Abstract:
A low-noise NPN transistor comprising a cut-off region laterally surrounding, at a given distance, the emitter region in the surface portion of the transistor and of such conductivity as to practically turn off the surface portion of the transistor, so that the transistor operates mainly in the bulk portion. The cut-off region is formed by a P ring astride a P.sup.- type well region and the epitaxial layer.
Abstract:
A high density, mixed technology integrated circuit comprises CMOS structures and bipolar lateral transistors, the electrical efficiency and Early voltage of which are maintained high by forming "well" regions through the collector area. The operation determines the formation of a "collector extension region" extending relatively deep within the epitaxial layer so as to intercept the emitter current and gather it to the collector, subtracting it from dispersion toward the substrate through the adjacent isolation junctions surrounding the region of the lateral bipolar transistor. Under comparable conditions, the ratio between IcIsubstrate is incremented from about 8 to about 300 and the Early voltage from about 20V to about 100V. The V.sub.CEO, BV.sub.CBO and BV.sub.CES voltages are also advantageously increased by the presence of said "well" region formed in the collector zone.
Abstract:
A process for the manufacture of an integrated voltage limiter and stabilizer component in a flash EEPROM memory device comprises a step of formation of an N type lightly doped well on a single-crystal silicon substrate; a step of formation of an active area on the surface of said N type well; a step of growth of a thin gate oxide layer over said active area; a step of implantation of a first heavy dose of N type dopant into said N type well to obtain an N type region; a step of implantation of a second heavy dose, higher than said first heavy dose, of N type dopant into said N type region to obtain an N+contact region to both the N type well and said N type region; a step of implantation of a third heavy dose, higher than said first heavy dose, of P type dopant into said N type region to form a P+ region.
Abstract:
A planarization process for the manufacturing of highly-planar interlayer dielectric thin films in integrated circuits, particularly in non-volatile semiconductor memory devices, comprises the steps of: forming a first barrier layer over a semiconductor substrate wherein integrated devices have been previously obtained; forming a second layer of oxide containing phosphorous and boron over the first undoped oxide the concentration of boron being lower than the concentration of phosphorous; forming a third layer of oxide containing phosphorous and boron over the second oxide layer, the concentration of phosphorous being lower than or equal to the concentration of boron; performing a thermal process at a temperature sufficient to melt the third oxide layer, to obtain a planar surface.
Abstract:
A circuit structure for a matrix of EEPROM memory cells, being of a type which comprises a matrix of cells including plural rows and columns, with each row being provided with a word line and a control gate line and each column having a bit line; the bit lines, moreover, are gathered into groups or bytes of simultaneously addressable adjacent lines. Each cell in the matrix incorporates a floating gate transistor which is coupled to a control gate, connected to the control gate line, and is connected serially to a selection transistor; also, the cells of each individual byte share their respective source areas, which areas are structurally independent for each byte and are led to a corresponding source addressing line extending along a matrix column.
Abstract:
A method for testing an electrically erasable and programmable memory device comprising a matrix of memory cells and redundancy memory cells for functionally substituting defective memory cells, comprises the steps of: programing all the memory cells of the memory device; submitting all the memory cells of the memory device to a preliminary electrical erasure for a time much shorter than an average erasing time of the memory cells; reading the information stored in all the memory cells of the memory device; memorizing the addresses of defective memory cells which have been read as erased memory cell; storing the addresses of the defective memory cells in redundancy registers associated to redundancy memory cells which must substitute the defective memory cells.
Abstract:
A method for generating a reset signal in an electrically programmable non-volatile storage device of a type which comprises a matrix of memory cells and a control logic portion being supplied a supply voltage and a programming voltage, and a threshold detection circuit adapted to detect a decrease in the supply voltage, provides for the signal applied to the control logic to be obtained as a change-over function between the output signal from the threshold detector and a reset signal generated during the power-on transient of the device.
Abstract:
An electronic device for the automatic conversion of sampling frequencies, being a type adapted to convert a predetermined frequency of a sampled input signal to a desired frequency of an output signal. The device is comprised of:a phase detector being input both the input frequency and the output frequency; a decoder block associated with the detector to determine an interpolation coefficient; an interpolation filter having a digital input for encoding the sampling signal and receiving the input frequency on the one side, and a digital signal representative of the interpolation coefficient on the other side; and a synchronizer connected after the filter and being input both said input and output frequencies, the synchronizer having a digital output for encoding the converted sampling signal.
Abstract:
A DFT technique for the detection of bridging faults in CMOS and BiCMOS logic ICs, employs purposely integrated monitoring inverters, driven by signal nodes of the functional circuits to be tested, for revealing the presence of intermediate voltages of a critical value. The monitoring inverters are supplied through a dedicated shadow line that is connected to either one of the supply rails of the functional circuits through a load: a resistance, for a static implementation, or a capacitor, for a dynamic (clocked) implementation. Absence of series connected built-in current sensors (BICSs) avoids degradation of the performance of the functional circuits and is compatible with scaling down of the power supply and with on-line testing techniques. Only critical bridging faults may be reliably and selectively detected, thus reducing the number of rejects, failing a conventional IDDQ test. In a modified embodiment, a DFT scheme of the invention may be adapted to reveal also stuck-at faults, by connecting together the output nodes of certain monitoring inverters to create activatable current paths from a test node (shadow line) and a supply rail of the IC.
Abstract:
A control circuit for a power transistor, connected between two supply terminals in series with a load. The control circuit comprises a control logic circuit which produces a signal at two levels with respect to a reference terminal, a level shifter connected between the control circuit and the power transistor, which produces a signal at two levels relative to the node between the power transistor and the load. The level shifter comprises a flip-flop the output of which controls the power transistor, and an electronic switch, for example a MOSFET transistor, connected between the "set" input of the flip-flop and the node and controlled by the "reset" input of the flip-flop in such a way as to be closed when the "reset" input is greater, by a predetermined value, than that of the node. The electronic switch prevents the parasitic current flowing through the set and reset inputs from erroneously switching the power transistor.