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    Protector
    261.
    发明授权
    Protector 有权

    公开(公告)号：US09781868B2

    公开(公告)日：2017-10-03

    申请号：US15354345

    申请日：2016-11-17

    Applicant: SUMITOMO WIRING SYSTEMS, LTD.

    Inventor： Masataka Wakabayashi ,  Junya Fujita ,  Keisuke Yagihashi

    IPC: H05K1/00 ,  H05K9/00 ,  H05K1/02

    CPC classification number: H05K9/0007 ,  H05K1/0228 ,  H05K9/0098 ,  H05K2201/09245

    Abstract: A compact protector is unlikely to be affected by electromagnetic noise and provides excellent workability when being assembled, despite having a configuration in which twisted electrical wires are not used. The protector includes first and second plate members that respectively have a plurality of parallel slits that have a depth that is approximately half a length of wiring areas in a widthwise direction of the wiring areas. First and second linear conductors are respectively supported by the first and second plate members such that the first and second linear conductors have an approximately wave-like shape that is bent in a lengthwise direction, a widthwise direction, and a thickness direction of the first and second plate members. The first and second plate members are laterally fitted to each other such that respective bottom parts of each pair of parallel slits that face each other are brought close to each other.

    PROTECTOR
    266.
    发明申请
    PROTECTOR 有权

    公开(公告)号：US20170164528A1

    公开(公告)日：2017-06-08

    申请号：US15354345

    申请日：2016-11-17

    Applicant: SUMITOMO WIRING SYSTEMS, LTD.

    Inventor： Masataka WAKABAYASHI ,  Junya FUJITA ,  Keisuke YAGIHASHI

    IPC: H05K9/00

    CPC classification number: H05K9/0007 ,  H05K1/0228 ,  H05K9/0098 ,  H05K2201/09245

    Abstract: A compact protector is unlikely to be affected by electromagnetic noise and provides excellent workability when being assembled, despite having a configuration in which twisted electrical wires are not used. The protector includes first and second plate members that respectively have a plurality of parallel slits that have a depth that is approximately half a length of wiring areas in a widthwise direction of the wiring areas. First and second linear conductors are respectively supported by the first and second plate members such that the first and second linear conductors have an approximately wave-like shape that is bent in a lengthwise direction, a widthwise direction, and a thickness direction of the first and second plate members. The first and second plate members are laterally fitted to each other such that respective bottom parts of each pair of parallel slits that face each other are brought close to each other.

    Multilayer circuit substrate
    267.
    发明授权
    Multilayer circuit substrate 有权
    多层电路基板

    公开(公告)号：US09590288B2

    公开(公告)日：2017-03-07

    申请号：US14701171

    申请日：2015-04-30

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Tetsuo Saji ,  Hiroshi Nakamura

    IPC: H01F3/08 ,  H01P3/08 ,  H01P3/00 ,  H05K1/02

    CPC classification number: H01P3/08 ,  H01P3/003 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/0298 ,  H05K2201/09245

    Abstract: A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer across an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area, and the first signal line is formed at a smaller line width in the intersection area than in the non-intersection area.

    Abstract translation: 多层电路基板包括：第一信号线和形成在第一导电层中的第一接地导体; 以及形成在第二导电层中的第二信号线和第二接地导体，所述第二导电层跨过绝缘层面向所述第一导电层。 第一信号线在多层电路基板的俯视图中与第二信号线相交，在第一和第二信号线的交叉区域中，第一接地导体与第一信号线之间的间隔比非非空 在第二接地导体和第二信号线之间的空间在交叉区域中比非交叉区域中的空间小，并且第一信号线形成在交叉区域中比在 非交叉区域。

    Feed line structure, circuit board using same, and EMI noise reduction method
    270.
    发明授权
    Feed line structure, circuit board using same, and EMI noise reduction method 有权
    馈线结构，使用电路板和EMI降噪方法

    公开(公告)号：US09532442B2

    公开(公告)日：2016-12-27

    申请号：US13387566

    申请日：2010-06-17

    Applicant: Kazuhiro Kashiwakura

    Inventor： Kazuhiro Kashiwakura

    IPC: H05K1/18 ,  H05K1/02 ,  H05K1/16

    CPC classification number: H05K1/0228 ,  H05K1/162 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09781

    Abstract: Provided is a feed line structure that enables suppression of noise entering a primary power supply from an electronic circuit without using a circuit component such as a choke coil and a capacitor and also without increasing an occupied area on the circuit board, so that an EMI countermeasure is achieved. The feed line structure includes a feed line composed by pairing a power supply wire 41 and a reference potential wire 42 in an insulator 40, and is characterized in that a wire 43 in a floating state in potential is provided.

    Abstract translation: 提供了一种馈线结构，其能够抑制从电子电路进入主电源的噪声，而不使用诸如扼流线圈和电容器的电路元件，并且还不增加电路板上的占用面积，使得EMI对策 已完成。 馈电线结构包括通过将电源线41和参考电位线42配对在绝缘体40中而构成的馈电线，其特征在于提供处于浮置状态的电线43。

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