摘要:
A laminate film including a first core polylactic acid layer, a coating receiving-layer of polylactic acid, and coated on one side of the coating receiving-layer with PVOH, EVOH, a blend of crosslinked EVOH/PVOH, vinyl alcohol-vinylamine (PVAm) copolymer, anionic carboxylated styrene-butadiene copolymer (SBR) emulsion, or blends thereof. This coating may be applied after the machine-direction orientation step and dried and oriented in a transverse direction orientation oven if in-line coating is desired; or applied to the film in an off-line coating method and dried in an air flotation oven. The dried coating layer can be metallized. This laminate film exhibits excellent gas and moisture barrier properties, appearance, and metal adhesion. It may also optionally include a heat sealable or winding improving layer on the side opposite the coating receiving-layer of the core layer.
摘要:
A coated article is provided so as to include a low-E (low emissivity) coating having an infrared (IR) reflecting layer(s) of or including a material such as silver (Ag), which is provided between a pair of contact layers. The low-E coating includes an overcoat having at least one layer of or including zirconium oxide and/or a substantially metallic layer. The overcoat has been found to improve the durability of the coating without significantly sacrificing desired optical characteristics. Such coated articles may be used in the context of windows.
摘要:
Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.
摘要:
The present invention relates to a multilayer structure as a reflector with increased mechanical stability, which comprises a substrate layer A, a barrier layer B, a metallic reflector layer C, an optional layer D, a plasma polymer layer E, and a covering layer comprising inorganic constituents, and the covering layer does not contain UV absorber.
摘要:
Coating systems and processes by which the coating systems can be deposited to be resistant to contaminants, and particularly resistant to infiltration and damage caused by CMAS. The coating systems include inner and outer ceramic layers, each having a microstructure characterized by splats and horizontal porosity. The inner ceramic layer consists essentially of zirconia stabilized by about 6 to about 9 weight percent yttria. The outer ceramic layer overlies and contacts the inner ceramic layer to define the outermost surface of the coating system. The outer ceramic layer consists essentially of zirconia stabilized by about 25 to about 75 weight percent yttria, has a thickness that is less than the thickness of the inner ceramic layer, and has a porosity level that is lower than that of the inner ceramic layer.
摘要:
The multilayer metal member of the invention includes a metallic base having a first layer 11 which is an electrocast seamless belt made of nickel or a nickel alloy, and a second layer 12 which is an electrocast seamless belt made of a metal having a Young's modulus lower than that of the first layer 11; and a fluororesin layer 17 provided on the second layer 12 side of the metallic base by the mediation of an adhesion layer, wherein the ratio of the thickness of the second layer 12 to the total thickness of the metallic base is 0.25 to 0.65.
摘要:
A laminate film including a first core polylactic acid layer, a coating receiving-layer of polylactic acid, and coated on one side of the coating receiving-layer with PVOH, EVOH, a blend of crosslinked EVOH/PVOH, vinyl alcohol-vinylamine (PVAm) copolymer, anionic carboxylated styrene-butadiene copolymer (SBR) emulsion, or blends thereof. This coating may be applied after the machine-direction orientation step and dried and oriented in a transverse direction orientation oven if in-line coating is desired; or applied to the film in an off-line coating method and dried in an air flotation oven. The dried coating layer can be metallized. This laminate film exhibits excellent gas and moisture barrier properties, appearance, and metal adhesion. It may also optionally include a heat sealable or winding improving layer on the side opposite the coating receiving-layer of the core layer.
摘要:
A low emissivity and EMI shielding transparent composite film typically for use in association with window glazing and comprising a transparent film substrate having on one side thereof an underlayer of abrasion resistant hardcoat material with at least one infrared reflective layer covering the underlayer, typically a metallic layer which may be encased in metal oxide layers, which is then covered with a thin external protective top coat of a cured fluorinated resin.
摘要:
Certain example embodiments relate to a coated article including a low-E coating. In certain example embodiments, a titanium oxide inclusive bottom layer stack and/or a NiCr-based layer(s) are designed to improve b* coloration values and/or transmission of the coated article. These layer stack portions also advantageously permit a double-silver coated article to achieve (i) an LSG value (Tvis/SHGC) of at least 2.0, (ii) an SHGC value of no greater than 35%, and (iii) a U-value (BTU h−1 ft−2° F.−1) (e.g., x=12 mm) of no greater than 0.30. In certain example embodiments, the titanium oxide based layer may be an interlayer provided in a bottom portion of the layer stack between first and second layers comprising silicon nitride. Coated articles according to certain example embodiments may be used in the context of insulating glass (IG) window units, other types of windows, or in any other suitable application.
摘要:
A thermal barrier coating having a reduced high temperature thermal conductivity includes group II germanate constructs. This thermal barrier coating may be applied directly to a substrate, applied to a bond-coated substrate, and/or incorporated into a protective coating including one or more other thermal barrier coating layers. The thermal barrier coating provides improved thermal protection properties over current industry standards and materials considered for thermal protection applications.