DRIVER CIRCUIT FOR A BUCK CONVERTER, RELATED INTEGRATED CIRCUIT, ELECTRONIC BUCK CONVERTER AND METHOD

    公开(公告)号:US20230170803A1

    公开(公告)日:2023-06-01

    申请号:US18154167

    申请日:2023-01-13

    CPC classification number: H02M3/158 H02M1/08 H02M3/1566 H02M1/0019

    Abstract: An embodiment buck converter control circuit comprises an error amplifier configured to generate an error signal based on a feedback signal and a reference signal, a pulse generator circuit configured to generate a pulsed signal having switching cycles set to high and low as a function of the error signal, a driver circuit configured to generate a drive signal for an electronic switch of the buck converter as a function of the pulsed signal, a variable load, connected between two output terminals of the buck converter, configured to absorb a current based on a control signal, and a detector circuit configured to monitor a first signal indicative of an output current provided by the buck converter and a second signal indicative of a negative transient of the output current, and verify whether the second signal indicates a negative transient of the output current.

    CRACK DETECTOR FOR SEMICONDUCTOR DIES
    195.
    发明公开

    公开(公告)号:US20230168300A1

    公开(公告)日:2023-06-01

    申请号:US18053688

    申请日:2022-11-08

    CPC classification number: G01R31/315 H01L22/12

    Abstract: An assembly for detecting a structural defect in a semiconductor die is provided. The assembly includes a defect-detection sensor and a microcontroller. The defect-detection sensor includes a plurality of resistive paths of electrical-conductive material in the semiconductor die, each of which has a first end and a second end and extends proximate a perimeter of the semiconductor die. The defect-detection sensor includes a plurality of signal-generation structures, each coupled to a respective resistive path and configured to supply a test signal to the resistive path. The microcontroller is configured to control the signal-generation structures to generate the test signals, acquire the test signals in each resistive paths, test an electrical feature of the resistive paths by performing an analysis of the test signals acquired and detect the presence of the structural defect in the semiconductor die based on a result of the analysis of the test signals acquired.

    ELECTROSTATIC CHARGE SENSOR WITH HIGH IMPEDANCE CONTACT PADS

    公开(公告)号:US20230168290A1

    公开(公告)日:2023-06-01

    申请号:US17537069

    申请日:2021-11-29

    Inventor: Massimo ORIO

    CPC classification number: G01R29/12 G01R29/0878 G01R29/24

    Abstract: The present disclosure is directed to a device that provides high impedance contact pads for an electrostatic charge sensor. The contact pads are shared between the electrostatic charge sensor and drivers. The contact pads are set to a high impedance state by reducing current leakage through the drivers. Compared to electrostatic charge sensor with low impedance contact pads, the electrostatic charge sensor disclosed herein has high sensitivity, and is able to detect weak electrostatic fields.

    Method of controlling a half-bridge circuit

    公开(公告)号:US11652479B2

    公开(公告)日:2023-05-16

    申请号:US17659226

    申请日:2022-04-14

    CPC classification number: H03K17/6877 H02M1/0025 H02M3/157 H03K17/6874

    Abstract: A method of controlling a half-bridge circuit includes receiving an analog feedback signal proportional to an output of the half-bridge circuit, comparing the received analog feedback signal with a threshold value, selecting a digital feedback signal based on a result of the comparing, comparing the digital feedback signal with a digital reference signal to generate a digital error signal, integrating the digital error signal to generate an integration error signal, downscaling the integral error signal to generate a downscaled integration signal, sampling the downscaled integration signal to generate a sampled integration signal, and generating pulsed signals from the sampled integration signal to provide an input to the half-bridge circuit.

Patent Agency Ranking