公开(公告)号：US06553028B1

公开(公告)日：2003-04-22

申请号：US09302823

申请日：1999-04-30

Applicant: Cheng Tang ,  Chickayya G. Naik ,  Jonathan Davar ,  Yiqun Cai

Inventor： Cheng Tang ,  Chickayya G. Naik ,  Jonathan Davar ,  Yiqun Cai

IPC: H04L1228

CPC classification number: H04L45/02 ,  H04L45/16

Abstract: A technique implements forwarding operation shortcuts at a switch for multicast data traffic routed between subnetworks of a computer network. A first multicast frame is forwarded from the switch to a router, which peforms route processing and forwarding operations for a packet encapsulated within the frame. During execution of the operations, the router provides multicast flow and additional information concerning the routed packet to the switch in accordance with a novel multicast shortcut control protocol. The information is used by the switch to implement a novel multicast shortcut for subsequent frames received at the switch having the multicast packet flow.

Abstract translation: 一种技术在交换机上实现转发操作快捷方式，用于在计算机网络的子网之间路由的多播数据流量。 第一组播帧从交换机转发到路由器，该路由器对封装在帧内的分组进行路由处理和转发操作。 在执行操作期间，路由器根据新的组播快捷控制协议向交换机提供有关路由分组的组播流和附加信息。 交换机使用该信息为具有组播分组流的交换机接收到的后续帧实现新颖的多播快捷方式。

公开(公告)号：US09196553B2

公开(公告)日：2015-11-24

申请号：US13352346

申请日：2012-01-18

Applicant: Tsung-Jen Liao ,  Mei-Fang Peng ,  Cheng-Tang Huang

Inventor： Tsung-Jen Liao ,  Mei-Fang Peng ,  Cheng-Tang Huang

IPC: H01L23/60 ,  H01L23/13 ,  H01L23/498 ,  H01L25/10 ,  H01L21/683

CPC classification number: H01L23/13 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49827 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/16 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: A manufacturing method of semiconductor package structure includes: providing a first dielectric layer having multiple through holes; providing a second dielectric layer having multiple conductive vias and a chip-containing opening; laminating the second dielectric layer onto the first dielectric layer; disposing a chip in the chip-containing opening and adhering a rear surface of the chip onto the first dielectric layer exposed by the chip-containing opening; forming a redistribution circuit layer on the second dielectric layer wherein a part of the redistribution circuit layer extends from the second dielectric layer onto an active surface of the chip and the conductive vias so that the chip electrically connects the conductive vias through the partial redistribution circuit layer; forming multiple solder balls on the first dielectric layer wherein the solder balls are in the through holes and electrically connect the chip through the conductive vias and the redistribution circuit layer.

Abstract translation: 半导体封装结构的制造方法包括：提供具有多个通孔的第一电介质层; 提供具有多个导电通孔和含芯片的开口的第二电介质层; 将第二电介质层层压到第一介电层上; 将芯片设置在含芯片的开口中并将芯片的后表面粘附到由含芯片的开口暴露的第一介质层上; 在所述第二电介质层上形成再分布电路层，其中所述再分布电路层的一部分从所述第二电介质层延伸到所述芯片的有源表面和所述导电通孔，使得所述芯片将所述导电通孔电连接到所述部分再分布电路层 ; 在第一介电层上形成多个焊球，其中焊球位于通孔中，并通过导电通孔和再分布电路层将芯片电连接。

公开(公告)号：US08416968B2

公开(公告)日：2013-04-09

申请号：US12548968

申请日：2009-08-27

Applicant: Chung-Hang Tsai ,  Wei-Cheng Tang

Inventor： Chung-Hang Tsai ,  Wei-Cheng Tang

IPC: H03F99/00

CPC classification number: H03F1/305 ,  H03F3/72 ,  H03F2200/03 ,  H03F2203/7206

Abstract: An audio device and an audio input/output method are described, which is coupled to an audio port, and includes a capacitor, a load, an output amplifying module, and an input amplifying module. The capacitor and the load are coupled to the audio port. The output amplifying module is operated at a first working voltage, for outputting a first audio signal to the audio port. A direct current (DC) level of the first audio signal is substantially zero volts. The input amplifying module is operated at a second working voltage, in order to receive a second audio signal from the audio port. When the audio port is in an output state, the output amplifying module is enabled and the input amplifying module is disabled, and when the audio port is in an input state, the input amplifying module is enabled and the output amplifying module is disabled.

Abstract translation: 描述了音频设备和音频输入/输出方法，其耦合到音频端口，并且包括电容器，负载，输出放大模块和输入放大模块。 电容器和负载耦合到音频端口。 输出放大模块以第一工作电压工作，用于将第一音频信号输出到音频端口。 第一音频信号的直流（DC）电平基本为零伏特。 输入放大模块以第二工作电压工作，以便从音频端口接收第二音频信号。 当音频端口处于输出状态时，输出放大模块使能，输入放大模块被禁止，当音频端口处于输入状态时，输入放大模块使能，输出放大模块被禁止。

公开(公告)号：US20120123020A1

公开(公告)日：2012-05-17

申请号：US13256243

申请日：2010-02-27

Applicant: Helmut Meyer ,  Zhong Zhang ,  Hui Zhang ,  Long-Cheng Tang ,  Ke Peng ,  Lu-Qi Liu ,  Hongchao Li ,  Stefan Bahnmüller ,  Julia Hitzbleck

Inventor： Helmut Meyer ,  Zhong Zhang ,  Hui Zhang ,  Long-Cheng Tang ,  Ke Peng ,  Lu-Qi Liu ,  Hongchao Li ,  Stefan Bahnmüller ,  Julia Hitzbleck

IPC: C08K9/02 ,  C08J3/22 ,  C08L63/00 ,  B82Y30/00

CPC classification number: C08L63/00 ,  C08K3/041 ,  C08K7/22 ,  C09D163/00 ,  C08L2666/04

Abstract: The present invention deals with a methodology of incorporating carbon nanotubes (CNTs) into an epoxy matrix and thereby producing epoxy-based CNT nanocomposites. Both the pristine and ozonized CNTs are almost homogeneously dispersed into the resin by this approach. Compared with the pristine CNTs (p-MWCNTs), the ozonized ones (f-MWCNTs) offer considerable improvements on mechanical properties within the epoxy resin.

Abstract translation: 本发明涉及将碳纳米管（CNT）引入到环氧基质中并由此制备环氧基CNT纳米复合材料的方法。 通过这种方法，原始和臭氧化的CNT几乎均匀地分散到树脂中。 与原始CNT（p-MWCNTs）相比，臭氧化（f-MWCNT）对环氧树脂中的机械性能有很大的改进。

公开(公告)号：US07969003B2

公开(公告)日：2011-06-28

申请号：US11836146

申请日：2007-08-09

Applicant: Cheng-Tang Huang

Inventor： Cheng-Tang Huang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/10126 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1191 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/05552

Abstract: A manufacturing method of a bump structure having a reinforcement member is disclosed. First, a substrate including pads and a passivation layer is provided. The passivation layer has first openings, and each first opening exposes a portion of the corresponding pad respectively. Next, an under ball metal (UBM) material layer is formed on the substrate to cover the passivation layer and the pads exposed by the passivation layer. Bumps are formed on the UBM material layer and the lower surface of each bump is smaller than that of the opening. Each reinforcement member formed on the UBM material layer around each bump contacts with each bump, and the material of the reinforcement member is a polymer. The UBM material layer is patterned to form UBM layers and the lower surface of each UBM layer is larger than that of each corresponding opening. Hence, the bump has a planar upper surface.

Abstract translation: 公开了一种具有加强件的凸块结构的制造方法。 首先，提供包括焊盘和钝化层的衬底。 钝化层具有第一开口，并且每个第一开口分别暴露相应衬垫的一部分。 接下来，在衬底上形成底部球金属（UBM）材料层以覆盖钝化层和由钝化层暴露的焊盘。 在UBM材料层上形成凸起，并且每个凸起的下表面小于开口的下表面。 形成在每个凸块周围的UBM材料层上的每个加强构件与每个凸块接触，并且加强构件的材料是聚合物。 将UBM材料层图案化以形成UBM层，并且每个UBM层的下表面大于每个相应开口的下表面。 因此，凸块具有平坦的上表面。

公开(公告)号：US07876770B1

公开(公告)日：2011-01-25

申请号：US12156080

申请日：2008-05-29

Applicant: Hsiao-Cheng Tang ,  Yungping Hsu ,  Guorong Hu ,  Weishi Feng

Inventor： Hsiao-Cheng Tang ,  Yungping Hsu ,  Guorong Hu ,  Weishi Feng

IPC: H04L12/413

CPC classification number: H04B17/00 ,  H04B1/707 ,  H04W24/00 ,  H04W74/08

Abstract: Techniques for and apparatus capable of implementing packet detection and signal recognition in wireless communications systems are disclosed. In particular, the disclosed techniques and apparatus incorporate at least one of relative energy detection operable on assessment of a relative energy threshold for an inbound signal borne across an RF channel, carrier sense operable upon on assessment of at least one of a peak-to-sidelobe ratio and peak-to-peak distance defined by the inbound signal, and comparison operable upon demodulated data corresponding to the inbound signal as compared to predetermined preamble data. Clear channel assessment is performed based on determinations undertaken by one or more of the aforementioned relative energy detection, carrier sense and comparison operations.

Abstract translation: 公开了能够在无线通信系统中实现分组检测和信号识别的技术和装置。 具体地，所公开的技术和装置包括相对能量检测中的至少一个，其可操作用于对横跨RF信道承载的入站信号的相对能量阈值的评估，所述载波检测可在通过评估峰 - 旁瓣比和由峰值到峰值的距离，并且与对应于入站信号的解调数据进行比较，与预定的前导码数据相比较。 基于由上述相对能量检测，载波检测和比较操作中的一个或多个进行的确定来执行清除信道评估。

公开(公告)号：US07660480B1

公开(公告)日：2010-02-09

申请号：US11351794

申请日：2006-02-10

Applicant: Cheng-Tang Wu ,  Hongsheng Lu

Inventor： Cheng-Tang Wu ,  Hongsheng Lu

IPC: G06K9/40 ,  G06F7/60 ,  G06F17/10 ,  G06F9/45 ,  G06F9/455 ,  G06T15/00 ,  G06T17/00 ,  G06T15/30 ,  G06T17/20

CPC classification number: G06T17/20

Abstract: A two-level transformation scheme to enable a practical fast mesh-free method is disclosed. The first level transformation transforms the original chosen mesh-free shape function to a first transformed mesh-free shape function that preserves Kronecker delta properties. The first transformed mesh-free function allows the essential boundary conditions to be imposed directly. The second-level transformation scheme employs a low pass filter function served as a regularization process that filters out the higher-order terms in the monomial mesh-free approximation obtained from the first-level transformation scheme with desired consistency and completeness conditions. This integration scheme requires only a low-order integration rule comparing to the high order integration rule used in the traditional mesh-free methods. The present invention simplifies the boundary condition treatments and avoids the usage of high-order integration rule and therefore is more practical than the traditional mesh-free methods.

Abstract translation: 公开了一种实现快速无网格实用的方法的两级转换方案。 第一级变换将原始选择的无网格形状函数转换为保留Kronecker delta属性的第一个无变换网格形状函数。 第一个无网格变换功能允许直接施加基本边界条件。 第二级转换方案采用低通滤波器函数作为正则化过程，其过滤出从具有期望的一致性和完整性条件的第一级变换方案获得的单项无网格近似中的高阶项。 与传统的无网格方法中使用的高阶整合规则相比，该集成方案只需要一个低阶积分规则。 本发明简化了边界条件处理，避免了高阶整合规则的使用，因此比传统的无网格方法更为实用。

公开(公告)号：US20090180345A1

公开(公告)日：2009-07-16

申请号：US12014454

申请日：2008-01-15

Applicant: Chin-Ghee Ch'ng ,  Kuan-Cheng Tang

Inventor： Chin-Ghee Ch'ng ,  Kuan-Cheng Tang

IPC: G11C5/14

CPC classification number: G11C8/08 ,  G11C16/08 ,  G11C16/30

Abstract: Systems and methods for improving efficiency of a voltage booster for read mode operations of memory cells and discharging a boosted supply voltage safely are disclosed. The system contains a plurality of boosting stages coupled in series including a plurality of boosting capacitors, a plurality of isolators. The isolator can be used to prevent boosting of one capacitor from negatively affecting a charge of the other adjacent capacitor to improve the efficiency of the voltage booster. A voltage booster circuit can accurately boost a supply voltage with a suitable number of boosting stages depending on a level of the supply voltage being provided. Since boosters contain a suitable number of boosting stages, the boosters can discharge a boosted voltage sequentially. With this sequential discharge method, memory cells can not have a hot switching problem.

Abstract translation: 公开了用于提高存储器单元的读取模式操作的升压器的效率并且安全地放电升压的电压的系统和方法。 该系统包括串联耦合的多个升压级，包括多个升压电容器，多个隔离器。 隔离器可用于防止一个电容器的升压对其他相邻电容器的电荷产生负面影响，以提高升压器的效率。 升压电路可以根据所提供的电源电平的水平，以适当数量的升压级来精确地提高电源电压。 由于增压器包含适当数量的升压级，所以增压器可以依次放电升压。 利用这种顺序放电方法，存储器单元不能具有热切换问题。

公开(公告)号：US07557120B2

公开(公告)日：2009-07-07

申请号：US10543794

申请日：2004-02-23

Applicant: Stephen D. Goble ,  Alexander Pasternak ,  Cheng Tang ,  Changyou Zhou ,  Lihu Yang

Inventor： Stephen D. Goble ,  Alexander Pasternak ,  Cheng Tang ,  Changyou Zhou ,  Lihu Yang

IPC: A61K31/437 ,  C07D471/02 ,  C07D471/14

CPC classification number: C07D471/06 ,  C07D487/06 ,  C07D513/06

Abstract: The present invention is directed to compounds of formulae (I and II)(wherein A, D, E, X, l, m, n and R1 through R18 are defined herein) which are useful as modulators of chemokine receptor activity. In particular, these compounds are useful as modulators of the chemokine receptor CCR-2.

Abstract translation: 本发明涉及可用作趋化因子受体活性调节剂的式（I和II）（其中A，D，E，X，l，m，n和R 1至R 18如本文所定义）的化合物。 特别地，这些化合物可用作趋化因子受体CCR-2的调节剂。

公开(公告)号：US20080265736A1

公开(公告)日：2008-10-30

申请号：US11739101

申请日：2007-04-24

Applicant: Cheng-Tang Chen

Inventor： Cheng-Tang Chen

IPC: H01J7/24

CPC classification number: F21V17/06 ,  F21K9/00 ,  F21V3/02 ,  F21V3/04 ,  F21V5/041 ,  F21V19/0055 ,  F21V29/89 ,  F21Y2115/10

Abstract: A LED reflective spherical lamp is disclosed. The spherical lamp comprises a transparent spherical lamp hood, a leading LED beam assembly, a linkage of the leading LED beam assembly, a heat dissipation block having good thermal conductivity and a securing base, characterized in that the leading LED beam assembly comprises a threaded connection tube, a converging lense and a conductive base board for mounting LED, and the threaded connection tube screws to a screw hole at the bottom of the transparent spherical lamp hood and the threaded connection tube extends into a tube opening of the lamp hood, overlappingly connecting the converging lense, the other end of the threaded tube is a peg tube wall for peggingly connection of a corresponding recess of the conductive base board such that the LED on the conductive base board face the converging lense, and the other end of the conductive base board mounting the LED is connected to the heat dissipation block, and then is secured with the securing base, thereby when LED is lighted, LED beams pass through the transparent lense into the lamp hood such that the entire lamp hood is lighted.

Abstract translation: 公开了一种LED反射球形灯。 球形灯包括透明球形灯罩，LED LED组件，LED LED组件的连杆，具有良好导热性的散热块和固定底座，其特征在于，LED灯组件包括螺纹连接 管，会聚透镜和用于安装LED的导电基板，并且螺纹连接管螺钉到透明球形灯罩底部的螺孔，螺纹连接管延伸到灯罩的管开口中，重叠连接 会聚透镜，螺纹管的另一端是用于将导电基板的相应凹部彼此连接的栓管壁，使得导电基板上的LED面向会聚透镜，导电基底的另一端 板安装LED连接到散热块，然后用固定底座固定，因此当LED点亮时，LED b 电子束通过透明透镜进入灯罩，使整个灯罩点亮。