第二面的透光非线性光学材料。 第一面和第二面相互对立。 第一面具有设置在其上的多个第一反射部，第二面具有设置在其上的多个第二反射部。 每个第二反射部分对应于第一反射部分中的一个。 此外，除了形成在第一和第二面中的至少一个上的至少一个凸形弓形部分之外，第一和第二面基本上是平坦的。 此外，第一和第二反射部分中的至少一个通过在凸弧形部分上涂覆反射材料而获得。

    Lensed planar optical waveguides for packaging opto-electronic devices
    20.
    发明授权
    Lensed planar optical waveguides for packaging opto-electronic devices 失效
    用于封装光电器件的平面光波导

    公开(公告)号：US5879571A

    公开(公告)日：1999-03-09

    申请号：US474777

    申请日：1995-06-07

    申请人： Robert F. Kalman ,  Edward R. Silva ,  Ronald S. Maynard

    发明人： Robert F. Kalman ,  Edward R. Silva ,  Ronald S. Maynard

    IPC分类号： G02B6/12 ,  G02B6/124 ,  G02B6/42 ,  G02B6/04

    CPC分类号： G02B6/1245 ,  G02B6/42 ,  G02B6/4249 ,  G02B2006/12102 ,  G02B2006/12176 ,  G02B6/421

    摘要： A method for forming lensed ends on waveguides to within very fine tolerances is applicable to many types of waveguides, including single fibers and POWs. The method uses photolithographic materials and techniques, but uses the waveguides themselves to provide the exposing radiation. Thus a method for forming a lens on the end of a waveguide having a waveguiding region and a cladding region includes the step of coating a first end of the waveguide with a photoresist material having sensitivity to at least light in a particular wavelength range. Light in that particular wavelength range is then injected into a second end of the waveguide so that the light within the waveguiding region preferentially exposes the photoresist that covers the waveguiding region at the first end of the waveguide. The method can be carried out with either positive photoresist (where only the exposed portion is removed by development) or negative photoresist (where only the exposed portion remains after development).

    摘要翻译： 在波导上形成非常精细的公差中的透镜端的方法可应用于许多类型的波导，包括单个光纤和POW。 该方法使用光刻材料和技术，但是使用波导本身来提供曝光辐射。 因此，在具有波导区域和包层区域的波导的端部上形成透镜的方法包括用具有至少在特定波长范围内的光的灵敏度的光致抗蚀剂材料涂覆波导的第一端的步骤。 然后将该特定波长范围的光注入波导的第二端，使得波导区域内的光优先地暴露在波导的第一端处覆盖波导区域的光致抗蚀剂。 该方法可以用正性光致抗蚀剂（其中仅通过显影除去暴露部分）或负性光致抗蚀剂（其中仅显影部分保留后露出部分）进行。