公开(公告)号：US12016115B2

公开(公告)日：2024-06-18

申请号：US17956999

申请日：2022-09-30

Applicant: SHENNAN CIRCUITS CO., LTD.

Inventor： Beilei Wang ,  Weijing Guo ,  Zhanhao Xie

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0263 ,  H05K1/113 ,  H05K3/103 ,  H05K2201/0355 ,  H05K2201/07 ,  H05K2201/08

Abstract: Disclosed are an embedded circuit board and a fabrication method therefor. The embedded circuit board comprises: a circuit board body; signal transmission layers (1200), wherein the signal transmission layers are arranged on two opposite sides of the circuit board body; bonding layers, wherein the bonding layers are arranged between at least one signal transmission layer and the circuit board body and used for bonding the signal transmission layer to the circuit board body; metal bases which are embedded in the circuit board body and are electrically connected to the signal transmission layers on two opposite sides of the circuit board body; conductive parts which are arranged at the positions in the bonding layers corresponding to the metal bases, and are electrically connected to the signal transmission layer and the metal bases; and magnetic cores embedded in the circuit board body.

公开(公告)号：US11813546B1

公开(公告)日：2023-11-14

申请号：US18054130

申请日：2022-11-09

Applicant: SPIN MASTER LTD.

Inventor： Amir Haddadi ,  Benjamin Elias Dermer ,  Paul Andrew Reynolds ,  Amrit Dhoot ,  Martin Labrecque

IPC: A63H13/00 ,  A63H33/26 ,  A63H33/22 ,  A63H5/00 ,  H05B47/155 ,  H05K1/16 ,  H05K1/02 ,  G06F3/16 ,  G06F3/044 ,  G06F3/041

CPC classification number: A63H33/26 ,  A63H5/00 ,  A63H33/22 ,  H05B47/155 ,  H05K1/028 ,  H05K1/16 ,  A63H2200/00 ,  G06F3/044 ,  G06F3/0416 ,  G06F3/165 ,  H05K2201/08 ,  H05K2201/10106

Abstract: A toy includes a magnetically responsive member, a fulcrum member, a printed circuit board (PCB), a lid covering the PCB, an activation switch, a touch sensor, a motion sensor, an audio transducer, a signal generator and a controller. The flexible PCB includes an electromagnetic coil, and a plurality of light emitting diodes (LEDs). Opening of the lid actuates the activation switch, and in response, the controller controls the signal generator to generate a coil control signal for the electromagnetic coil to produce a magnetic field that interacts with the magnetically responsive member, to induce oscillatory flapping of the PCB. In response to detecting a touch signal from the controller, or a motion signal from the motion sensor, the controller also generates a LED control signal to control illumination of the LEDs while the PCB is flapping, and an audio control signal to control the audio transducer to output sound.

公开(公告)号：US20230343506A1

公开(公告)日：2023-10-26

申请号：US18216277

申请日：2023-06-29

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Gennadi Sizov ,  Zoran Vrankovic ,  Gary L. Skibinski

IPC: H01F27/28 ,  H01F27/34 ,  H02M1/12 ,  H05K1/18

CPC classification number: H01F27/2804 ,  H01F27/346 ,  H01F27/2885 ,  H02M1/12 ,  H05K1/181 ,  H01F2027/2809 ,  H05K2201/08 ,  H05K2201/0792

Abstract: A system and method for integrating a magnetic component within a power converter includes a coil integrated on a PCB. The PCB includes multiple layers and traces on each layer to form a single coil or to form multiple coils on the magnetic component. The PCB further includes at least one opening in the PCB through which a core component may pass, such that the magnetic component is defined by the coils and the core material. To reduce eddy currents built up within the traces, the dimensions of traces on a layer are varied and the position of traces between layers of the PCB are varied. The widths and locations of individual traces are selected to reduce coupling of the trace to leakage fluxes within the magnetic component. A floating conductive layer may also be provided to still further reduce the magnitude of eddy currents induced within the coil.

公开(公告)号：US20230199962A1

公开(公告)日：2023-06-22

申请号：US18078238

申请日：2022-12-09

Applicant: Silergy Semiconductor Technology (Hangzhou) LTD

Inventor： Gao Fan ,  Chen Zhao

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/14 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0014 ,  H05K2201/08 ,  H05K2201/047

Abstract: A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.

公开(公告)号：US11682980B1

公开(公告)日：2023-06-20

申请号：US17572691

申请日：2022-01-11

Applicant: Vicor Corporation

Inventor： Patrizio Vinciarelli

IPC: H01F27/28 ,  H02M7/00 ,  H05K1/16 ,  H01F27/40 ,  H05K1/18

CPC classification number: H02M7/003 ,  H01F27/2804 ,  H01F27/40 ,  H05K1/165 ,  H01F2027/2809 ,  H05K1/18 ,  H05K2201/08 ,  H05K2201/10015 ,  H05K2201/10053

Abstract: An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits.

公开(公告)号：US09401239B2

公开(公告)日：2016-07-26

申请号：US14687040

申请日：2015-04-15

Applicant: Electroninks Writeables, Inc.

Inventor： Michael A. Bell ,  Analisa Russo

IPC: H01F7/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01F7/0252 ,  H05K1/0386 ,  H05K1/11 ,  H05K1/181 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/08 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2203/104

Abstract: An electrical component for attachment to paper and other substrates comprises, according to one embodiment, a functional electronic part including one or more support pillars on an underside thereof. Each of the support pillars comprises: a channel extending therethrough from a top opening to a bottom opening, where the top opening of the channel is adjacent to the functional electronic part; and a magnet moveably positioned in the channel in electrical contact with the functional electronic part, where the bottom opening of the channel has a width smaller than a maximum lateral dimension of the magnet.

Abstract translation: 根据一个实施例，用于附接到纸和其它基底的电气部件包括在其下侧上包括一个或多个支撑柱的功能电子部件。 每个支撑柱包括：从顶部开口延伸到底部开口的通道，其中通道的顶部开口与功能电子部件相邻; 以及可移动地定位在所述通道中的与所述功能电子部件电接触的磁体，其中所述通道的底部开口具有小于所述磁体的最大横向尺寸的宽度。

公开(公告)号：US20240337827A1

公开(公告)日：2024-10-10

申请号：US18631273

申请日：2024-04-10

Applicant: CANON KABUSHIKI KAISHA

Inventor： KOICHI ODAGAKI

IPC: G02B26/10 ,  H05K1/02 ,  H05K1/18

CPC classification number: G02B26/101 ,  H05K1/0271 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/08 ,  H05K2201/10121

Abstract: An image display device includes: a flexible board, a vibrational structure including a light reflecting film for reflecting light, and a molded circuit component including a mounting portion which is electrically connected to the vibrational structure and on which the vibrational structure is mounted and a connecting portion which is electrically and mechanically connected to the flexible board and which has a lower dynamic rigidity than the mounting portion. The flexible board and the vibrational structure are electrically connected via the molded circuit component.

公开(公告)号：US11950359B2

公开(公告)日：2024-04-02

申请号：US17841853

申请日：2022-06-16

Applicant: NIDEC SANKYO CORPORATION

Inventor： Ryo Uchiyama ,  Masaya Fujimoto

IPC: G06K7/08 ,  H05K1/02

CPC classification number: H05K1/0268 ,  G06K7/082 ,  H05K1/028 ,  H05K2201/08

Abstract: A card reader for use with a card may include a card insertion part provided with an insertion port into which the card is inserted, a protruded part which is provided on a front face of the card insertion part and is protruded to a front side with respect to the card insertion part, a breakage detection wiring which is provided in an inside of the protruded part, and a detection part which detects at least one of disconnection and a short circuit of the breakage detection wiring.

公开(公告)号：US20230413453A1

公开(公告)日：2023-12-21

申请号：US18459624

申请日：2023-09-01

Applicant: STEMCO CO., LTD.

Inventor： Sung Jin LEE ,  Kang Dong KIM ,  Chang Hoon HAN ,  Chul Ho YOON ,  Ho Byung KIM ,  Hyun Woo KIM ,  Gun Woo SHIN

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/4644 ,  H05K3/103 ,  H05K3/3405 ,  H05K1/181 ,  H05K2203/0502 ,  H05K2201/08

Abstract: A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic device including the circuit board are provided. The circuit board includes: a base layer; a wiring layer formed on the base layer; and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.

公开(公告)号：US11744005B2

公开(公告)日：2023-08-29

申请号：US17237594

申请日：2021-04-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hideki Shinkai

IPC: H05K1/02 ,  H01L21/56 ,  H01L23/552 ,  H05K3/28 ,  H05K1/18 ,  H05K9/00

CPC classification number: H05K1/0218 ,  H01L21/56 ,  H01L23/552 ,  H05K3/284 ,  H05K1/181 ,  H05K9/0088 ,  H05K2201/0715 ,  H05K2201/08 ,  H05K2201/10098 ,  H05K2203/1322

Abstract: An electronic component module includes a board, an electronic component, a sealing portion, a metal layer, and a magnetic layer. The board has a first main surface. The electronic component is provided on a first main surface of the board. The sealing portion seals the electronic component. The metal layer covers the sealing portion. The magnetic layer is provided between the sealing portion and the metal layer. The magnetic layer has a magnetic main body and a first cover sheet. The first cover sheet is provided between the magnetic main body and the metal layer. The first cover sheet has a first main surface and a second main surface. The first main surface faces the magnetic main body. The second main surface faces the metal layer. The second outer peripheral end of the second main surface is located inside the first outer peripheral end of the first main surface.