公开(公告)号：US20140262451A1

公开(公告)日：2014-09-18

申请号：US14289401

申请日：2014-05-28

Applicant: YAZAKI CORPORATION

Inventor： Akira HARAO ,  Mototatsu MATSUNAGA ,  Yasuhiro SUGIURA ,  Minoru KUBOTA

IPC: H05K1/02 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

Abstract translation: 公开了布线基板及其制造方法，所述布线基板包括具有高导热层的基板，其中所述基板的前表面和后表面中的至少一个是用于各种部件的安装表面; 形成在所述基板中的窗部; 以及从所述窗部的内表面部分延伸并在垂直于所述基板的表面的方向上弯曲的连接端子。

公开(公告)号：US20140240885A1

公开(公告)日：2014-08-28

申请号：US14190297

申请日：2014-02-26

Applicant: Murata Manufacturing Co., Ltd. ,  DENSO CORPORATION

Inventor： Yuuto KAMIYA ,  Toru ITABASHI ,  Ryoichi SHIRAISHI ,  Yuki MIKAMI ,  Akihiro YANAGISAWA ,  Shigeki NISHIYAMA

IPC: H02H3/08 ,  H05K1/18

CPC classification number: H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10181 ,  H05K2201/10636 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10946 ,  Y02P70/611

Abstract: A main body of an electronic part has multiple electrodes, to which multiple terminals are respectively connected. The terminals include a fuse terminal and a normal terminal, each of which extends from the main body to a printed board so that the main body is supported at a position above and separated from a board surface of the printed board. The fuse terminal has an intermediate portion between an electrode-connected portion and a land-connected portion. The intermediate portion has a cut-off portion having a smaller width than other portions of the fuse terminal, so that the cut-off portion is melted down when excess current flows in the fuse terminal. The intermediate portion extends in a direction parallel to the board surface or in a direction inclined to the board surface at an angle smaller than 90 degrees.

Abstract translation: 电子部件的主体具有分别连接有多个端子的多个电极。 端子包括保险丝端子和正常端子，每个端子从主体延伸到印刷电路板，使得主体被支撑在印刷电路板的板表面上方和离开印刷电路板的位置。 熔丝端子在电极连接部分和平台连接部分之间具有中间部分。 中间部分具有比熔丝端子的其它部分更小的宽度的截止部分，使得当过剩的电流在熔丝端子中流动时，截止部分被熔化。 中间部分在平行于板表面的方向上或者以小于90度的角度沿与板表面倾斜的方向延伸。

公开(公告)号：US20140160681A1

公开(公告)日：2014-06-12

申请号：US13708876

申请日：2012-12-07

Applicant: WINTEC INDUSTRIES, INC.

Inventor： Kong-Chen Chen

IPC: H05K1/02 ,  H05K13/00

CPC classification number: H05K3/366 ,  H01R12/718 ,  H01R12/721 ,  H01R12/737 ,  H05K1/0201 ,  H05K1/117 ,  H05K3/325 ,  H05K2201/09181 ,  H05K2201/09745 ,  H05K2201/10265 ,  H05K2201/10303 ,  H05K2201/1034 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10787 ,  H05K2201/1081 ,  Y10T29/49117

Abstract: An electric apparatus for connecting to a first printed circuit includes a second printed circuit, which includes a first surface substantially parallel to a first plane and a second surface substantially parallel to a second plane perpendicular to the first plane. The first surface includes a first area and the second surface includes a smaller second area. The second printed circuit includes conductive traces in a layer of the second printed circuit. The electric apparatus further includes first and second conductive pins including first and second longitudinal axes, respectively. First and second notches in the second printed circuit include respective first and second openings through the second surface adapted to receive portions of the first and second pins and adapted to electrically connect the pins to first and second respective ones of the conductive traces. The first and second longitudinal axes are installed substantially parallel to the first plane.

Abstract translation: 用于连接到第一印刷电路的电气设备包括第二印刷电路，其包括基本上平行于第一平面的第一表面和基本上平行于垂直于第一平面的第二平面的第二表面。 第一表面包括第一区域，第二表面包括较小的第二区域。 第二印刷电路在第二印刷电路的一层中包括导电迹线。 电气设备还包括分别包括第一和第二纵向轴线的第一和第二导电销。 第二印刷电路中的第一和第二凹口包括通过第二表面的相应的第一和第二开口，其适于接收第一和第二引脚的部分，并且适于将引脚电连接到第一和第二相应的导电迹线。 第一和第二纵轴基本上平行于第一平面安装。

公开(公告)号：US08628338B2

公开(公告)日：2014-01-14

申请号：US13125741

申请日：2009-01-30

Applicant: Takashi Miyamoto

Inventor： Takashi Miyamoto

IPC: H01R12/00

CPC classification number: H05K1/18 ,  B60R25/00 ,  H01R4/028 ,  H01R12/58 ,  H01R12/716 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10659 ,  H05K2201/10757

Abstract: To reduce the number of terminals that protrude from a printed board and to lower a cost in production of the base. A printed board including an electrical junction unit provided with a set of terminals soldered on printed boards. The set of terminals comprise first type terminals each having a small sectional area and second type terminals each having a sectional area greater than that of each of the first type terminals. The electrical junction unit is any one of only the first type terminals, only the second type terminals, and a combination of the first and second type terminals. The first type terminals are inserted into and protrude from through-holes in a base and are soldered on the printed boards. The second type terminals are soldered on the printed boards without using the base.

Abstract translation: 减少从印刷电路板突出的端子数量，降低基座的生产成本。 一种印刷电路板，包括电连接单元，其具有焊接在印刷电路板上的一组端子。 该组端子包括各自具有小截面面积的第一类型端子和分别具有大于第一类型端子的截面积的第二类型端子。 电接合单元是仅第一类型端子，仅第二类型端子中的任何一种以及第一和第二类型端子的组合。 第一类型端子插入基底中的通孔并从其中突出并且被焊接在印刷板上。 第二类端子焊接在印刷电路板上而不使用基座。

公开(公告)号：US08514048B2

公开(公告)日：2013-08-20

申请号：US13286234

申请日：2011-11-01

Applicant: Hsiang-Yi Tseng ,  Ching-Hsiang Tien ,  Yi-Lin Chen ,  Hsin-Wei Tsai ,  Chun-Song Ming

Inventor： Hsiang-Yi Tseng ,  Ching-Hsiang Tien ,  Yi-Lin Chen ,  Hsin-Wei Tsai ,  Chun-Song Ming

IPC: H01F27/30 ,  H01F27/29 ,  H01F27/24

CPC classification number: H05K1/182 ,  H01F27/306 ,  H05K3/306 ,  H05K2201/1003 ,  H05K2201/10409 ,  H05K2201/10757

Abstract: A transformer capable of adjusting its height is provided. The transformer is formed on a circuit board having a receiving hole. The transformer comprises a winding module, two magnetic core modules, a plurality of pins and a plurality of supporting bulges. The winding module comprises a winding baseboard and a winding pillar where a winding structure is formed thereon. The winding pillar is received in the receiving hole. The winding baseboard further comprises a corresponding surface heading to the circuit board. The magnetic core modules contact and hold the winding module. The pins are formed on the edge of the to winding baseboard to be connected to the circuit board around the receiving hole. The supporting bulges are formed between the corresponding surface and the circuit board, wherein the height of the corresponding surface relative to the circuit board is adjusted according to the supporting bulges.

Abstract translation: 提供了能够调节其高度的变压器。 变压器形成在具有接收孔的电路板上。 变压器包括绕组模块，两个磁芯模块，多个销和多个支撑凸起。 绕组模块包括绕组基板和在其上形成绕组结构的绕组柱。 卷绕柱被容纳在接收孔中。 绕组基板还包括朝向电路板的相应表面。 磁芯模块接触并保持绕组模块。 引脚形成在绕组基板的边缘上，以在接收孔周围连接到电路板。 支撑凸起形成在相应的表面和电路板之间，其中相对于电路板的对应表面的高度根据支撑凸起来调节。

公开(公告)号：US08379395B2

公开(公告)日：2013-02-19

申请号：US12665735

申请日：2008-04-22

Applicant: Gerhard Wetzel

Inventor： Gerhard Wetzel

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00

CPC classification number: H05K3/284 ,  H01L23/3107 ,  H01L2924/0002 ,  H05K2201/1034 ,  H05K2201/10757 ,  H05K2201/10977 ,  H05K2203/1316 ,  H01L2924/00

Abstract: An electrical component system and method is provided. In an embodiment, the electrical component system includes a circuit carrier onto which at least one electrical component has been mounted. The circuit carrier is injection molded around using a molding compound. An embedding length of a circuit-board conductor in the molding compound, situated between the contacting area on the circuit carrier and the exit location, is maximized.

Abstract translation: 提供电气部件系统和方法。 在一个实施例中，电气部件系统包括其上安装有至少一个电气部件的电路载体。 使用模塑料将电路载体注塑成型。 位于电路载体上的接触区域和出口位置之间的模制化合物中的电路板导体的嵌入长度最大化。

公开(公告)号：US20130025923A1

公开(公告)日：2013-01-31

申请号：US13237728

申请日：2011-09-20

Applicant: Yung-Cheng CHANG

Inventor： Yung-Cheng CHANG

IPC: H05K1/16

CPC classification number: H05K7/08 ,  H05K1/0203 ,  H05K3/308 ,  H05K3/3447 ,  H05K7/20 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: A component fixed on a circuit board. The circuit board has a first perforation and a second perforation. The component has a body, a first pin, and a second pin. The first pin is connected to a side of the body. The first pin has a first section, a first bent section, and a second bent section. The first bent section is stuck in the first perforation. The second pin is connected to another side of the body. The second pin has a second section, a third bent section, and a fourth bent section. The third bent section is stuck in the second perforation. The design prevents the body from toppling and makes it stable and convenient to assemble the component onto the circuit board.

Abstract translation: 固定在电路板上的部件。 电路板具有第一穿孔和第二穿孔。 该部件具有主体，第一销和第二销。 第一针连接到身体的一侧。 第一销具有第一部分，第一弯曲部分和第二弯曲部分。 第一个弯曲部分卡在第一个穿孔中。 第二针连接到身体的另一侧。 第二销具有第二部分，第三弯曲部分和第四弯曲部分。 第三个弯曲部分卡在第二个穿孔中。 该设计可防止身体倒塌，使组件安装在电路板上稳定方便。

公开(公告)号：US20110201216A1

公开(公告)日：2011-08-18

申请号：US13125741

申请日：2009-01-30

Applicant: Takashi Miyamoto

Inventor： Takashi Miyamoto

IPC: H01R12/71

CPC classification number: H05K1/18 ,  B60R25/00 ,  H01R4/028 ,  H01R12/58 ,  H01R12/716 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10659 ,  H05K2201/10757

Abstract: To reduce the number of terminals that protrude from a printed board and to lower a cost in production of the base. A printed board including an electrical junction unit provided with a set of terminals soldered on printed boards. The set of terminals comprise first type terminals each having a small sectional area and second type terminals each having a sectional area greater than that of each of the first type terminals. The electrical junction unit is any one of only the first type terminals, only the second type terminals, and a combination of the first and second type terminals. The first type terminals are inserted into and protrude from through-holes in a base and are soldered on the printed boards. The second type terminals are soldered on the printed boards without using the base.

Abstract translation: 减少从印刷电路板突出的端子数量，降低基座的生产成本。 一种印刷电路板，包括电连接单元，其具有焊接在印刷电路板上的一组端子。 该组端子包括各自具有小截面面积的第一类型端子和分别具有大于第一类型端子的截面积的第二类型端子。 电接合单元是仅第一类型端子，仅第二类型端子中的任何一种以及第一和第二类型端子的组合。 第一类型端子插入基底中的通孔并从其中突出并且被焊接在印刷板上。 第二类端子焊接在印刷电路板上而不使用基座。

公开(公告)号：US07868447B2

公开(公告)日：2011-01-11

申请号：US12390714

申请日：2009-02-23

Applicant: Hirochika Narita

Inventor： Hirochika Narita

IPC: H01L23/495

CPC classification number: H04N1/03 ,  H01L23/49541 ,  H01L23/49544 ,  H01L23/49555 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/16195 ,  H04N2201/02456 ,  H04N2201/02466 ,  H04N2201/02483 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10689 ,  H05K2201/10757 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Warpage and twist of a solid-state image sensing apparatus is controlled, thereby preventing displacement occurring to the solid-state image sensing apparatus when it is mounted on a printed circuit board. The solid-state image sensing apparatus comprises a plurality of outer leads, and the outer leads each comprises a horizontal portion protruding in the horizontal direction from a side face of a package body for encasing a solid-state image sensing chip therein, an end portion extending in a direction orthogonal to the horizontal portion, and disposed directly below the horizontal portion, a mid portion positioned between the horizontal portion, and the end portion, a first bend formed between the horizontal portion, and the mid portion, and a second bend formed between the mid portion, and the end portion.

Abstract translation: 控制固态图像感测装置的翘曲和扭曲，从而防止固体摄像装置安装在印刷电路板上时产生的位移。 固体摄像装置包括多个外部引线，外部引线各自包括水平部分，该水平部分从封装体的侧面在水平方向上突出，用于将固态图像感测芯片包封在其中，端部 在垂直于水平部分的方向上延伸并且设置在水平部分正下方，位于水平部分和端部之间的中间部分，形成在水平部分和中间部分之间的第一弯曲部分和第二弯曲部分 形成在中间部分和端部之间。

公开(公告)号：US07820920B2

公开(公告)日：2010-10-26

申请号：US12284036

申请日：2008-09-17

Applicant: Yong Dong ,  Jiebing Pan ,  Tieming Luo

Inventor： Yong Dong ,  Jiebing Pan ,  Tieming Luo

IPC: H01L23/495

CPC classification number: H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/2036 ,  H05K2203/167 ,  H05K2203/304

Abstract: The present application discloses a casing and a corresponding mounting device, for protecting pins of an element from melting during a process flow in which the element is soldered on a circuit board, while saving an area required for soldering the element on the circuit board. The casing comprises a hollow body provided with at least one opening.

Abstract translation: 本申请公开了一种壳体和相应的安装装置，用于在将元件焊接在电路板上的工艺流程期间保护元件的销钉熔化，同时节省了将元件焊接在电路板上所需的面积。 壳体包括设置有至少一个开口的中空主体。