公开(公告)号：US10020092B2

公开(公告)日：2018-07-10

申请号：US15368235

申请日：2016-12-02

Applicant: FURUKAWA ELECTRIC CO., LTD. ,  FURUKAWA MAGNET WIRE CO., LTD.

Inventor： Makoto Oya ,  Ryousuke Obika ,  Keiichi Tomizawa

IPC: H01B3/30 ,  H01B3/42 ,  H01B7/00 ,  H01B7/02 ,  H01B13/00 ,  H02K3/30 ,  H01B1/02 ,  H01B13/14

CPC classification number: H01B3/308 ,  H01B1/023 ,  H01B3/30 ,  H01B3/306 ,  H01B3/42 ,  H01B3/427 ,  H01B7/00 ,  H01B7/02 ,  H01B13/00 ,  H01B13/148 ,  H02K3/30

Abstract: An insulated wire which comprises an aluminum conductor, having: an adhesion layer formed by directly baking, on the aluminum conductor, varnish containing a carboxy group; an insulation layer as an outer layer of the adhesion layer; and a reinforcement insulation layer as an outer layer of the insulation layer; and a method of producing the same.

公开(公告)号：US20180190532A1

公开(公告)日：2018-07-05

申请号：US15905888

申请日：2018-02-27

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Jirou SUGIYAMA ,  Masami Aoyama

IPC: H01L21/683 ,  H01L23/31

Abstract: Provided is a film for semiconductor protection, which can prevent warpage in a semiconductor wafer or a semiconductor chip and can also prevent the occurrence of chipping or ref low cracking. The film for semiconductor protection of the invention has a metal layer to be stuck to the back surface of a semiconductor chip, and an adhesive layer for adhering the metal layer to the back surface of the semiconductor chip, the surface free energy of the face of the adhesive layer on the side that is adhered to the semiconductor chip and the surface free energy of the face on the side that is adhered to the metal layer are together 35 mJ/m2 or greater, and the peeling force between the adhesive layer in the B-stage state and the metal layer is 0.3 N/25 mm or higher.

公开(公告)号：US20180190316A1

公开(公告)日：2018-07-05

申请号：US15570751

申请日：2016-05-23

Applicant: UACJ Corporation ,  Furukawa Electric Co., Ltd.

Inventor： Kotaro KITAWAKI ,  Takuya MURATA ,  Akira HIBINO ,  Naoki KITAMURA ,  Masanobu ONISHI ,  Hideki TAKAHASHI ,  Satoshi YAMAZAKI ,  Sadayuki TODA

IPC: G11B5/65 ,  G11B5/858 ,  C22C21/06 ,  C22F1/047

Abstract: The present invention provides: an aluminum alloy substrate for magnetic discs with excellent plating surface smoothness; a manufacturing method therefor; and a magnetic disc using said aluminum alloy substrate for magnetic discs. The present invention is an aluminum alloy substrate for magnetic discs, a manufacturing method therefor, and a magnetic disc using said aluminum alloy substrate for magnetic discs, the aluminum alloy substrate being characterized in being obtained from an aluminum alloy containing Mg: 2.0-8.0 mass % (“%” below), Be: 0.00001-0.00200%, Cu: 0.003-0.150%, Zn: 0.05-0.60%, Cr: 0.010-0.300%, Si: 0.060% or less, Fe: 0.060% or less, the balance being obtained from Al and unavoidable impurities.

公开(公告)号：US10007073B2

公开(公告)日：2018-06-26

申请号：US15470282

申请日：2017-03-27

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masanori Takahashi ,  Junichi Hasegawa ,  Takeshi Yagi

IPC: G02B6/14 ,  G02B6/42 ,  G02B6/02 ,  G02B6/255

CPC classification number: G02B6/421 ,  G02B6/02395 ,  G02B6/122 ,  G02B6/14 ,  G02B6/24 ,  G02B6/2551 ,  G02B6/30 ,  G02B6/4216 ,  G02B6/4243 ,  G02B6/4249

Abstract: An optical component includes: a high-relative-refractive-index-difference optical fiber; a single-mode optical fiber fusion-spliced to the high-relative-refractive-index-difference optical fiber, a mode-field diameter of the single-mode optical fiber being greater than a mode-field diameter of the high-relative-refractive-index-difference optical fiber at a wavelength of 1550 nm; and an optical device connected to an end surface of the high-relative-refractive-index-difference optical fiber where the single-mode optical fiber is not fusion-spliced. A total of a connection loss between the high-relative-refractive-index-difference optical fiber and the single-mode optical fiber at the wavelength of 1550 nm and a connection loss between the high-relative-refractive-index-difference optical fiber and the optical device at the wavelength of 1550 nm is less than a connection loss at the wavelength of 1550 nm when the single-mode optical fiber is connected to the optical device directly.

公开(公告)号：US09989723B2

公开(公告)日：2018-06-05

申请号：US15510521

申请日：2015-01-13

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yutaka Hoshino ,  Noboru Okada ,  Tatsuya Oyama

IPC: G02B6/44

CPC classification number: G02B6/4404 ,  G02B6/44 ,  G02B6/4403 ,  G02B6/4411 ,  G02B6/443 ,  G02B6/4434 ,  G02B6/448 ,  G02B6/4494

Abstract: An optical fiber ribbon comprises a plurality of optical fiber strands that are arranged side-by-side in one direction and integrated. The optical fiber ribbon comprises a plurality of optical fiber strands that are bonded in parallel. In the optical fiber ribbon, the adjacent optical fiber strands are bonded using a bonding section in which the same are continuously bonded along the entire length thereof and a bonding section in which the same are intermittently bonded at prescribed intervals. In other words, either of the bonding sections is formed between the adjacent optical fiber strands.

公开(公告)号：US20180138657A1

公开(公告)日：2018-05-17

申请号：US15867833

申请日：2018-01-11

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masakazu MIURA ,  Jun MIYOKAWA ,  Kazuki YAMAOKA ,  Toshio KIMURA

IPC: H01S5/022 ,  H01S5/024 ,  G02B6/32 ,  G02B6/42

Abstract: A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon either directly or indirectly; and a housing which houses the base and fixes the base either directly or indirectly. Among faces of the base, a face on a side that is fixed either directly or indirectly to the housing includes a junction plane that is joined to the housing either directly or indirectly, and a detachment plane that is detached to remain unfixed from the housing.

公开(公告)号：US20180133649A1

公开(公告)日：2018-05-17

申请号：US15870426

申请日：2018-01-12

Applicant: Furukawa Electric Co., Ltd.

Inventor： Yoshikazu Tsuzuki ,  Kenji Iizuka ,  Mariko Wakae ,  Kazuhiko Kurusu

IPC: B01D53/94 ,  B01J23/72 ,  B01J23/89 ,  B01J35/02 ,  B82Y30/00

Abstract: A catalyst includes: a base material; and a nanocrystalline metal oxide composite having a plurality of accumulated flake-like nanocrystalline pieces in a connected state on the surface of the base material, the flake-like nanocrystalline pieces containing a metal oxide to accumulate, wherein the nanocrystalline metal oxide composite is configured such that an end surface of at least one of the nanocrystalline pieces is connected; the nanocrystalline pieces include a plurality of stacked surfaces stacked in a direction in which a main surface becomes an uppermost stacked surface; and when metal atoms or oxygen atoms forming the metal oxide are regarded as main constituent atoms, a proportion by number of the main constituent atoms to the metal atoms and the oxygen atoms forming the metal oxide existing on each stacked surface is 80% or more, and the main constituent atoms have a specific crystal orientation which changes in each stack.

公开(公告)号：US20180123311A1

公开(公告)日：2018-05-03

申请号：US15810707

申请日：2017-11-13

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Haruki OGOSHI ,  Masahito MORIMOTO

IPC: H01S3/094 ,  H01S3/30 ,  H01S3/0915 ,  H01S3/23

CPC classification number: H01S3/094046 ,  H01S3/06754 ,  H01S3/0915 ,  H01S3/0933 ,  H01S3/094003 ,  H01S3/094011 ,  H01S3/094038 ,  H01S3/094096 ,  H01S3/09415 ,  H01S3/2316 ,  H01S3/302 ,  H01S2301/02

Abstract: A light source for Raman amplification to Raman-amplify signal light includes: plural incoherent light sources that output incoherent light; plural pumping light sources that output second-order pumping light; an optical fiber for Raman amplification to Raman-amplify the incoherent light with the second-order pumping light, and outputs the amplified incoherent light; and an output unit connected to the optical transmission fiber, receiving the amplified incoherent light, and outputting the amplified incoherent light as first-order pumping light having a wavelength that Raman-amplifies the signal light to the optical transmission fiber.

公开(公告)号：US09958626B2

公开(公告)日：2018-05-01

申请号：US15513902

申请日：2015-09-24

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Kunio Kokura

IPC: G02B6/44 ,  G02B6/02 ,  G01M11/00 ,  G01J1/42

CPC classification number: G02B6/4404 ,  G01J1/42 ,  G01M11/30 ,  G01M11/35 ,  G02B6/02 ,  G02B6/02042 ,  G02B6/44 ,  G02B6/4457 ,  G02B6/4478 ,  G02B6/448

Abstract: Multi-core fibers are optical fibers each of which has a circular cross section. In each of the multi-core fibers, a plurality of cores are arranged at a prescribed interval, the peripheries thereof are covered by a cladding, and a resin coating is formed on the outer periphery of the cladding. In a cross section of this optical fiber ribbon, said cross section being orthogonal to the length direction, the multi-core fibers are arranged such that the cores of all of the multi-core fibers are all arranged in the same direction. The multi-core fibers are arranged such that central lines of the respective multi-core fibers, said central lines respectively linking three of the cores, all face the thickness direction of the optical fiber ribbon. Furthermore, in the optical fiber ribbon, the arrangement of the cores is substantially constant along the entire length of the optical fiber ribbon in the length direction.

公开(公告)号：US09942995B2

公开(公告)日：2018-04-10

申请号：US14555974

申请日：2014-11-28

Applicant: FURUKAWA ELECTRIC CO., LTD. ,  FURUKAWA AUTOMOTIVE SYSTEMS INC.

Inventor： Tomotsugu Shiratori ,  Shinichi Jingama

IPC: H01K3/10 ,  H05K3/44 ,  H05K1/05 ,  H05K3/00

CPC classification number: H05K3/445 ,  H05K1/05 ,  H05K1/056 ,  H05K3/0052 ,  H05K2201/09145 ,  Y10T29/49165

Abstract: A metal core substrate is obtained as a result of outline shaping performed on a substrate including a core plate and an insulating layer provided on each of two surfaces of the core plate. An outer circumferential edge of the metal core substrate has an insulating structural portion, which includes an end surface of the core plate that is retracted from an end surface of the outer circumferential edge of the metal core substrate and an insulating covering portion covers the end surface of the core plate. Separation portions to be filled with the resin and coupling portions which are to be removed before outline shaping are formed at outline shaping positions of the core plate. At the time of outline shaping, only the resin is present at the outline shaping positions.