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    Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method
    1.
    发明授权
    Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method 有权

    公开(公告)号：US10349531B2

    公开(公告)日：2019-07-09

    申请号：US15209930

    申请日：2016-07-14

    申请人： JX Nippon Mining & Metals Corporation

    发明人： Nobuaki Miyamoto ,  Michiya Kohiki

    IPC分类号： H05K3/40 ,  H05K3/20 ,  H05K3/18 ,  H05K3/00

    摘要： Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier. The surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz≤3.6 μm, and Sz/Sa≤14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm2 and heated at 220° C. for 2 hours. GMD, which is a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤150 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated using the same procedure.

    COPPER FOIL WITH CARRIER
    6.
    发明申请
    COPPER FOIL WITH CARRIER 有权
    铜箔与承运人

    公开(公告)号：US20160242281A1

    公开(公告)日：2016-08-18

    申请号：US15139482

    申请日：2016-04-27

    申请人： JX Nippon Mining & Metals Corporation

    发明人： Tomota Nagaura ,  Michiya Kohiki ,  Terumasa Moriyama

    IPC分类号： H05K1/09

    CPC分类号： H05K1/09 ,  B32B3/30 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/08 ,  C22C9/00 ,  C25D1/04 ,  C25D3/12 ,  C25D3/38 ,  C25D5/12 ,  C25D9/08 ,  H05K1/0313 ,  H05K3/022 ,  H05K3/025 ,  H05K3/06 ,  H05K3/181 ,  H05K3/188 ,  H05K3/381 ,  H05K3/383 ,  H05K3/388 ,  H05K2201/09009 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/1291

    摘要： Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.

    摘要翻译： 提供一种用于印刷电路板的铜箔，其在其至少一个表面上包括粗糙层。 在粗糙层中，粒子底部的平均粒径D1与粒子的底部相隔10％的粒子长度为0.2〜1.0μm，粒子长度L1与平均直径D1的比L1 / D1 在颗粒底部为15或更小。 在印刷电路板用铜箔中，当将具有粗糙层的印刷布线用铜箔层压到树脂上，然后通过蚀刻除去铜层时，占据具有凹凸的树脂粗糙面的孔面积之和为 20％以上。 本发明涉及开发用于半导体封装基板的铜箔，其可以避免电路侵蚀而不会导致铜箔的其它性能的劣化。 特别地，本发明的目的是提供一种用于印刷线路板的铜箔和铜箔的制造方法，其中可以通过改善粗糙层来提高铜箔和树脂之间的粘附强度 的铜箔。

    Carrier-Attached Copper Foil, Laminate, Laminate Producing Method, Printed Wiring Board Producing Method, And Electronic Device Producing Method
    9.
    发明申请
    Carrier-Attached Copper Foil, Laminate, Laminate Producing Method, Printed Wiring Board Producing Method, And Electronic Device Producing Method 审中-公开
    载体铜箔，层压板，层压板生产方法，印刷线路板生产方法和电子设备生产方法

    公开(公告)号：US20170019991A1

    公开(公告)日：2017-01-19

    申请号：US15209930

    申请日：2016-07-14

    申请人： JX Nippon Mining & Metals Corporation

    发明人： Nobuaki Miyamoto ,  Michiya Kohiki

    IPC分类号： H05K1/09 ,  H05K3/20 ,  H05K3/40 ,  H05K3/00 ,  H05K3/18 ,  H05K3/02 ,  H05K1/11

    CPC分类号： H05K3/4038 ,  H05K3/0035 ,  H05K3/188 ,  H05K3/205 ,  H05K3/4007

    摘要： Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier. The surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz≦3.6 μm, and Sz/Sa≦14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm2 and heated at 220° C. for 2 hours. GMD, which is a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≦150 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated using the same procedure.

    摘要翻译： 本文提供了一种载体附着的铜箔，其具有通过超薄铜层所需的激光可钻性，优选用于制造高密度集成电路基板。 载体附着的铜箔包括在载体的一个或两个表面上依次设置的中间层和超薄铜层。 在超薄铜层的层间侧的表面粗糙度Sz和表面粗糙度Sa满足Sz≤3.6μm，用激光显微镜测量的Sz /Sa≤14.00，如果从载体附着的铜箔上分离载体，则 在载体附着的铜箔在20kgf / cm 2的压力下从超薄铜层侧层压到绝缘基板上并在220℃下加热2小时的JIS C 6471。 在MD方向的层间侧的超薄铜层表面的60度光泽度的GMD在载体附着后根据JIS C 6471从载体附着的铜箔上分离载体的情况下满足GMD≤150 使用相同的程序层压铜箔。