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21.发明申请HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME 有权无卤素树脂组合物，使用它的铜层压板和使用其的印刷电路板公开(公告)号：US20140178656A1
公开(公告)日：2014-06-26
申请号：US13827911
申请日：2013-03-14
发明人： CHANG-YUAN LI , YI-JEN CHEN , HONG-XIA PENG
CPC分类号： C08L63/00 , C08G59/302 , C08G59/4064 , C08G59/621 , C08L35/00 , C09D163/00 , H05K1/0353 , Y10T428/24917 , Y10T428/31529 , C08L35/06
摘要： A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.
摘要翻译： 无卤树脂组合物包含（A）100重量份环氧树脂; （B）10〜100重量份苯乙烯 - 马来酸酐（SMA）共聚物; 和（C）5〜50重量份的双酚S.无卤素树脂组合物包含特定成分，其特征在于其特定比例，从而实现高玻璃化转变温度，高耐热性和有吸引力的外观，以及 因此适用于制备预浸料或树脂膜，从而可应用于覆铜层压板和印刷电路板。
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公开(公告)号：US11820894B2
公开(公告)日：2023-11-21
申请号：US17523184
申请日：2021-11-10
发明人： Teng Xu , Zhilong Hu , Xiangnan Li , Shuwen Liu , Cheng Li
IPC分类号： C08L79/08 , C08L83/04 , C08K3/36 , B32B27/28 , C09D179/08 , H05K1/03 , B32B15/20 , B32B5/02 , B32B15/14 , B32B5/26 , C08J5/24
CPC分类号： C08L79/085 , B32B5/024 , B32B5/263 , B32B15/14 , B32B15/20 , C08J5/244 , C09D179/085 , H05K1/036 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/206 , B32B2457/08 , C08J2379/08 , C08J2483/04 , C08L2203/16 , C08L2203/20
摘要： A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.
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公开(公告)号：US11649340B1
公开(公告)日：2023-05-16
申请号：US17539541
申请日：2021-12-01
发明人： Zhilong Hu , Changyuan Li , Hongxia Peng , Lianhui Cai , Jianzhao Li
CPC分类号： C08K5/541 , C07F7/0812 , C07F9/5325 , C08K5/5406 , C08K5/5425 , C08L71/12 , C08L71/126 , C08L79/08 , C08L71/12 , C08K3/36 , C08K5/5406 , C08L79/085
摘要： A phosphorus-containing silane compound has a structure of SiR1(R2)n(R3)3-n, wherein R1 is a phenyl group, R2 is a vinyl group, R3 each independently is a structure of Formula (I) or Formula (II), and n is 1 or 2. Moreover, a method of making the phosphorus-containing silane compound, a resin composition including the phosphorus-containing silane compound and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including Z-axis ratio of thermal expansion, copper foil peeling strength, inner resin flow, branch-like pattern, dielectric constant, dissipation factor and flame retardancy may be improved.
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公开(公告)号：US20230099943A1
公开(公告)日：2023-03-30
申请号：US17523184
申请日：2021-11-10
发明人： Teng XU , Zhilong HU , Xiangnan LI , Shuwen LIU , Cheng LI
摘要： A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.
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公开(公告)号：US20220204746A1
公开(公告)日：2022-06-30
申请号：US17205653
申请日：2021-03-18
发明人： Yaoqiang MING , Zhilong HU
摘要： A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 μm; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, ratio of thermal expansion, copper foil peeling strength, thermal resistance after moisture absorption, dissipation factor, amount of resin cluster and appearance of cooper-free circuit board.
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公开(公告)号：US11066552B2
公开(公告)日：2021-07-20
申请号：US16699159
申请日：2019-11-29
发明人： Zhilong Hu , Xiang Xiong , Yaoqiang Ming
IPC分类号： C08L71/12 , C08K5/54 , C08K3/013 , C08J5/24 , C08F283/08 , C08G65/336 , C08F283/00 , C08G65/48 , C08L55/02 , C08L25/10
摘要： A resin composition includes a vinyl-containing polyphenylene ether resin and a multifunctional vinylsilane. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board and achieve improvement in at least one of the properties including prepreg or laminate surface appearance, glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance after moisture absorption, thermal resistance, dielectric constant, dissipation factor and inner resin flow.
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27.发明申请公开(公告)号：US20200095504A1
公开(公告)日：2020-03-26
申请号：US16194962
申请日：2018-11-19
发明人： Zhilong HU , Teng XU
摘要： Disclosed is a compound useful in a resin composition for fabricating articles such as a prepreg, a resin film, a laminate or a printed circuit board, such that the articles have improved one or more properties including glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance, dielectric constant, dissipation factor and flame retardancy.
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公开(公告)号：US10577497B2
公开(公告)日：2020-03-03
申请号：US16196472
申请日：2018-11-20
发明人： Zhilong Hu , Hezong Zhang
摘要： A resin composition comprises 100 parts by weight of epoxy resin; 2 to 50 parts by weight of carboxyl-containing butadiene acrylonitrile resin; 1 to 40 parts by weight of phosphazene; and 1 to 8 parts by weight of acrylic triblock copolymer. The resin composition may be made into various articles, such as prepregs, laminates, printed circuit boards or rigid-flex boards, and meets one, more or all of the following properties: high yield rate in solder pad fall-off test at high temperature, low dust weight loss, low stickiness, high thermal resistance, high peel strength to copper foil, and high bonding strength to polyimide layer.
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公开(公告)号：US20190085150A1
公开(公告)日：2019-03-21
申请号：US15832083
申请日：2017-12-05
发明人： Zhilong HU , Licheng LIN
IPC分类号： C08K5/00 , C08K5/5313 , C08K5/5357 , C07F9/40 , C07F9/30
摘要： Disclosed is a phosphorus-containing compound capable of serving as a flame retardant to be used in conjunction with other ingredients to make resin compositions, useful for fabricating such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including glass transition temperature, coefficient of thermal expansion, thermal resistance, flame retardancy, dielectric constant, and dissipation factor. In addition, a method of preparing the phosphorus-containing compound and a resin composition comprising the phosphorus-containing compound are also disclosed.
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公开(公告)号：US20180324956A1
公开(公告)日：2018-11-08
申请号：US15690946
申请日：2017-08-30
发明人： Xiang XIONG , Zhilong HU
CPC分类号： H05K3/389 , B32B15/092 , B32B15/20 , B32B2307/206 , B32B2457/08 , C08G73/0233 , C08J5/24 , C08J2363/00 , C08J2463/00 , C08J2479/04 , C08L63/00 , C08L2205/02 , C08L2205/03 , H05K1/0373 , H05K1/09 , H05K3/007 , H05K2201/012 , H05K2201/0355
摘要： Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 μm, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.
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